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Design Optimization of a Thermoelectric Cooling Module Using Finite Element Simulations

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Abstract

The thermoelectric industry is concerned about the size reduction, cooling performance and, ultimately, the production cost of thermoelectric modules. Optimization of the size and performance of a commercially available thermoelectric cooling module is considered using finite element simulations. Numerical simulations are performed on eight different three-dimensional geometries of a single thermocouple, and the results are further extended for a whole module as well. The maximum temperature rise at the hot and cold sides of a thermocouple is determined by altering its height and cross-sectional area. The influence of the soldering layer is analyzed numerically using temperature dependent and temperature independent thermoelectric properties of the solder material and the semiconductor pellets. Experiments are conducted to test the cooling performance of the thermoelectric module and the results are compared with the results obtained through simulations. Finally, cooling rate and maximum coefficient of performance (COPmax) are computed using convective and non-convective boundary conditions.

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Abbreviations

V :

Applied voltage (\( {\hbox{V}} \))

I :

Applied current (\( {\hbox{A}} \))

\( \Delta T \) :

Temperature difference between hot and cold side (°C)

A P :

Cross-sectional area of the semiconductor pellet (m2)

H P :

Height of the semiconductor pellet (m)

T c :

Cold side temperature (°C)

T h :

Hot side temperature (°C)

\( T_{\rm{sink}} \) :

Heat sink temperature (°C)

Q c :

Heat absorbed at cold side interface (W)

Q h :

Heat released at hot side interface (W)

N :

Number of thermocouples

R :

Electrical resistance (Ω)

COP:

Coefficient of performance

Z :

Figure of merit

h :

Heat transfer coefficient (\( {\hbox{W}} \cdot {\hbox{m}}^{ - 2} \cdot {\hbox{K}}^{ - 1} \))

\( \dot{q}_{{{\rm{c}},\rm{max} }} \) :

Maximum heat flux at cold side (\( {\hbox{W}} \cdot {\hbox{m}}^{ - 2} \))

λ :

Thermal conductivity (\( {\hbox{W}} \cdot {\hbox{m}}^{ - 1} \cdot {\hbox{K}}^{ - 1} \))

λ p :

Thermal conductivity of the p-type semiconductor pellet (\( {\hbox{W}} \cdot {\hbox{m}}^{ - 1} \cdot {\hbox{K}}^{ - 1} \))

λ n :

Thermal conductivity of the n-type semiconductor pellet (\( {\hbox{W}} \cdot {\hbox{m}}^{ - 1} \cdot {\hbox{K}}^{ - 1} \))

α p :

Seebeck coefficient of p-type semiconductor element (\( \mu {\hbox{V}} \cdot {\hbox{K}}^{ - 1} \))

α n :

Seebeck coefficient of n-type semiconductor element (\( \mu {\hbox{V}} \cdot {\hbox{K}}^{ - 1} \))

ρ p :

Bulk density of the p-type semiconductor element (\( {\hbox{kg}} \cdot {\hbox{m}}^{ - 3} \))

ρ n :

Bulk density of the n-type semiconductor element (\( {\hbox{kg}} \cdot {\hbox{m}}^{ - 3} \))

σ :

Electrical conductivity \( ( {\hbox{S}} \cdot {\hbox{m}}^{ - 1} ) \)

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Acknowledgements

Author is thankful to the “Deutsche Bundesstiftung Umwelt” for financially supporting this work.

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Authors and Affiliations

  1. Department of Mechanical Engineering, COMSATS University Sahiwal Campus, COMSATS Road, Off GT Road, Sahiwal, Pakistan

    Muhammad Abid

  2. Institut für Thermodynamik, Technische Universität Carolo-Wilhelmina zu Braunschweig, Braunschweig, Germany

    Ragnar Somdalen & Marina Sancho Rodrigo

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  1. Muhammad Abid
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Correspondence to Muhammad Abid.

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Abid, M., Somdalen, R. & Rodrigo, M.S. Design Optimization of a Thermoelectric Cooling Module Using Finite Element Simulations. J. Electron. Mater. 47, 4845–4854 (2018). https://doi.org/10.1007/s11664-018-6369-4

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