Abstract
The interactions of Ti and Cr in a Sn0.3Ag0.7Cu melt with graphite were studied by continuous-heating and isothermal wetting experiments. Active Ti and Cr both had positive influences on the wettability of Sn0.3Ag0.7Cu on graphite. The Sn0.3Ag0.7Cu-Ti melt began to spread on graphite at 650 °C, while the Sn0.3Ag0.7Cu-Cr melt needed a temperature higher than 750 °C. Under the same processes, the spreading of the Sn0.3Ag0.7Cu-Cr melt was faster than that of the Sn0.3Ag0.7Cu-Ti melt. For the Sn0.3Ag0.7Cu-Ti/graphite system, the final contact angle was dependent on the isothermal temperature rather than the content of Ti, and the opposite was observed for the Sn0.3Ag0.7Cu-Cr/graphite system. Microanalyses revealed that nonstoichiometric TiCx and Cr-C compounds (Cr3C2 and Cr7C3) formed at the droplet/graphite interface. A smaller stoichiometry x of TiCx or more Cr7C3 in the Cr-C mixture indicated a better wetting. The thermodynamics of the interfacial reaction was calculated, and it was favorable. The faster spreading of the Sn0.3Ag0.7Cu-Cr melt and the more violent interfacial reaction were due to the higher activity of Cr than Ti in the melt.
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Acknowledgments
We are grateful to the helpful discussion and suggestions of Dr. V. Fabrizio and Dr. A. Passerone of Inst. of Condensed Matter Chemistry and Technologies for Energy-ICMATE-CNR. This project is supported by National Natural Science Foundation of China (Grant Nos. 51775138 and U1537206) and the Key Research & Development Program of Shandong Province (No. 2017GGX40103).
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Manuscript submitted May 14, 2018.
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Fu, W., Hu, S., Song, X. et al. Wetting Behaviors and Interfacial Characteristics of Sn0.3Ag0.7Cu Alloys Containing Ti or Cr on Graphite. Metall Mater Trans A 49, 5823–5832 (2018). https://doi.org/10.1007/s11661-018-4895-6
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DOI: https://doi.org/10.1007/s11661-018-4895-6