Abstract
Electronic components used in high power dissipating equipment’s requires superior thermal management and system design should be good enough to serve its promised lifetime without any performance issues/early failures. Prime task for product designers is to keep the electronic devices temperature below threshold limit by dispelling generated heat. Most common and preferred electronics thermal management technique is air-cooled heatsinks with fans because of its heat dissipation range and most reliable simple technique. This review paper specifically aims to understand the recent advancements of air-cooled pin–fin heatsinks for heat transfer applications. This article focuses on available literature only on heatsinks of pin–fin type to explore the results of different types of geometry, orientation, spacing out, perforations on heat transfer performance. In addition to above analytical, numerical, experimental results and heat transfer correlations of different studies are compared and summarized. The outcome of this review article is to provide better understanding on the cooling performance of the pin–fin type heatsink technology and its effective usage towards better thermal management applications.
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Abbreviations
- η :
-
System performance
- q :
-
Heat flux (W m–2)
- Re:
-
Reynolds number
- ρ :
-
Density (kg m–3)
- V :
-
Average velocity of air inside duct (m s–1)
- D h :
-
Hydraulic diameter (m)
- μ :
-
Dynamic Viscosity of fluid (kg ms–1)
- ν :
-
Kinematic viscosity of the fluid (m2 s–1)
- A d :
-
Cross-section area (m2)
- A s :
-
Total surface area of solid fin array (m2)
- P c :
-
Perimeter of cross-section (m)
- Nu:
-
Nusselt number
- h avg :
-
Average convective heat transfer coefficient (W m–2 °C–1)
- K air :
-
Thermal conductivity of air (W m–1 °C–1)
- K :
-
Thermal conductivity of heat sink (W m–1 °C–1)
- ΔP :
-
Pressure drop (kPa)
- g :
-
Acceleration due to gravity (m s–2)
- Δh :
-
Differential pressure head across the test section (m)
- P in :
-
Pressure at inlet (kPa)
- P out :
-
Pressure at outlet (kPa)
- Q ele :
-
Total electrical energy supplied to heater (W)
- Q cond :
-
Heat energy dissipated from heat sink through conduction (W)
- Q conv :
-
Heat dissipated from heat sink through convection (W)
- Q rad :
-
Heat dissipated from heat sink through radiation (W)
- Q loss :
-
Heat energy loss through insulation (W)
- Q net :
-
Net heat energy supplied to heat sink (W)
- m :
-
Mass flow rate of fluid (m s–1)
- C p :
-
Specific heat capacity of fluid (J kg–1 °C–1)
- T s :
-
Average base plate temperature (°C)
- T bm :
-
Bulk mean temperature (°C)
- T out :
-
Outlet air temperature (°C)
- T in :
-
Inlet air temperature (°C)
- R th :
-
Thermal resistance (°C W–1)
- f :
-
Friction factor
- ε f :
-
Fin effectiveness
- ϵ :
-
Fin efficiency
- Lw:
-
Length of wing
- D :
-
Pin fin diameter
- S :
-
Fin Pinch
- S/D :
-
Pitch to pin fin diameter ratio
- Lw/D :
-
Length of wing to pin fin diameter ratio
- Η :
-
System performance
- NACA:
-
National Advisory Committee for Aeronautics
- GA:
-
Genetic algorithm
- CFD:
-
Computational fluid dynamics
- HTPF:
-
Hydrothermal performance factor
- THP:
-
Thermo hydraulic performance
- PEC:
-
Performance evaluation criteria
- TPI:
-
Aero thermal performance index
- COE:
-
Coefficient of enhancement
- FOM:
-
Factor of merit
- PPFHS:
-
Plate-pin–fin heat sink
- PPFHS-P:
-
Plate-pin–fin heat sink with perforations
- PPFHS-S:
-
Plate-pin–fin heat sink with splitters
- PPFHS-PS:
-
Plate-pin–fin heat sink with perforations and splitters
- SFHSs:
-
Strip fin heat sinks
- MPF:
-
Micro pin fins
- BCC:
-
Body centred cubic
- PF:
-
Profit factor
- PPFI:
-
Percentage of profit factor increment
- C-GPFs:
-
Cylindrical grooved pin-fins
- T-GPFs:
-
Triangular grooved pin-fins
- HPFs:
-
Hexagonal pin fins
- CPFs:
-
Cylindrical pin fins
- Np:
-
Number of perforations
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Kesavan, D., Senthil Kumar, R. & Marimuthu, P. Heat transfer performance of air-cooled pin–fin heatsinks: a review. J Therm Anal Calorim 148, 623–649 (2023). https://doi.org/10.1007/s10973-022-11691-z
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DOI: https://doi.org/10.1007/s10973-022-11691-z