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Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties

  • TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder
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Abstract

This study examines factor(s) behind the formation of primary Cu6Sn5 (in the bulk, rather than at the interface) in solder joints, even though solder alloys are hypoeutectic. To understand the contribution from copper (Cu) dissolution from the substrate a Cu-free alloy, tin-3.5 silver (Sn-3.5Ag), was used as a soldered-on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish substrates. Microstructure observations including in situ synchrotron were used to observe microstructure development real-time and confirm the time and location for nucleation of primary Cu6Sn5. High-speed shear tests were performed to determine the solder joint’s strengths. The results confirm that Cu dissolution during soldering is responsible for the formation of primary Cu6Sn5. The ENIG finish prevented Cu dissolution and the formation of Cu6Sn5 resulting in higher solder joint strength for the Sn-3.5Ag/ENIG solder joints. The findings can be used to understand the evolution of primary Cu6Sn5 and how it can be suppressed to improve joint strength.

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References

  1. J.W. Yoon, B.I. Noh, and S.B. Jung, J. Alloys Compd. 506, 331 (2010).

    Article  CAS  Google Scholar 

  2. Z. Huang, P. Kumar, I. Dutta, R. Sidhu, M. Renavikar, and R. Mahajan, J. Electron. Mater. 43, 4485 (2014).

    Article  CAS  Google Scholar 

  3. J.M. Kim, M.H. Jeong, S. Yoo, and Y.B. Park, J. Electron. Mater. 41, 791 (2012).

    Article  CAS  Google Scholar 

  4. T.H. Chuang, C.C. Jain, and S.S. Wang, J. Mater. Eng. Perform. 18, 1133 (2009).

    Article  CAS  Google Scholar 

  5. Y. Tian, W. Liu, R. An, W. Zhang, L. Niu, and C. Wang, J. Mater. Sci.-Mater. Electron. 23, 136 (2012).

    Article  CAS  Google Scholar 

  6. G. Zeng, S. Xue, L. Zhang, L. Gao, W. Dai, and J. Luo, J. Mater. Sci-Mater. Electron. 21, 421 (2010).

    Article  CAS  Google Scholar 

  7. J.M. Kim, M.H. Jeong, S. Yoo, C.W. Lee, and Y.B. Park, Microelectron. Eng. 89, 55 (2012).

    Article  CAS  Google Scholar 

  8. J.W. Xian, S.A. Belyakov, M. Ollivier, K. Nogita, H. Yasuda, and C.M. Gourlay, Acta Mater. 126, 540 (2017).

    Article  CAS  Google Scholar 

  9. J.W. Xian, S.A. Belyakov, and C.M. Gourlay, J. Electron. Mater. 45, 69 (2016).

    Article  CAS  Google Scholar 

  10. M.A.A. Mohd Salleh, S.D. McDonald, C.M. Gourlay, S.A. Belyakov, H. Yasuda, and K. Nogita, J. Electron. Mater. 45, 154 (2016).

    Article  CAS  Google Scholar 

  11. M.A.A. Mohd Salleh, C.M. Gourlay, J.W. Xian, S.A. Belyakov, H. Yasuda, S.D. McDonald, and K. Nogita, Sci. Rep.-UK 7, 1 (2017).

    Article  Google Scholar 

  12. J. Shen, Y.C. Chan, and S.Y. Liu, Acta Mater. 57, 5196 (2009).

    Article  CAS  Google Scholar 

  13. Z. Chen, A. Kumar, and M. Mona, J. Electron. Mater. 35, 2126 (2006).

    Article  CAS  Google Scholar 

  14. M.A.A. Mohd Salleh, S.D. McDonald, H. Yasuda, A. Sugiyama, and K. Nogita, Scr. Mater. 100, 17 (2015).

    Article  CAS  Google Scholar 

  15. P.F. Yang, Y.S. Lai, S.R. Jian, J. Chen, and R.S. Chen, Mater. Sci. Eng. A 485, 305 (2008).

    Article  Google Scholar 

  16. S.K. Kang, W.K. Choi, D.Y. Shih, D.W. Henderson, T. Gosselin, A. Sarkhel, C. Goldsmith, and K.J. Puttlitz, JOM 55, 61 (2003).

    Article  CAS  Google Scholar 

  17. T. Garami and O. Krammer, J. Mater. Sci.-Mater. Electron. 26, 8540 (2015).

    Article  CAS  Google Scholar 

  18. H. Esaka, K. Shinozuka, and M. Tamura, Mater. Trans. (2005). https://doi.org/10.2320/matertrans.46.916.

    Article  Google Scholar 

  19. Y. Takamatsu, H. Esaka, and K. Shinozuka, Mater. Trans. (2011). https://doi.org/10.2320/matertrans.M2010325.

    Article  Google Scholar 

  20. J.W. Kim, Y.C. Lee, S.S. Ha, and S.B. Jung, J. Mater. Sci.-Mater. Electron. 20, 17 (2009).

    Article  CAS  Google Scholar 

  21. H. Tskukamoto, T. Nishimura, S. Suenaga, and K. Nogita, Mater. Sci. Eng. B 171, 162 (2010).

    Article  Google Scholar 

  22. H. Tskukamoto, T. Nishimura, S. Suenaga, S.D. McDonald, K.W. Sweatman, and K. Nogita, Microelectron. Reliab. 51, 657 (2011).

    Article  Google Scholar 

  23. A. Kumar, Z. Chen, S.G. Mhaisalkar, C.C. Wong, P.S. Teo, and V. Kripesh, Thin Solid Films 504, 410 (2006).

    Article  CAS  Google Scholar 

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Acknowledgments

The authors gratefully acknowledge the financial support from the Universiti Malaysia Perlis (UniMAP), Nihon Superior Co. Ltd. collaboration research project and the fundamental research grant scheme (FRGS) FRGS/1/2017/TK05/UNIMAP/03/3 (9003-00621) from the Ministry of Higher Education, Malaysia. Authors would like to thank N.R. Abdul Razak at the University of Queensland and UniMAP for the help in preparing the samples and helping in synchrotron imaging experiments. Real-time in situ synchrotron imaging experiments were performed at the Japan Synchrotron Radiation Research Institute (JASRI) using BL20XU beamline of the SPring-8 Synchrotron (2017B1519 and 2019B1618) which is also supported by Grant-in-Aid for Scientific Research (S) (No. 17H06155), JSPS, Japan. The micro-XRF mapping technique was performed at the Synchrotron Light Research Institute (SLRI), Thailand (Project ID: 6031). The high-speed shear test was conducted at Nihon Superior R&D Center, Osaka, Japan.

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Authors and Affiliations

  1. Center of Excellence Geopolymer & Green Technology (CeGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600, Jejawi, Arau, Perlis, Malaysia

    S. F. N. Muhd Amli, M. A. A. Mohd Salleh, M. I. I. Ramli & F. Somidin

  2. Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto, 606-8501, Japan

    H. Yasuda

  3. Synchrotron Light Research Institute, Muang, Nakhon Ratchasima, 3000, Thailand

    J. Chaiprapa

  4. School of Manufacturing Engineering, Universiti Malaysia Perlis (UniMAP), Pauh Putra Campus, 02600, Jejawi, Arau, Perlis, Malaysia

    Z. Shayfull

  5. Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, QLD, 4072, Australia

    F. Somidin & K. Nogita

Authors
  1. S. F. N. Muhd Amli
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  2. M. A. A. Mohd Salleh
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  3. M. I. I. Ramli
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  4. H. Yasuda
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  5. J. Chaiprapa
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  6. F. Somidin
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  7. Z. Shayfull
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  8. K. Nogita
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Correspondence to M. A. A. Mohd Salleh.

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Muhd Amli, S.F.N., Mohd Salleh, M.A.A., Ramli, M.I.I. et al. Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties. J. Electron. Mater. 50, 710–722 (2021). https://doi.org/10.1007/s11664-020-08428-9

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  • DOI: https://doi.org/10.1007/s11664-020-08428-9

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