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Increasing the Strength of Soldered Joints by Introducing Carbon Nanotubes into Soldering Pastes

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Journal of Engineering Physics and Thermophysics Aims and scope

An increase in the strength of soldered joints obtained by reflow soldering pastes based on lead-free solders by introducing carbon nanotubes into the composition of pastes by means of ultrasonic vibrations has been achieved. The influence of the content of carbon nanotubes in the paste on the mechanical properties of soldered joints and the solderability of coatings of electronic components has been studied.

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References

  1. Lee Ning-Cheng, The Technology of Reflow Soldering, Search and Elimination of Depects: Surface Mounting, BGA-, CSP-, and Flip-Chip Technologies [Russian translation], Tekhnologii, Moscow (2006).

  2. V. N. Popov, Carbon nanotubes: Properties and applications, Mater. Sci. Eng.; R. Rep., 43, No. 3, 61–102 (2004).

  3. I. V. Sukhno and V. Yu. Buz’ko, Carbon Nanotubes, Pt. 1. High-Technology Applications [in Russian], KubGU, Krasnodar (2008).

  4. A. Novikov, Application of nanostructured materials in the technology of connections, Tekhnol. Élektron. Prom., No. 5, 65–67 (2012).

  5. A. R. Gataullin, M. S. Frantsuzova, S. A. Bogdanova, and Yu. G. Galyametdinov, Dispersion of single-wall carbon nanotubes and fullerenes C60 in water and aqueous solutions of surfactants, Vestn. Kazansk. Tekhnol. Univ., No. 10, 54–57 (2011).

  6. Kai-kai Xu, L. Zhang, L. Sun, N. Jiang, M. Zhao, and M.-Y. Xiohg, The influence of carbon nanotubes on the properties of Sn solder, Mater. Trans., 61, No. 4, 718–722 (2020).

    Article  Google Scholar 

  7. V. Lanin and I. Sergachev, Economical induction heating for soldering in the magnetic circuit gap, Tekhnol. Élektron. Prom., No. 8, 48–52 (2017).

  8. V. Lanin, I. Pashuk, and Yu. Barannikov, Evaluation of the solderability of electcroplated coatings of electronic components and parts, Proizvod. Élektron., No. 4, 114–119 (2015).

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Authors and Affiliations

  1. LLC “Advanced Research and Technologies”, 1 Sovkhoznaya Str., Village Leskovka, 223058, Minsk Region, Minsk District, Belarus

    S. A. Zhdanok & A. V. Krauklis

  2. Belarusian State University of Informatics and Radioelectronics, 6 P. Brovka Str., 220013, Minsk, Belarus

    V. L. Lanin

  3. JSC “INTEGRAL”, 121A Kazinets Str., 220108, Minsk, Belarus

    V. A. Emel’yanov

Authors
  1. S. A. Zhdanok
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  2. V. L. Lanin
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  3. V. A. Emel’yanov
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  4. A. V. Krauklis
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Corresponding author

Correspondence to V. L. Lanin.

Additional information

Translated from Inzhenerno-Fizicheskii Zhurnal, Vol. 95, No. 6, pp. 1465–1470, November–December, 2022.

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Zhdanok, S.A., Lanin, V.L., Emel’yanov, V.A. et al. Increasing the Strength of Soldered Joints by Introducing Carbon Nanotubes into Soldering Pastes. J Eng Phys Thermophy 95, 1437–1442 (2022). https://doi.org/10.1007/s10891-022-02612-w

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  • DOI: https://doi.org/10.1007/s10891-022-02612-w

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