Abstract
To improve the copper corrosion resistance of epoxy-functionalized hybrid sol–gel monolayers (Hy) consisting of 3-glycidoxypropyltrimethoxysilane (GPTMS-functional monomer) and tetraethoxysilane (TEOS-reticulating agent), the copper surface was modified by a well-defined inhibitor viz., thiosemicarbazide (TSC). At first, the copper surface was activated by TSC monolayers through Cu–S bonds which end up with free tail amino groups. Secondly, Hy monolayers were immobilized on the TSC-modified copper surface via epoxy-amine reaction. The interaction of TSC with copper and Hy was investigated by Fourier transform infrared spectroscopy, which revealed the cleavage of epoxy ring due to the cross-linking reaction with free amino groups of TSC monolayers. The surface morphology of these monolayers was investigated by scanning electron microscopy and atomic force microscopy. The effectiveness of TSC and Hy monolayers on corrosion protection of copper was scrutinized by electrochemical methods viz., potentiodynamic polarization studies and electrochemical impedance spectroscopy techniques. These studies revealed the enhancement of copper corrosion resistance of epoxy-functionalized Hy monolayers by the TSC activation.
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Acknowledgments
The authors are grateful to the Board of Research in Nuclear Sciences (BRNS), Department of Atomic Energy (DAE), Mumbai, Government of India, for the financial support for this work through a major research project on “Sol–Gel” (No. 2011/37C/55/BRNS).
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Karthik, N., Sethuraman, M.G. Improved copper corrosion resistance of epoxy-functionalized hybrid sol–gel monolayers by thiosemicarbazide. Ionics 21, 1477–1488 (2015). https://doi.org/10.1007/s11581-014-1274-1
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DOI: https://doi.org/10.1007/s11581-014-1274-1