Abstract
Hybrid plasmonic waveguides have emerged as one of the most emerging tools for long-range subwavelength optical guidance. We propose the coupling of a hybrid plasmonic (HP) mode into a silicon tip. The HP mode is made to confine in the silicon tip through lateral as well as a vertical coupling, which provides moderately good field enhancement with long-range propagation. The lateral coupling exhibits a field enhancement of more than 200 in a silicon tip with a propagation length of 110 μm. Field enhancement in the vertically coupled case is 25 with a propagation length of 1.1 mm. In both cases, mode area remains around 50–60 nm2. In addition, both structures show broadband propagation of HP modes where propagation length remains long over a broad range wavelength. The proposed waveguide structures can be useful in realizing nanophotonic devices for broad range of applications including spectroscopy, optical fiber communication and bio-chemical sensing.
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The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.
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The computer codes used during the current study are available from the corresponding author on reasonable request.
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Funding
The work is supported by Science and Engineering Research Board (SERB) with grant no. CRG/2020/000144 and from Council of Scientific and Industrial Research (CSIR) with grant no. 22(0840)/20/EMR-II.
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S.K. and M.K. conceptualized the device and conducted a theoretical analysis. The numerical analysis on lateral coupling was carried out by S.K., S.R., and R.D.M. The vertical coupling analysis was done by S.K., V.K., and P.B. R.R. provided partial technical suggestions and helped in finalizing the manuscript. M.K. guided the entire computational process. S.K. and M.K. conducted the data analysis and wrote the manuscript.
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Kumar, S., Rajput, S., Kaushik, V. et al. Numerical Analysis of Laterally and Vertically Coupled Hybrid Plasmonic Modes in Silicon Tip. Plasmonics 17, 1699–1707 (2022). https://doi.org/10.1007/s11468-022-01657-0
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DOI: https://doi.org/10.1007/s11468-022-01657-0