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Quantitative Simultaneous Determination for Young’s Modulus and Adhesion of Low-k Thin Film by Non-destructive CZM-SAW Technique

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Abstract

Adhesion and Young’s modulus are of great interest in thin film science because these two properties are the most vital factors in determining the durability and stability of the device. Insufficient Young’s modulus and adhesion property are the most serious problems encountered in the application of low-k thin film which is widely used in microelectronic industry. In this study, the nondestructive surface acoustic wave (SAW) technique with cohesive zone model (CZM) is employed to determine the quantitative thin film Young’s modulus and adhesion simultaneously. By studying the influence of film adhesion on the determination of film Young’s modulus, a film adhesion and Young’s modulus simultaneous measuring method is proposed. Based on the original CZM-SAW technique, comprehensive matching process is executed in this simultaneous measuring method. By this method, interactive effects of these two parameters are taken into consideration in the determining process so that more accurate adhesion and Young’s modulus results can be acquired. In this paper, the adhesion and Young’s modulus of SiO2 films and porous Black Diamond film are measured by the CZM-SAW technique. This study presents a high-precision measuring method for film adhesion and Young’s modulus. This paper also shows the promising advantages of the CZM-SAW technique in characterization of thin film properties.

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References

  1. Seo, H.J., Nam, S.H., Kim, S., Boo, J.H.: Organic and organic–inorganic hybrid polymer thin films deposited by PECVD using TEOS and cyclohexene for ULSI interlayer-dielectric application. Appl. Surf. Sci. 354, 134–138 (2015)

    Article  Google Scholar 

  2. Jin, F.Y., Chang, K.C., Chang, T.C., Tsai, T.M., Pan, C.H., Lin, C.Y., Chen, P.H., Chen, M.C., Huang, H.C., Lo, I., Zheng, J.C., Sze, S.M.: Reducing operation voltages by introducing a lowk switching layer in indium–tin-oxide-based resistance random access memory. Appl. Phys. Express 9, 061501 (2016)

    Article  Google Scholar 

  3. Shima, K., Tu, Y., Takamizawa, H., Shimizu, H., Momose, T., Inoue, K., Nagai, Y., Shimogaki, Y.: Role of W and Mn for reliable 1X nanometer-node ultra-large-scale integration Cu interconnects proved by atom probe tomography. Appl. Phys. Lett. 105, 133512 (2014)

    Article  Google Scholar 

  4. Cho, S.J., Bae, I.S., Jeong, H.D., Boo, J.H.: A study on electrical and mechanical properties of hybrid-polymer thin films by a controlled TEOS bubbling ratio. Appl. Surf. Sci. 254, 7817–7820 (2008)

    Article  Google Scholar 

  5. Vanstreels, K., Pantouvaki, M., Ferchichi, A., Verdonck, P., Conard, T., Ono, Y., Matsutani, M., Nakatani, K., Baklanov, M.R.: Effect of bake/cure temperature of an advanced organic ultra low-k material on the interface adhesion strength to metal barriers. J. Phys. D 109, 074301 (2011)

    Google Scholar 

  6. Chen, A., Mu, W.B., Chen, Y.: Compressive elastic moduli and polishing performance of non-rigid core/shell structured PS/SiO2 composite abrasives evaluated by AFM. Appl. Surf. Sci. 290, 433–439 (2014)

    Article  Google Scholar 

  7. Volinsky, A.A., Vella, J.B., Gerberich, W.W.: Fracture toughness, adhesion and mechanical properties of low-k dielectric thin films measured by nanoindentation. Thin. Solid. Films. 429, 201–210 (2003)

    Article  Google Scholar 

  8. Adhihetty, I.S., Vella, J.B., Volinsky, A.A., Goldberg, C., Gerberich, W.W.: Nanoscale Problems Symposium, Proceedings of 10th International Congress on Fracture, Honolulu, USA, December 2–6, 2001. Organized by W.W. Gerberich, R.H. Dauskardt, K. Tanaka.

  9. Kim, J., Kim, K.S., Kim, Y.H.: Mechanical effects in peel adhesion test. J. Adhes. Sci. Technol. 3, 175–187 (1999)

    Article  Google Scholar 

  10. Atanacio, A.J., Latella, B.A., Barbe, C.J., Swain, M.V.: Mechanical properties and adhesion characteristics of hybrid sol–gel thin films. Surf. Coat. Technol. 192, 354–364 (2005)

    Article  Google Scholar 

  11. Chow, G., Miller, P., Wang, J.: Correlation between laser-induced surface acoustic waves and nanoindentation on elastic modulus measurement of a nanoporous zeolite thin film. Exp. Mech. 55, 647–650 (2015)

    Article  Google Scholar 

  12. Baklanov, M.R., Denis, S.: Porous Polymers, pp. 206–207. Wiley, New York (2011)

    Google Scholar 

  13. Link, A., Sooryakumar, R., Bandhu, R.S., Antonelli, G.A.: Brillouin light scattering studies of the mechanical properties of ultrathin low-k dielectric films. J. Appl. Phys. 100, 013507 (2006)

    Article  Google Scholar 

  14. Okudur, O.O., Vanstreels, K., De, W.I., Hangen, U., Qiu, A.Q.: Substrate Independent elastic modulus of thin low dielectric constant materials. Adv. Eng. Mater. 19, 1600653 (2017)

    Article  Google Scholar 

  15. Park, T.S., Park, I.K., Yoshida, S.: Evaluation of the adhesion on the nano-scaled polymeric film systems. Ultrasonics. 76, 166–176 (2017)

    Article  Google Scholar 

  16. Bensalem, S., Amouri, C., Houari, H., Belachia, M.: Influence of recycled fines on the flexural creep of self-compacting concrete beams under four-point bending load. J. Adhes. Sci. Technol. 31, 1515–1523 (2017)

    Article  Google Scholar 

  17. Gee, C., Weddell, J.N., Swain, M.V.: Comparison of three and four point bending evaluation of two adhesive bonding systems for glass-ceramic zirconia bi-layered ceramics. Dent. Mater. 33, 1004–1011 (2017)

    Article  Google Scholar 

  18. Veysset, D., Maznev, A.A., Veres, I.A., Pezeril, T., Kooi, S.E., Lomonosov, A.M., Nelson, K.A.: Acoustical breakdown of materials by focusing of laser-generated Rayleigh surface waves. Appl. Phys. Lett. 111, 031901 (2017)

    Article  Google Scholar 

  19. Xiao, X., Shan, X.M., Kayaba, Y., Kohmora, K., Tanaka, H., Kikkawa, T.: Young’s modulus evaluation by SAWs for porous silica low-k film with cesium doping. Microelectron. Eng. 88, 666–670 (2011)

    Article  Google Scholar 

  20. Xiao, X., Qi, H.Y., Sui, X.L., Kikkawa, T.: Evaluation and criterion determination of the low-k thin film adhesion by the surface acoustic waves with cohesive zone model. Appl. Surf. Sci. 399, 599–607 (2017)

    Article  Google Scholar 

  21. Xiao, X., Qi, H.Y., Tao, Y., Kikkawa, T.: Study on the interfacial adhesion property of low-k thin film by the surface acoustic waves with cohesive zone model. Appl. Surf. Sci. 388, 448–454 (2016)

    Article  Google Scholar 

  22. Jenot, F., Fourez, S., Ouaftouh, M., Duquennoy, M.: Nondestructive testing of thin films using surface acoustic waves and laser ultrasonics. AIP Conf. Proc. 1949, 230031 (2018)

    Article  Google Scholar 

  23. Xiao, X., Hata, N., Yamada, K., Kikkawa, T.: Mechanical property determination of thin porous low-k films by twin-transducer laser generated surface acoustic waves. Jpn. J. Appl. Phys. 43, 508–513 (2004)

    Article  Google Scholar 

  24. Chen, Y.T., Liu, K.X.: Crack propagation in viscoplastic polymers: heat generation in near-tip zone and viscoplastic cohesive model. Appl. Phys. Lett. 106, 061908 (2015)

    Article  Google Scholar 

  25. Kubair, D.V., Spearing, S.M.: Cohesive zone model for direct silicon wafer bonding. J. Phys. D 40, 3070 (2007)

    Article  Google Scholar 

  26. Richter, F., Herrmann, M., Molnar, F., Chudoba, T., Schwarzer, N., Keunecke, M., Bewilogua, K., Zhang, X.W., Boyen, H.G., Ziemann, P.: Substrate influence in Young’s modulus determination of thin films by indentation methods: Cubic boron nitride as an example. Surf. Coat. Technol. 201, 3577–3587 (2006)

    Article  Google Scholar 

  27. Valier-Brasier, T., DeHoux, T., Audoin, B.: Scaled behavior of interface waves at an imperfect solid-solid interface. J. Appl. Phys. 112, 024904 (2012)

    Article  Google Scholar 

  28. Jansen, I., Schneider, D., Häßler, R.: Laser-acoustic, thermal and mechanical methods for investigations of bond lines. Int. J. Adhes. Adhes. 29, 210–216 (2009)

    Article  Google Scholar 

  29. Liu, Y.L., Xiao, X., Shan, X.M., Fu, S.C.: Young’s modulus detection for the low-k film by laser-generated SAWs. In: International Symposium on Photonics and Optoelectronics, Wuhan, China, pp. 69–72 (2009).

  30. Fujii, N., Kohmura, K., Nakayama, T., Tanaka, H., Hata, N., Seino, Y., Kikkawa, T.: Fabrication of mesoporous silica for ultra-low-k interlayer dielectrics. In: Nanofabrication: Technologies, Devices, and Applications II, Boston, United States, p. 60020N (2005).

  31. Schneider, D., Ollendorf, H., Schwarz, T.: Non-destructive evaluation of the mechanical behavior of TiN-coated steels by laser-induced ultrasonic surface waves. Appl. Phys. A 61, 277–284 (1995)

    Article  Google Scholar 

  32. Herrmann, M., Richter, F.: On the usage of the effectively shaped indenter concept for analysis of yield strength. J. Mater. Res. 24, 1258–1269 (2009)

    Article  Google Scholar 

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Acknowledgements

The authors are grateful to the support of National Science Foundation of China (Grant No. 61571319).

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  1. Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, School of Microelectronics, Tianjin University, Tianjin, 300072, China

    Haiyang Qi, Xia Xiao & Tao Kong

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  1. Haiyang Qi
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  2. Xia Xiao
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  3. Tao Kong
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Correspondence to Xia Xiao.

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Qi, H., Xiao, X. & Kong, T. Quantitative Simultaneous Determination for Young’s Modulus and Adhesion of Low-k Thin Film by Non-destructive CZM-SAW Technique. J Nondestruct Eval 38, 59 (2019). https://doi.org/10.1007/s10921-019-0597-2

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