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Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

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Abstract

Solder joint interconnects in three-dimensional (3D) packages with package stacking configurations typically must undergo multiple reflow cycles during the assembly process. In this work, interfacial open joint failures between the bulk solder and the intermetallic compound (IMC) layer were found in Sn–Ag–Cu (SAC) solder joints connecting a small package to a large package after multiple reflow reliability tests. Systematic progressive 3D x-ray computed tomography experiments were performed on both incoming and assembled parts to reveal the initiation and evolution of the open failures in the same solder joints before and after the reliability tests. Characterization studies, including focused ion beam cross-sections, scanning electron microscopy, and energy-dispersive x-ray spectroscopy, were conducted to determine the correlation between IMC phase transformation and failure initiation in the solder joints. A comprehensive failure mechanism, along with solution paths for the solder joint interfacial failures after multiple reflow cycles, is discussed in detail.

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Authors and Affiliations

  1. Intel Corporation, CH5-263, 5000 W. Chandler Blvd., Chandler, AZ, USA

    Yan Li, Olen Hatch, Pilin Liu & Deepak Goyal

Authors
  1. Yan Li
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  2. Olen Hatch
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  3. Pilin Liu
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  4. Deepak Goyal
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Correspondence to Yan Li.

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Li, Y., Hatch, O., Liu, P. et al. Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows. J. Electron. Mater. 46, 1674–1682 (2017). https://doi.org/10.1007/s11664-016-5211-0

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  • DOI: https://doi.org/10.1007/s11664-016-5211-0

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