Abstract
The encapsulant-dependent effects of long-term low-temperature annealing on defects in Mg-ion-implanted GaN were investigated using metal-oxide-semiconductor (MOS) diodes. Annealing was carried out at 600°C under nitrogen flow without or with a cap layer of Al2O3, SiO2, or SiN. For annealing at 600°C for 3 h, the capacitance–voltage characteristics of the Al2O3 cap annealed samples indicated the existence of acceptor-like defects, whereas those of the capless, SiO2 cap and SiN cap annealed samples exhibited bumps, which indicated the existence of a donor-like defect level at around 0.8 eV from the conduction band edge EC. A more distinct result was obtained for annealing at 600°C for 30 h. Namely, annealing of samples with the Al2O3 cap layer induced an acceptor-like defect level at EC−0.9 eV, whereas that with the SiN cap layer induced a donor-like defect level at EC−0.8 eV. Secondary ion mass spectroscopy and transmission electron microscopy studies revealed that interstitial Ga (Gai) in Mg-implanted GaN diffused into the Al2O3 cap layer but not into the SiN cap layer after annealing. Most likely, the detected EC−0.8 eV level can be assigned to interstitial Gai.
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References
T. Kachi, Recent progress of GaN power devices for automotive applications. Jpn. J. Appl. Phys. 53, 100210 (2014).
H. Amano, Y Baines, E. Beam, M. Borga, T. Bouchet, P. R Chalker, M. Charles, K. J. Chen, N. Chowdhury, R. Chu, C. De Santi, M. M. De Souza, S. Decoutere, L. Di Cioccio, B. Eckardt, T. Egawa, P. Fay, J. J. Freedsman, L. Guido, O. Häberlen, G. Haynes, T. Heckel, D. Hemakumara, P. Houston, J. Hu, M. Hua, Q. Huang, A. Huang, S. Jiang, H Kawai, D. Kinzer, M. Kuball, A. Kumar, K. B. Lee, X. Li, D. Marcon, M. März, R. McCarthy, G. Meneghesso, M. Meneghini, E. Morvan, A. Nakajima, E. M. S. Narayanan, S. Oliver, T. Palacios, D. Piedra, M. Plissonnier, R. Reddy, M. Sun, I. Thayne, A. Torres, N. Trivellin, V. Unni, M. J. Uren, M. V. Hove, D. J. Wallis, J. Wang, J. Xie, S. Yagi, S. Yang, C. Youtsey, R. Yu, E. Zanoni, S. Zeltner, Yuhao Zhang, The 2018 GaN power electronics roadmap. J. Phys. D, Appl. Phys. 51, 163001 (2018).
D. Ueda, Power GaN devices. ed. M. Meneghini, G. Meneghesso, and E. Zanoni (New York: Springer, 2017), p. 1.
B.J. Baliga, Gallium nitride devices for power electronic applications. Semicond. Sci. Technol. 28, 074011 (2013).
F. Schwierz, An electron mobility model for wurtzite GaN. Solid-State Electron. 49, 889 (2005).
P.A. Alvi, S. Gupta, M.J. Siddiqui, G. Sharma, and S. Dalela, Modeling and simulation of GaN/Al0.3Ga0.7N new multilayer nano-heterostructure. Physica B 405, 2431 (2010).
P.A. Alvi, S. Gupta, P. Vijay, G. Sharma, and M.J. Siddiqui, Affects of Al concentration on GaN/AlxGa1–xN newmodeled multilayer nano-heterostructure. Physica B 405, 3624 (2010).
S. Gupta, F. Rahman, M.J. Siddiqui, and P.A. Alvi, Strain profile in nitride based multilayer nano-heterostructures. Physica B 411, 40 (2013).
S. Ahmad, M.A. Raushan, S. Kumar, S. Dalela, M.J. Siddiqui, and P.A. Alvi, Modeling and simulation of GaN based QW LED for UV emission. Optik 158, 1334 (2018).
S. Kaneki, J. Ohira, S. Toiya, Z. Yatabe, J.T. Asubar, and T. Hashizume, Highly-stable and low-state-density Al2O3/GaN interfaces using epitaxial n-GaN layers grown on free-standing GaN substrates. Appl. Phys. Lett. 109, 162104 (2016).
T. Hashizume, S. Kaneki, T. Oyobiki, Y. Ando, S. Sasaki, and K. Nishiguchi, Effects of postmetallization annealing on interface properties of Al2O3/GaN structures. Appl. Phys. Express 11, 124102 (2018).
T. Yamada, J. Ito, R. Asahara, K. Watanabe, M. Nozaki, T. Hosoi, T. Shimura, and H. Watanabe, Improved interface properties of GaN-based metal-oxide-semiconductor devices with thin Ga-oxide interlayers. Appl. Phys. Lett. 110, 261603 (2017).
T. Yamada, D. Terashima, M. Nozaki, H. Yamada, T. Takahashi, M. Shimizu, A. Yoshigoe, T. Hosoi, T. Shimura, H. Watanabe, Controlled oxide interlayer for improving reliability of SiO2/GaN MOS devices. Jpn, J. Appl. Phys. 58, SCCD06 (2019).
B.N. Feigelson, T.J. Anderson, M. Abraham, J.A. Freitas, J.K. Hite, C.R. Eddy, and F.J. Kub, Multicycle rapid thermal annealing technique and its application for the electrical activation of Mg implanted in GaN. J. Cryst. Growth 350, 21 (2012).
T.J. Anderson, B.N. Feigelson, F.J. Kub, M.J. Tadjer, K.D. Hobart, M.A. Mastro, J.K. Hite, and C.R. Eddy, Activation of Mg implanted in GaN by multicycle rapid thermal annealing. Electron. Lett. 50, 197 (2014).
J.D. Greenlee, T.J. Anderson, B.N. Feigelson, K.D. Hobart, and F.J. Kub, Characterization of an Mg-implanted GaN p–i–n diode. Phys. Status Solidi A 212, 2772 (2015).
T.J. Anderson, J.D. Greenlee, B.N. Feigelson, J.K. Hite, K.D. Hobart, and F.J. Kub, Improvements in the annealing of Mg Ion implanted GaN and related devices. IEEE Trans. Semicond. Manuf. 29, 343 (2016).
K. Nomoto, K. Takahashi, T. Oikawa, H. Ogawa, T. Nishimura, T. Mishima, H.G. Xing, and T. Nakamura, Ion Implantation into GaN and implanted GaN power transistors. ECS Trans. 69, 105 (2015).
T. Oikawa, Y. Saijo, S. Kato, T. Mishima, and T. Nakamura, Formation of definite GaN p–n junction by Mg-ion implantation to n–-GaN epitaxial layers grown on a high-quality free-standing GaN substrate. Nucl. Inst. Methods Phys. Res. B 365, 168 (2015).
T. Niwa, T. Fujii, and T. Oka, High carrier activation of Mg ion-implanted GaN by conventional rapid thermal annealing. Appl. Phys. Express 10, 091002 (2017).
T. Narita, T. Kachi, K. Kataoka, and T. Uesugi, Electric-field-induced simultaneous diffusion of Mg and H in Mg-doped GaN prepared using ultra-high-pressure annealing. Appl. Phys. Exp. 10, 016501 (2017).
H. Sakurai, M. Omori, S. Yamada, Y. Furukawa, H. Suzuki, T. Narita, K. Kataoka, M. Horita, M. Bockowski, J. Suda, and T. Kachi, Highly effective activation of Mg-implanted p-type GaN by ultra-high-pressure annealing. Appl. Phys. Lett. 115, 142104 (2019).
G. Alfieri, V.K. Sundaramoorthy, and R. Micheletto, Electrically active point defects in Mg implanted n-type GaN grown by metal-organic chemical vapor deposition. J. Appl. Phys. 123, 205303 (2018).
M. Akazawa, N. Yokota, and K. Uetake, Detection of deep-level defects and reduced carrier concentration in Mg-ionimplanted GaN before high-temperature annealing. AIP Advances 8, 025310 (2018).
M. Akazawa, K. Uetake, Impact of low-temperature annealing on defect levels generated by Mg-ion-implanted GaN. Jpn. J. Appl. Phys. 58, SCCB10 (2019).
M. Akazawa, R. Kamoshida, S. Murai, T. Narita, M. Omori, J. Suda, and T. Kachi, Effects of dosage increase on electrical properties of metal-oxide-semiconductor diodes with mg-ion-implanted GaN before activation annealing. Phys. Status Solidi B 257, 1900367 (2020).
M. Akazawa, and R. Kamoshida, Analysis of simultaneous occurrence of shallow surface Fermi level pinning and deep depletion in MOS diode with Mg-ion-implanted GaN before activation annealing. Jpn. J. Appl. Phys. 59, 096502 (2020).
M. Akazawa, R. Kamoshida, S. Murai, T. Kachi, and A. Uedono, Low-temperature annealing behavior of defects in Mg-ion-implanted GaN studied using MOS diodes and monoenergetic positron beam. Jpn. J. Appl. Phys. 60, 016502 (2021).
A. Uedono, S. Takashima, M. Edo, K. Ueno, H. Matsuyama, W. Egger, T. Koschine, C. Hugenschmidt, M. Dickmann, K. Kojima, S.F. Chichibu, and S. Ishibashi, Carrier trapping by vacancy-type defects in mg-implanted GaN studied using monoenergetic positron beams. Phys. Status Solidi B 255, 1700521 (2018).
W. Shockley, and W.T. Read, Statistics of the recombinations of holes and electrons. Phys. Rev. 87, 835 (1952).
P. Hacke, T. Detchprohm, K. Hiramatsu, N. Sawaki, K. Tadatomo, and K. Miyake, Analysis of deep levels in n-type GaN by transient capacitance methods. J. Appl. Phys. 76, 304 (1994).
G. Brammertz, K. Martens, S. Sioncke, A. Delabie, M. Caymax, M. Meuris, and M. Heyns, Characteristic trapping lifetime and capacitance-voltage measurements of GaAs metal-oxide-semiconductor structures. Appl. Phys. Lett. 91, 133510 (2007).
F. Schmidt, H. Wenckstern, O. Breitenstein, R. Pickenhain, and M. Grundmann, Low rate deep level transient spectroscopy - a powerful tool for defect characterization in wide bandgap semiconductors. Solid State Electron. 92, 40 (2014).
J. Pavelka, J. Šikula, M. Tacano, and M. Toita, Activation energy of RTS noise. Radioengineering 20, 194 (2011).
S.M. Sze, and K.K. Ng, Physics of Semiconductor Devices, 3rd ed., (Hoboken, NJ: Wiley, 2007).
H. Hasegawa, and H. Ohno, Unified disorder induced gap state model for insulator-semiconductor and metal-semiconductor interfaces. J. Vac. Sci. Technol. B 4, 1130 (1986).
H. Hasegawa, and M. Akazawa, Interface models and processing technologies for surface passivation and interface control in III–V semiconductor nanoelectronics. Appl. Surf. Sci 254, 8005 (2008).
C. Mizue, Y. Hori, M. Miczec, and T. Hashizume, Capacitance–voltage characteristics of Al2O3/AlGaN/GaN structures and state density distribution at Al2O3/AlGaN interface. Jpn. J. Appl. Phys. 50, 021001 (2011).
M. Matys, B. Adamowicz, A. Domanowska, A. Michalewicz, R. Stoklas, M. Akazawa, Z. Yatabe, and T. Hashizume, On the origin of interface states at oxide/III-nitride heterojunction interfaces. J. Appl. Phys. 120, 225305 (2016).
T. Sawada, K. Numata, S. Tohdoh, T. Saitoh, and H. Hasegawa, In-situ characterization of compound semiconductor surfaces by novel photoluminescence surface state spectroscopy. Jpn. J. Appl. Phys. 32, 511 (1993).
T. Hashizume, and R. Nakasaki, Discrete surface state related to nitrogen vacancy defect on plasma-treated GaN surfaces. Appl. Phys. Lett. 80, 4564 (2002).
J. L. Lyons, C. G. Van de Walle, Computationally predicted energies and properties of defects in GaN. npj Comput. Mater. 3, 12 (2017).
Z.-Q. Fang, D.C. Look, J. Jasinski, M. Benamara, Z. Liliental-Weber, and R.J. Molnar, Evolution of deep centers in GaN grown by hydride vapor phase epitaxy. Appl. Phys. Lett. 78, 332 (2001).
A.Y. Polyakov, N.B. Smirnov, A.V. Govorkov, A.V. Markov, N.G. Kolin, D.I. Merkurisov, V.M. Boiko, K.D. Shcherbatchev, V.T. Bublik, M.I. Voronova, I.-H. Lee, C.R. Lee, S.J. Pearton, A. Dabirian, and A.V. Osinsky, Fermi level pinning in heavily neutronirradiated GaN. J. Appl. Phys. 100, 093715 (2006).
S. Limpijumnong, C. G. Van de Walle, Diffusivity of native defects in GaN. Phys. Rev. B 69, 035207 (2004).
K.K. Khichar, S.B. Dangi, V. Dhayal, U. Kumar, S.Z. Hashmi, V. Sadhu, B.L. Choudhary, S. Kumar, S. Kaya, A.E. Kuznetsov, S. Dalela, S.K. Gupta, and P.A. Alvi, Structural, optical, and surface morphological studies of ethyl cellulose/graphene oxide nanocomposites. Polym. Compos. 41, 2792 (2020).
B.L. Choudhary, U. Kumar, S. Kumar, S. Chander, S. Kumar, S. Dalela, S.N. Dolia, and P.A. Alvi, Irreversible magnetic behavior with temperature variation of Ni0.5Co0.5Fe2O4 nanoparticles. J. Magn. Magn. Mater. 507, 166861 (2020).
V. Dhayal, S.Z. Hashmi, U. Kumar, B.L. Choudhary, A.E. Kuznetsov, S. Dalela, S. Kumar, S. Kaya, S.N. Dolia, and P.A. Alvi, Spectroscopic studies, molecular structure optimization and investigation of structural and electrical properties of novel and biodegradable Chitosan-GO polymer nanocomposites. J. Mater. Sci. 55, 14829 (2020).
G. Lal, K. Punia, S.N. Dolia, P.A. Alvi, B.L. Choudhary, S. Kumar, Structural, cation distribution, optical and magnetic properties of quaternary Co0.4+xZn0.6−xFe2O4 (x = 0.0, 0.1 and 0.2) and Li doped quinary Co0.4+xZn0.5−xLi0.1Fe2O4 (x = 0.0, 0.05 and 0.1) nanoferrites. J. Alloys Compd. 828, 154388 (2020).
U. Kumar, S. Upadhyay, P.A. Alvi, Study of reaction mechanism, structural, optical and oxygen vacancy-controlled luminescence properties of Eu-modified Sr2SnO4 Ruddlesden popper oxide. Physica B: Phys. Condens. Matter. 604, 412708 (2021).
B.J. Pong, C.J. Pan, Y.C. Teng, G.C. Chi, W.-H. Li, K.C. Lee, and C.H. Lee, Structural defects and microstrain in GaN induced by Mg ion implantation. J. Appl. Phys. 83, 5992 (1998).
P. Mendes, K. Lorenz, E. Alves, S. Schwaiger, F. Scholz, and S. Magalhães, Measuring strain caused by ion implantation in GaN. Mater. Sci. Semicond. Process. 98, 95 (2019).
Acknowledgments
The authors thank Dr. T. Narita of Toyota Central R&D Labs., Inc. for the MOVPE growth of GaN epitaxial layers. This work was supported by MEXT Programs “Research and development of next-generation semiconductor to realize energy-saving society” (Grant Number JPJ005357) and “Creation of innovative core technology for power electronics” (Grant Number JPJ009777).
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Akazawa, M., Murai, S. & Kachi, T. Encapsulant-Dependent Effects of Long-Term Low-Temperature Annealing on Interstitial Defects in Mg-Ion-Implanted GaN. J. Electron. Mater. 51, 1731–1739 (2022). https://doi.org/10.1007/s11664-022-09431-y
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DOI: https://doi.org/10.1007/s11664-022-09431-y