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Electroless Silver Coating on Copper Microcones for Low-Temperature Solid-State Bonding

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Abstract

A low-temperature solid-state bonding technology using silver-coated Cu microcones and Sn-3.0Ag-0.5Cu (wt.%) solder for three-dimensional (3D) packaging is presented. Electroless silver coating on the surfaces of copper microcones effectively reduces oxide layer growth and significantly enhances the solder joint shear strength from an average of 33.5 MPa to 43.4 MPa. Low-temperature thermocompression bonding at 463 K in ambient air was achieved using silver-coated Cu microcones, with no voids found along the bonded interface. Microscopic observation revealed that the microcones were completely inserted into the soft solder. Probable mechanisms for this bonding process are proposed and discussed.

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Authors and Affiliations

  1. State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, People’s Republic of China

    Fengtian Hu, Shan Yang, Haozhe Wang, Anmin Hu & Ming Li

Authors
  1. Fengtian Hu
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  2. Shan Yang
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  3. Haozhe Wang
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  4. Anmin Hu
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  5. Ming Li
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Correspondence to Fengtian Hu.

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Hu, F., Yang, S., Wang, H. et al. Electroless Silver Coating on Copper Microcones for Low-Temperature Solid-State Bonding. J. Electron. Mater. 44, 4516–4524 (2015). https://doi.org/10.1007/s11664-015-3930-2

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