Results
of investigations of submicrocrystalline copper subjected to cold rolling after abc pressing by methods of backscatter electron diffraction and x-ray diffraction analysis are presented. It is demonstrated that after such combined intensive plastic deformation, the submicrocrystalline structure with average grain-subgrain structure elements having sizes of 0.63 μm is formed with relative fraction of high-angle grain boundaries of ~ 70% with texture typical for rolled copper. Results of investigation of microplastic deformation of copper with such structure at temperatures in the interval 295–473 K and with submicrocrystalline structure formed by cold rolling of coarse-grained copper are presented.
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Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 10, pp. 63–66, October, 2016.
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Dudarev, E.F., Pochivalova, G.P., Tabachenko, A.N. et al. Microplastic Deformation of Submicrocrystalline Copper at Room and Elevated Temperatures. Russ Phys J 59, 1589–1592 (2017). https://doi.org/10.1007/s11182-017-0948-3
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DOI: https://doi.org/10.1007/s11182-017-0948-3