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Development of high performance 2.5D packaging using glass interposer with through glass vias

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Abstract

2.5D interposer technology has gotten a lot of attention as a viable solution to high IO density, cost, and performance challenges. Glass is a potential choice as an interposer material in an integrated package, with low dielectric loss and simple processing, it can be a low-cost alternative to silicon interposer. In this paper, a 2.5D package using glass interposer with a size of 10 mm × 15 mm × 0.8 mm is developed. The interposer with through glass via (TGV) technology simplifies the process and dramatically reduces manufacturing costs, which is especially important for the system in package. Several key processes are developed and discussed. To optimize the wafer level warpage problem, finite element modeling is used to simulate the warpage of glass wafers and optimize the process parameters and material parameters. Finally, the package level reliability tests are conducted on the 2.5D packages, after pro-conditional level 3 and temperature cycling tests, and the final packages pass the reliability tests without significant failure mode, which provides an important reference value for the subsequent mass-production of the TGV interposer.

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Data availability

The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.

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Acknowledgements

This Research is supported by the National Natural Science Foundation of China (Grant Nos. 6197412). We gratefully thank the great support from the engineering teams within Xiamen Sky Semiconductor Technology Co., Ltd.

Funding

National Natural Science Foundation of China, 61974121, Daquan Yu.

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Authors and Affiliations

  1. Faculty of Materials and Manufacturing, Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, 100124, China

    Jin Zhao & Fei Qin

  2. School of Electronic Science and Engineering, Xiamen University, Xiamen, 361005, China

    Daquan Yu

  3. Loongson Technology, Beijing, 100089, China

    Zuohuan Chen

  4. Xiamen Sky Semiconductor Technology Co., Ltd, Xiamen, 361005, China

    Daquan Yu

Authors
  1. Jin Zhao
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  2. Zuohuan Chen
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  3. Fei Qin
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  4. Daquan Yu
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Contributions

Conceptualization and patent, JZ and FQ; investigation, JZ and ZC; package structure design and fabrication, JZ and DY; reliability analysis, JZ; writing—original draft preparation, JZ; writing—review and editing, FQ, DY and ZC; supervision, DY; project administration, DY All authors have read and agreed to the published version of the manuscript. All authors read and approved the final manuscript.

Corresponding authors

Correspondence to Fei Qin or Daquan Yu.

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Competing interest

This work was supported by the National Natural Science Foundation of China (Grant No. 61974121).

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This research does not involve Human Participants and/or Animals.

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Zhao, J., Chen, Z., Qin, F. et al. Development of high performance 2.5D packaging using glass interposer with through glass vias. J Mater Sci: Mater Electron 34, 1790 (2023). https://doi.org/10.1007/s10854-023-11185-0

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