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Contact resistance and arc erosion of tungsten-copper contacts in direct currents

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Abstract

The arc erosion under medium direct currents in the argon flow was tested on tungsten-copper (W-Cu) contacts which were processed by hot extrusion and heat treatment. The scanning electron microscopy (SEM) and transmission electron microscopy (TEM) were used to study the microstructure of the W-Cu powders and compacts. The contact resistance, arcing energy, and arcing time were continuously measured by JF04C contact materials test system. Changes in tungsten-copper contact surface were observed by SEM. The test results showed that the arcing time and arcing energy all increase with current and voltage, but the changes of average contact resistance are more complicated. For a short arcing time, the average contact resistance decreases with increasing current due to the vaporization of Cu. However, for a longer arcing time, it slightly increases due to the formation of high resistant films, compound copper tungsten. The formation of compound copper tungsten was confirmed by the increased Rc kept in the range from 1.1 to 1.6 mΩ. The compound copper tungsten is first exposed with a tungsten and copper-rich surface, and then totally exposed due to evaporation of copper from the surface. At last a stabilized surface is created and the crystals decrease from 8 μm to 2 μm caused by the arc erosion.

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References

  1. Slade PG. Electrical Contacts: Principles and Applications[M]. New York: CRC press, 2014: 879–880

    Book  Google Scholar 

  2. Liu S, Yu K, Shen Q, et al. Fabrication of WCu Composite Powders by Direct Electroless Plating Using a Dripping Method[J]. Journal of Wuhan University of Technology-Materials Science Edition, 2013, 28: 829–33

    Article  Google Scholar 

  3. Luo S, Yi J, Guo Y, et al. Consolidation and Microstructures of Microwave Sintered W-25Cu Alloys with Fe Addition[J]. Journal of Wuhan University of Technology-Materials Science Edition, 2010, 25: 437–43

    Article  Google Scholar 

  4. Tao J, Shi X. Properties, Phases and Microstructure of Microwave Sintered W-20Cu Composites from Spray Pyrolysis-continuous Reduction Processed Powders[J]. Journal of Wuhan University of Technology-Materials Science Edition, 2012, 27: 38–44

    Article  Google Scholar 

  5. Zhang Q, Shi X, Yang H, et al. Microstructure and Properties of W-15Cu Alloys Prepared by Mechanical Alloying and Spark Plasma Sintering Process[J]. Journal of Wuhan University of Technology-Materials Science Edition, 2008, 23: 399–402

    Article  Google Scholar 

  6. Wang J, Tie S, Kang Y, et al. Contact Resistance Characteristics of Ag-SnO2 Contact Materials with High SnO2 Content[J]. Journal of Alloys and Compounds, 2015, 644: 438–443

    Article  Google Scholar 

  7. Myshkin NK. Tribological Problems in Electrical Contacts[J]. Tribology International, 1991, 24(1): 45–49

    Article  Google Scholar 

  8. Slade PG. Effect of the Electric Arc and the Ambient Air on the Contact Resistance of Ag, W, and W-Ag Contacts [J]. Journal of Applied Physics, 1976, 47(8): 3438–3443

    Article  Google Scholar 

  9. Hashempour M, Razavizadeh H, Rezaie H. Investigation on Wear Mechanism of Thermochemically Fabricated W-Cu Composites[J]. Wear, 2010, 269: 405–415

    Article  Google Scholar 

  10. Slade PG, Li WP, Mayo S, et al. Vacuum Interrupter, High Reliability Component of Distribution Switches, Circuit Breakers and Contactors[J]. J Zhejiang Univ-SCI A, 2007, 8: 335–342.

    Article  Google Scholar 

  11. Ma DQ, Xie JP, Li JW, et al. Synthesis and Hydrogen Reduction of Nano-sized Copper Tungstate Powders Produced by a Hydrothermal Method[J]. International Journal of Refractory Metals & Hard Materials, 2014, 46: 152–158

    Article  Google Scholar 

  12. Dorfman LP, Houck DL, Scheithauer MJ. Consolidation of Tungsten-coated Copper Composite powder[J]. Journal of Materials Research, 2002, 17(8): 2075–2084

    Article  Google Scholar 

  13. Xie X, Lin Q, Liu D, et al. Research on the Densification of W-30wt%-Cu Composite Powder by Hot Extrusion with Steel Cup[J]. Materials Science and Engineering: A, 2013, 578: 187–190

    Article  Google Scholar 

  14. Chen ZK, Sawa K. Effect of Arc Behavior on Material Transfer: A Review[C]. In: Joint with the 18th International Conference on Electrical Contacts, IEEE, 1996: 238–251

    Google Scholar 

  15. Slade PG. Advances in Material Development for High Power, Vacuum Interrupter Contacts[J]. IEEE Transactions on Components, Packing, and Manufacturing Technology, 1994, 17: 96–106

    Article  Google Scholar 

  16. Boyle WS, Geriner LH. Arcing at Electricalcontacts on Closure. Part VI. The anode Mechanism of Extremely Short Arcs[J]. Journal of Applied Physics, 1955, 26: 571–574

    Article  Google Scholar 

  17. Chen W, Kang Z, Ding B. Preparation and Arc Breakdown Behavior of Nanocrystalline W-Cu Electrical Contact Materials[J]. Journal of Materials Science & Technology, 2005, 21: 875–878

    Article  Google Scholar 

  18. Ding T, Chen GX, Li YM, et al. Arc Erosive Characteristics of a Carbon Strip Sliding Against a Copper Contact Wire in a High-speed Electrified Railway[J]. Tribology International, 2014, 79: 8–15

    Article  Google Scholar 

  19. Leung C, Bevington R, Wingert P, et al. Effects of Processing Methods on the Contact Performance Parameters for Silver-tungsten Composite Materials[J]. IEEE Trans CHMT, 1982, 5(1): 23–31

    Google Scholar 

Download references

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Authors and Affiliations

  1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China

    Douqin Ma  (马窦琴), Jingpei Xie, Jiwen Li, Aiqin Wang & Wenyan Wang

  2. Non-ferrous Metal Generic Technology Collaborative Innovation Center of Henan Province, Luoyang, 471023, China

    Douqin Ma  (马窦琴), Jingpei Xie & Wenyan Wang

Authors
  1. Douqin Ma  (马窦琴)
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  2. Jingpei Xie
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  3. Jiwen Li
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  4. Aiqin Wang
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  5. Wenyan Wang
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Correspondence to Douqin Ma  (马窦琴).

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Ma, D., Xie, J., Li, J. et al. Contact resistance and arc erosion of tungsten-copper contacts in direct currents. J. Wuhan Univ. Technol.-Mat. Sci. Edit. 32, 816–822 (2017). https://doi.org/10.1007/s11595-017-1674-y

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  • DOI: https://doi.org/10.1007/s11595-017-1674-y

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