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Integrated microchannel cooling for densely packed electronic components using vanadium pentaoxide (V2O5)-xerogel nanoplatelets-based nanofluids

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Abstract

The present study reports the implementation of novel nanoplatelets-based vanadium pent oxide (V2O5)-xerogel for the application of conjugate cooling in densely packed electronic devices. An integrated heat sink is made up of copper with a channel width of 490 µm and is shrink-fitted into aluminium block that acts as a heat spreader. V2O5-xerogel is synthesized by melt quenching process and characterized based on field emission scanning electron microscope, transmission electron microscope, and X-ray diffraction to analyse the surface morphology of the particles. Studies related to the stability of the nanofluids for different concentrations are discussed in this paper. Furthermore, a study on the effect of pulsating flow in microchannel is performed for different flow rates. As a result, a maximum enhancement of 17% in heat transfer coefficient was observed for the concentration of 0.4 mass% with a flow rate of 200 mL min-1 compared to a pure fluid. Finally, the results reveal that the xerogel is a potential working fluid for heat transfer applications involving microscale devices.

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Abbreviations

MEMS:

Micro-electromechanical systems

NEMS:

Nano-electromechanical systems

MHS:

Microchannel heat sink

Ag:

Silver

CuO:

Copper oxide

TiO2 :

Titanium oxide

Al2O3 :

Aluminium oxide

Cu:

Copper

SiO2 :

Silicon oxide

CNT:

Carbon nanotubes

SWCNT:

Single-walled carbon nanotubes

GNP:

Graphene nanoplatelets

ZnO:

Zinc oxide

DW:

Distilled water

BNN:

Boron nitrate nanotubes

PEG:

Polyethylene glycol

CNC:

Cellulose nanocrystal

PVDF:

Polyvinylidene fluoride

FeV3O8 :

Iron vanadium oxide

BET:

Brunauer–Emmett–Teller

SEM:

Scanning electron microscope

TEM:

Transmission electron microscope

XRD:

X-ray diffraction

MVO:

Mesoporous vanadium oxide

P :

Perimeter of the channel

A c :

Area of the channel

Nuz :

Local Nusselt number

D h :

Hydraulic diameter

h z :

Local heat transfer coefficient

T f :

Temperature of the fluid

T w :

Temperature of the wall

q" :

Heat flux

h avg :

Average heat transfer coefficient

k :

Thermal conductivity

A :

Height of the microchannel

B :

Width of the channel

C :

Gap between the channels

D :

Gap between the channel bottoms to thermocouple

tin :

Temperature in

t out :

Temperature out

P in :

Pressure in

P out :

Pressure out

F in :

Fluid inlet

F out :

Fluid outlet

f :

Friction factor

\(\dot{m}\) :

Mass flow rate

Re:

Reynolds number

Z :

Cartesian coordinate

X :

Cartesian coordinates

Y :

Cartesian coordinate

Ø:

Volume fraction

p :

Particles

C p :

Specific heat

S:

Solid region

f:

Fluid region

nf:

Nanofluid

bf:

Basefluid

l,b,h :

Length, breadth and height of copper channel

L,B,H :

Length, breadth and height of aluminium block

t1-t6:

Thermocouple locations of copper channel

tA11-tA16:

Thermocouple locations of aluminium block

ρ :

Density

μ:

Dynamic viscosity

Ω:

Electrical resistance

Δ:

Difference

ϕ:

Nanoparticle volume fraction

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Acknowledgements

The authors acknowledge Centre for System Design (CSD) Facility, NITK, Surathkal, for providing required instrumentation for performing the experiments which is highly appreciated.

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore, Karnataka, 575025, India

    Ganesan Narendran, N. Gnanasekaran & D. Arumuga Perumal

  2. Materials Research Laboratory, Department of Physics, National Institute of Technology Karnataka, Surathkal, Mangalore, Karnataka, 575025, India

    M. Sreejesh & H. S. Nagaraja

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  1. Ganesan Narendran
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  2. N. Gnanasekaran
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  3. D. Arumuga Perumal
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  4. M. Sreejesh
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  5. H. S. Nagaraja
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Contributions

GN contributed to conceptualization, methodology, validation, formal analysis, investigation, and writing—original draft. NG performed writing—review and editing, supervision, and project administration. DAP and HSN performed writing—review and editing, and supervision. MS contributed to methodology, formal analysis, and investigation.

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Correspondence to D. Arumuga Perumal.

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Narendran, G., Gnanasekaran, N., Perumal, D.A. et al. Integrated microchannel cooling for densely packed electronic components using vanadium pentaoxide (V2O5)-xerogel nanoplatelets-based nanofluids. J Therm Anal Calorim 148, 2547–2565 (2023). https://doi.org/10.1007/s10973-022-11925-0

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