Abstract
A novel structure of a silicon carbide (SiC) double-trench metal oxide semiconductor field-effect transistor (DTMOSFET) is proposed using a hafnium silicate (HfSiOx ) dielectric combined with PN pillars. Moreover, it has been characterized using Atlas TCAD Silvaco 2D simulations, and offers a very high breakdown voltage of 4879 V, which is due to the PN pillars under the N-drift layer altering the electric field distribution and HfSiOx dielectric that diminishes the impact ionization. The proposed DTMOSFET achieves a transconductance (gm) and drain current (ID) of 7 mA/mm and 780 µS/mm, respectively. In addition, the simulated results show the cut-off frequency, fT = 1.28 GHz, and maximum frequency, fmax = 10.5 GHz. In addition, the peak electric field observed near the gate edge is 0.93 MV/cm. Moreover, the proposed DTPNH-MOSFET shows 11% improvement in breakdown voltage when compared to the breakdown voltage of conventional DTMOSFET. Therefore, the DTPNH-MOSFET shows a superior performance over other SiC MOSFETs and is a suitable device for future high-power electronics.
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The authors acknowledge the Centre for Research in Semiconductor Devices, Department of Electronics and Communication Engineering, Karunya Institute of Technology and Sciences, Coimbatore, India for providing all facilities to carry out this research work.
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ASA Fletcher-TCAD Simulation and paper writing. AF TCAD Simulation PM Paper editing and English correction. JA Idea and concept. DN Idea and concept.
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Fletcher, A.S.A., Franklin, S.A., Murugapandiyan, P. et al. 4.87 kV SiC MOSFET Using HfSiOx/SiO2 Gate Dielectrics Combined with PN Pillars. J. Electron. Mater. 53, 2601–2608 (2024). https://doi.org/10.1007/s11664-024-11014-y
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DOI: https://doi.org/10.1007/s11664-024-11014-y