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Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In–48at.%Sn solders

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Abstract

This study investigated the interfacial reactions of Co with molten In and eutectic In–48at.%Sn solders at different temperatures. For the In/Co reactions at 350 °C, the intermetallic compound (IMC) of CoIn3 was formed with a uniform and dense structure. It exhibited a unique linear growth with aging time, suggesting that the CoIn3 formation was reaction-controlled. In the eutectic In–Sn/Co reactions at 350 °C, the formed Co(Sn,In)2 phase also displayed a linear growth and its growth rate (~ 5 μm/h) was higher than that of the In/Co reactions (~ 2 μm/h). Moreover, in these two interfacial systems, both the CoIn3 and Co(Sn,In)2 IMCs revealed the so-called cruciform pattern, which is the important feature of the reaction-controlled linear growth. It was the first time to find the special linear growths in the Co/In and In–48at.%Sn/Co reactions. The reactions were carried out at lower temperatures and the microstructures of the reaction phases had a significant change. In the In/Co reactions at 250 °C, the CoIn3 showed a microstructure of isolated particulates and a significant grain coarsening occurred due to the Ostwald ripening. At 180 °C, the CoIn3 grains was unstable at the interface and drastically spalled into the molten In. A similar phenomenon and the microstructural evolutions were also observed in the eutectic In–Sn/Co reactions. It was attributed to the fact that the diffusion and dissolution of the formed phase became dominant at lower reaction temperatures. Based on the detailed results, the correlated reaction mechanism was discussed in detail.

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Data availability

The datasets generated during the current study are available from the corresponding author on reasonable request.

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Acknowledgements

This work was financially supported by Ministry of Science and Technology of Taiwan (MOST 109-2221-E-194-007).

Funding

This work was financially supported by Ministry of Science and Technology, Taiwan [Grant No. MOST 109-2221-E-194-007].

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Authors and Affiliations

  1. Department of Chemical Engineering, National Chung Cheng University, Chia-yi, 62102, Taiwan

    Chao-hong Wang & Tai-Yu Chang

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  1. Chao-hong Wang
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Contributions

All authors contributed to the conception and design of this study and data interpretation. Material preparation, data collection and analysis were performed by T-YC. The original draft of the manuscript was written by C-hW.

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Correspondence to Chao-hong Wang.

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Wang, Ch., Chang, TY. Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In–48at.%Sn solders. J Mater Sci: Mater Electron 33, 12321–12333 (2022). https://doi.org/10.1007/s10854-022-08190-0

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