Abstract
A numerical simulation-based high-performance metal–insulator–semiconductor high electron mobility transistors (MISHEMTs) on an ultra-wide band gap β-Ga2O3 (Eg ~ 4.8 eV) substrate is presented. β-Ga2O3 (beta gallium oxide) has gained significant attention in radio frequency (RF) and power electronics applications. GaN HEMTs on β-Ga2O3 substrates are emerging HEMT technology for future RF and power electronics. Enhancement mode AlGaN/GaN MISHEMTs on β-Ga2O3 are proposed and analyzed for their DC and RF performance for Lg = 0.8 µm using ATLAS TCAD. A MISHEMT based on a SiN (Al2O3) insulator exhibited a high drain current density (IDS) of 3.62 (3.7) A/mm, blocking voltage (VBR) of 898 (1505) V, transconductance (gm) of 1.09 (1.13) S/mm, and cut-off frequency (fT) of 49 (44) GHz. Moreover, the proposed MISHEMT exhibited a very low on-resistance of 5 Ω mm. Combined with a higher cut-off frequency and high breakdown voltage, the proposed MISHEMT is suitable for future power switching and RF applications.
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A. Udabe, I. Baraia-Etxaburu, and D.G. Diez, Gallium nitride power devices: a state of the art review. IEEE Access (2023). https://doi.org/10.1109/ACCESS.2023.3277200.
N. Keshmiri, D. Wang, B. Agrawal, R. Hou, and A. Emadi, Current status and future trends of GaN HEMTs in electrified transportation. IEEE Access (2020). https://doi.org/10.1109/ACCESS.2020.2986972.
L.H. Hsu, Y.Y. Lai, P.T. Tu, C. Langpoklakpam, Y.T. Chang, Y.W. Huang, W.C. Lee, A.J. Tzou, Y.J. Cheng, C.H. Lin, and H.C. Kuo, Development of GaN HEMTs fabricated on silicon, silicon-on-insulator, and engineered substrates and the heterogeneous integration. Micromachines (2021). https://doi.org/10.3390/mi12101159.
K. Hoo Teo, Y. Zhang, N. Chowdhury, S. Rakheja, R. Ma, Q. Xie, E. Yagyu, K. Yamanaka, K. Li, and T. Palacios, Emerging GaN technologies for power, RF, digital, and quantum computing applications: recent advances and prospects. J. Appl. Phys. (2021). https://doi.org/10.1063/5.0061555.
M. Meneghini, C. De Santi, I. Abid, M. Buffolo, M. Cioni, R.A. Khadar, L. Nela, N. Zagni, A. Chini, F. Medjdoub, and G. Meneghesso, GaN-based power devices: physics, reliability, and perspectives. J. Appl. Phys. (2021). https://doi.org/10.1063/5.0061354.
Y. Zhou, Y. Zhong, H. Gao, S. Dai, J. He, M. Feng, Y. Zhao, Q. Sun, A. Dingsun, and H. Yang, p-GaN gate enhancement-mode HEMT through a high tolerance self-terminated etching process. IEEE J. Electron Devices Soc. (2017). https://doi.org/10.1109/JEDS.2017.2725320.
N. Islam, M.F. Mohamed, M.F. Khan, S. Falina, H. Kawarada, and M. Syamsul, Reliability, applications and challenges of GaN HEMT technology for modern power devices: a review. Crystals (2022). https://doi.org/10.3390/cryst12111581.
C.T. Ma and Z.H. Gu, Review of GaN HEMT applications in power converters over 500 W. Electronics (2019). https://doi.org/10.3390/electronics8121401.
W. Yi-Feng, D. Kapolnek, J.P. Ibbetson, P. Parikh, B.P. Keller, and U.K. Mishra, Very-high power density AlGaN/GaN HEMTs. IEEE Trans. Electron Devices (2001). https://doi.org/10.1109/16.906455.
C. Du, R. Ye, X. Cai, X. Duan, H. Liu, Y. Zhang, G. Qiu, and M. Mi, A review on GaN HEMTs: nonlinear mechanisms and improvement methods. J. Semicond. (2023). https://doi.org/10.1088/1674-4926/44/12/121801.
S. Baskaran, M. Shunmugathammal, C. Sivamani, S. Ravi, P. Murugapandiyan, and N. Ramkumar, UWBG AlN/β-Ga2O3 HEMT on silicon carbide substrate for low loss portable power converters and RF applications. SILICON (2022). https://doi.org/10.1007/s12633-022-01846-w.
P. Murugapandiyan, S.R. Kalva, V. Rajyalakshmi, B.A. Princy, Y.U. Tarauni, A. Fletcher, and M. Wasim, A, comparative analysis of GaN and InGaN/GaN coupling channel HEMTs on silicon carbide substrate for high linear RF applications. Micro Nanostruct. (2023). https://doi.org/10.1016/j.micrna.2023.207545.
A. Revathy, J. Vijaya Kumar, P. Murugapandiyan, K. Mohd Wasim, N. Devi, and N. Ramkumar, Design and analysis of normally-off GaN-HEMT using β-Ga2O3 buffer for low-loss power converter applications. Micro Nanostruct. (2023). https://doi.org/10.1016/j.micrna.2023.207643.
N. Ramkumar, E. Parthasarathy, and P. Murugapandiyan, Influence of high-k passivation layer on gate field plate AlGaN/GaN/AlGaN double heterojunction HEMT. SILICON (2022). https://doi.org/10.1007/s12633-022-01746-z.
N. Ramkumar, E. Parthasarathy, and P. Murugapandiyan, Ultra-wide band gap Al0.1Ga0.9N double channel HEMT for RF applications. Int. J. RF Microw. Comput. Aided Eng. (2022). https://doi.org/10.1002/mmce.23360.
G. Crupi, M. Latino, G. Gugliandolo, Z. Marinković, J. Cai, G. Bosi, A. Raffo, E. Fazio, and N. Donato, A comprehensive overview of the temperature-dependent modeling of the high-power GaN HEMT technology using mm-wave scattering parameter measurements. Electronics (2023). https://doi.org/10.3390/electronics12081771.
L. Shen, R. Coffie, D. Buttari, S. Heikman, A. Chakraborty, A. Chini, S. Keller, S.P. DenBaars, and U.K. Mishra, High-power polarization-engineered GaN/AlGaN/GaN HEMTs without surface passivation. IEEE Electron Device (2004). https://doi.org/10.1109/LED.2003.821673.
S. Huang, Q. Jiang, S. Yang, Z. Tang, and K.J. Chen, Mechanism of PEALD-grown AlN passivation for AlGaN/GaN HEMTs: compensation of interface traps by polarization charges. IEEE Electron Device Lett. (2013). https://doi.org/10.1109/LED.2012.2229106.
B.K. Jebalin, A.S. Rekh, P. Prajoon, D. Godwinraj, N.M. Kumar, and D. Nirmal, Unique model of polarization engineered AlGaN/GaN based HEMTs for high power applications. Superlattices Microstruct. (2015). https://doi.org/10.1016/j.spmi.2014.10.038.
C. De Santi, M. Meneghini, G. Meneghesso, and E. Zanoni, Review of dynamic effects and reliability of depletion and enhancement GaN HEMTs for power switching applications. IET Power Electron. (2018). https://doi.org/10.1049/iet-pel.2017.0403.
R. Brown, D. Macfarlane, A. Al-Khalidi, X. Li, G. Ternent, H. Zhou, I. Thayne, and E. Wasige, A sub-critical barrier thickness normally-off AlGaN/GaN MOS-HEMT. IEEE Electron Device Lett. (2014). https://doi.org/10.1109/LED.2014.2334394.
C. Beckmann, Z. Yang, J. Wieben, T. Zweipfennig, J. Ehrler, A. Kirchbrücher, H. Kalisch, and A. Vescan, Depletion-and enhancement-mode p-channel MISHFET based on GaN/AlGaN single heterostructures on sapphire substrates. IEEE J. Electron Devices Soc. (2023). https://doi.org/10.1109/JEDS.2023.3268205.
Y.H. Chen, D. Ohori, M. Aslam, Y.J. Lee, Y. Li, and S. Samukawa, Enhancing the performance of E-mode AlGaN/GaN HEMTs with recessed gates through low-damage neutral beam etching and post-metallization annealing. IEEE Open J. Nanotechnol. (2023). https://doi.org/10.1109/OJNANO.2023.3306011.
H. Lee, H. Ryu, J. Kang, and W. Zhu, High temperature operation of E-mode and D-mode AlGaN/GaN MIS-HEMTs with recessed gates. IEEE J. Electron Devices Soc. (2023). https://doi.org/10.1109/JEDS.2023.3253137.
C.H. Wu, P.C. Han, Q.H. Luc, C.Y. Hsu, T.E. Hsieh, H.C. Wang, Y.K. Lin, P.C. Chang, Y.C. Lin, and E.Y. Chang, Normally-off GaN MIS-HEMT with F−doped gate insulator using standard ion implantation. IEEE J. Electron Devices Soc. (2018). https://doi.org/10.1109/JEDS.2018.2859769.
J.S. Wu, C.C. Lee, C.H. Wu, M.L. Kao, Y.C. Weng, C.Y. Yang, Q.H. Luc, C.T. Lee, D. Ueda, and E.Y. Chang, E-mode GaN MIS-HEMT using ferroelectric charge trap gate stack with low dynamic on-resistance and high V th stability by field plate engineering. IEEE Electron Device Lett. (2021). https://doi.org/10.1109/LED.2021.3098726.
Y. Wang, Y. Lv, X. Zhou, J. Yin, T. Han, G. Gu, X. Song, X. Tan, S. Dun, H. Guo, and Y. Fang, High-uniformity and high drain current density enhancement-mode AlGaN/GaN gates-seperating groove HFET. IEEE J. Electron Devices Soc. (2017). https://doi.org/10.1109/JEDS.2017.2778087.
Y.C. Lin, Y.X. Huang, G.N. Huang, C.H. Wu, J.N. Yao, C.M. Chu, S. Chang, C.C. Hsu, J.H. Lee, K. Kakushima, and K. Tsutsui, Enhancement-mode GaN MIS-HEMTs with LaHfO x gate insulator for power application. IEEE Electron Device Lett. (2017). https://doi.org/10.1109/LED.2017.2722002.
S.Y. Ho, C.H. Lee, A.J. Tzou, H.C. Kuo, Y.R. Wu, and J. Huang, Suppression of current collapse in enhancement mode GaN-based HEMTs using an AlGaN/GaN/AlGaN double heterostructure. IEEE Trans. Electron Devices (2017). https://doi.org/10.1109/TED.2017.2657683.
R. Singh, T.R. Lenka, R.T. Velpula, B. Jain, H.Q. Bui, and H.P. Nguyen, A novel β‐Ga2O3 HEMT with f T of 166 GHz and X‐band P OUT of 2.91 W/mm. Int. J. Numer. Model. Electron. Netw. Devices Fields (2021). https://doi.org/10.1002/jnm.27946.
S.J. Pearton, J. Yang, P.H. Cary, F. Ren, J. Kim, M.J. Tadjer, and M.A. Mastro, A review of Ga2O3 materials, processing, and devices. Appl. Phys. Rev. (2018). https://doi.org/10.1063/1.5006941.
Y. Zhang, C. Joishi, Z. Xia, M. Brenner, S. Lodha, and S. Rajan, Demonstration of β-(AlxGa1−x)2O3/Ga2O3 double heterostructure field effect transistors. Appl. Phys. Lett. (2018). https://doi.org/10.1063/1.5037095.
M. Ge, Y. Li, Y. Zhu, D. Chen, Z. Wang, and S. Tan, An improved design for e-mode AlGaN/GaN HEMT with gate stack β-Ga2O3/p-GaN structure. J. Appl. Phys. (2021). https://doi.org/10.1063/5.0051274.
H. Xue, Q. He, G. Jian, S. Long, T. Pang, and M. Liu, An overview of the ultrawide band gap Ga2O3 semiconductor-based Schottky barrier diode for power electronics application. Nanoscale Res. Lett. (2018). https://doi.org/10.1186/s11671-018-2712-1.
X.Q. Zheng, Y. Xie, J. Lee, Z. Jia, X. Tao, and P.X. Feng, Beta gallium oxide (β-Ga2O3) nanoelectromechanical transducer for dual-modality solar-blind ultraviolet light detection. APL Mater. (2019). https://doi.org/10.1063/1.5054625.
Z. Galazka, β-Ga2O3 for wide-band gap electronics and optoelectronics. Semicond. Sci. Technol. (2018). https://doi.org/10.1088/1361-6641/aadf78.
K. Tetzner, O. Hilt, A. Popp, S.B. Anooz, and J. Würfl, Challenges to overcome breakdown limitations in lateral β-Ga2O3 MOSFET devices. Microelectron. Reliab. (2020). https://doi.org/10.1016/j.microrel.2020.113951.
A. Sarkar, Device simulation using Silvaco ATLAS tool, Technology computer aided design. (Boca Raton: CRC Press, 2018), pp. 203–252.
M. Kanamura, T. Ohki, T. Kikkawa, K. Imanishi, T. Imada, A. Yamada, and N. Hara, Enhancement-mode GaN MIS-HEMTs with n-GaN/i-AlN/n-GaN triple cap layer and high-k gate dielectrics. IEEE Electron Device Lett. (2010). https://doi.org/10.1109/LED.2009.2039026.
Q. Hu, B. Hu, C. Gu, T. Li, S. Li, S. Li, X. Li, and Y. Wu, Improved current collapse in recessed AlGaN/GaN MOS-HEMTs by interface and structure engineering. IEEE Trans. Electron Devices (2019). https://doi.org/10.1109/TED.2019.2940749.
L. Yang, M. Mi, B. Hou, J. Zhu, M. Zhang, Y. He, Y. Lu, Q. Zhu, X. Zhou, L. Lv, and Y. Cao, Improvement of subthreshold characteristic of gate-recessed AlGaN/GaN transistors by using dual-gate structure. IEEE Trans. Electron Devices (2017). https://doi.org/10.1109/TED.2017.2741001.
M. Vadizadeh, M. Fallahnejad, M. Shaveisi, R. Ejlali, and F. Bajelan, Double gate double-channel AlGaN/GaN MOS HEMT and its applications to LNA with Sub-1 dB noise figure. SILICON (2023). https://doi.org/10.1007/s12633-022-02083-x.
L.Q. Zhang, X.L. Wu, W.Q. Miao, Z.Y. Wu, Q. Xing, and P.F. Wang, Process of Au-free source/drain Ohmic contact to AlGaN/GaN HEMT. Crystals (2022). https://doi.org/10.3390/cryst12060826.
C. Sivamani, P. Murugapandiyan, A. Mohanbabu, and A. Fletcher, High performance enhancement mode GaN HEMTs using β-Ga2O3 buffer for power switching and high frequency applications: a simulation study. Microelectronics (2023). https://doi.org/10.1016/j.mejo.2023.105946.
S. Mohanty, Z. Jian, K. Khan, and E. Ahmadi, Demonstration of N-polar GaN MIS-HEMT with high-k atomic layer deposited HfO2 as gate dielectric. J. Electron. Mater. (2023). https://doi.org/10.1007/s11664-023-10222-2.
P. Pal, Y. Pratap, and S. Kabra, Small-signal analysis of double-channel AlGaN/GaN HEMT and MOSHEMT with undoped barrier for microwave applications. J. Electron. Mater. (2022). https://doi.org/10.1007/s11664-022-09652-1.
Y. Cheng, Y.H. Ng, Z. Zheng, and K.J. Chen, RF enhancement-mode-GaN gate HEMT on 200 mm-Si substrates. IEEE Electron Device Lett. (2022). https://doi.org/10.1109/LED.2022.3220693.
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The authors acknowledge the Anil Neerukonda Institute of Technology and Sciences, Visakhapatnam, India-531 162 for providing the support and facility to carry out this research work.
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Murugapandiyan, P., Sri Rama Krishna, K., Revathy, A. et al. Enhancement Mode AlGaN/GaN MISHEMT on Ultra-Wide Band Gap β-Ga2O3 Substrate for RF and Power Electronics. J. Electron. Mater. (2024). https://doi.org/10.1007/s11664-024-11005-z
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DOI: https://doi.org/10.1007/s11664-024-11005-z