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Thermal Conductance of Titanium Hot-Electron Bolometers with Different Microbridge Thicknesses

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Abstract

Hot-electron bolometers (HEBs) based on Johnson noise thermometry are potential terahertz detectors with high sensitivity and wide dynamic range. Understanding the thermal conductance of these detectors is crucial, as their sensitivity scales linearly with this property. In this paper, we focus on the experimental study of the thermal conductance of the titanium HEBs with different microbridge thicknesses ranging from 15 to 59 nm. We find that the thermal conductance of the HEBs takes a temperature power law of Tn, and the exponent n decreases from 3.4 to 2.8 as the microbridge thickness increases. The variation of the exponent n is mainly due to electron diffusion, which is not completely suppressed by superconducting contacts and is stronger in thick microbridges. In addition, we observed that the thermal radiation from the low-noise amplifier for Johnson noise readout may raise the electron temperature by about 30 mK at the bath temperature of 0.25 K, giving an excessive thermal conductance.

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Data Availability

The data that support the findings of this study are available from the corresponding author upon reasonable request.

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Acknowledgements

This work is supported in part by NSFC under Grant Nos. 11873099, 11922308, and U1931123, in part by CAS under Grant GJJSTD20210002, in part by the National Key R&D Program of China under Grant 2018YFA0404701, and in part by the CAS Key Lab for Radio Astronomy.

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Authors and Affiliations

  1. Purple Mountain Observatory, CAS, Nanjing, 210033, China

    F. M. Li, W. Miao, Q. H. Luo, H. Gao, Z. Wang, K. M. Zhou, J. Q. Zhong, Y. Ren, W. Zhang & S. C. Shi

  2. University of Science and Technology of China, Hefei, 230026, China

    F. M. Li, Q. H. Luo & H. Gao

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  1. F. M. Li
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  2. W. Miao
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  3. Q. H. Luo
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  7. J. Q. Zhong
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  9. W. Zhang
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Li, F.M., Miao, W., Luo, Q.H. et al. Thermal Conductance of Titanium Hot-Electron Bolometers with Different Microbridge Thicknesses. J Low Temp Phys 211, 248–254 (2023). https://doi.org/10.1007/s10909-022-02937-z

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