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Viscoplastic behavior of bulk solder material under cyclic loading and compression of spherical joint-scale granules

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Abstract

The viscoplastic behavior of solder material is investigated from different scales. Due to the thermal stress in Sn–3.0Ag–0.5Cu alloy at elevated temperatures, the continuous accumulation of unrecoverable deformation becomes the key of interconnections failure in microelectronic packaging. In the current study, the rate and temperature dependence of inelastic deformation and cyclic hardening properties of Sn–3.0Ag–0.5Cu alloy under different loading conditions are studied. A novel phenomenological constitutive model is developed to describe the deformation of lead-free solder interconnections in the microelectronic packaging. The developed model is verified by comparing with the experimental data of bulk solder materials. The results show that the proposed model can accurately describe the viscoplastic properties of bulk solder materials and shows excellent numerical stability. For understanding better the overall deformation behaviors of solder joins, especially the strain–stress relationship, uniaxial compression experiments of spherical joint-scale granules were conducted under different loading rates. The developed model is applied to simulate the compression testing of granules. It shows that the developed model can characterize the viscoplastic compression deformation of Sn–3.0Ag–0.5Cu solder on joint-scale with reasonable accuracy.

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Acknowledgements

This work was supported by the Natural Science Foundation of Jiangsu Province (Grant No. BK20190437), the Fundamental Research Funds for the Central Universities (Grant No. 30920021147), NUPTSF (Grant No. NY220131), the National Natural Science Foundation of China (No. 11772257) and the open research fund of the National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology.

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Authors and Affiliations

  1. School of Science, Nanjing University of Science and Technology, Nanjing, 210094, People’s Republic of China

    Xu He & Yawei Dong

  2. Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang, 621999, People’s Republic of China

    Shaobing Wang & Yuexing Wang

  3. National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology, College of Electronic and Optical Engineering & College of Microelectronics, Nanjing University of Posts and Telecommunications, Nanjing, 210023, People’s Republic of China

    Lu Liu

  4. School of Mechanics and Civil Engineering, Northwestern Polytechnical University, Xi’an, 710072, People’s Republic of China

    Yao Yao

  5. School of Civil Engineering, Xi’an University of Architecture and Technology, Xi’an, 710055, People’s Republic of China

    Yao Yao

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  1. Xu He
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  2. Shaobing Wang
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  3. Yuexing Wang
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  4. Lu Liu
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Correspondence to Xu He or Shaobing Wang.

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He, X., Wang, S., Wang, Y. et al. Viscoplastic behavior of bulk solder material under cyclic loading and compression of spherical joint-scale granules. J Mater Sci: Mater Electron 32, 20640–20650 (2021). https://doi.org/10.1007/s10854-021-06573-3

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