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Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications

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Abstract

The suitability of Ni–Sn combination paste as a transient liquid phase sintering (TLPS) bonding material for applications in high-temperature power electronic technologies was investigated. The microstructure and mechanical properties of joints bonded through TLPS with a Sn-30 wt% Ni paste were investigated at varying bonding temperatures (250, 270, 300, and 350 °C) and times using field-emission scanning electron microscopy, field-emission transmission electron microscopy, electron probe micro-analyzer, differential scanning calorimetry, and X-ray diffraction analyses. The results indicated that Ni and Sn reacted and bonded quickly to form Ni–Sn intermetallic compounds, which primarily consisted of Ni3Sn4 and residual Ni particles. The mechanical strength analysis results show that the shear strength values of the joints tended to increase as the bonding temperature increased. As Ni3Sn4 reacted with Ni particles, the joints achieved a stable and dense microstructure. The shear strength values were determined to be 47.9 MPa (300 °C) and 41.4 MPa (350 °C) for 15 and 5 min, respectively. Furthermore, the shear strength value saturated at a bonding temperature of 350 °C for a bonding duration of 5 min.

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Authors and Affiliations

  1. Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH), 156 Gaetbeol-ro, Yeonsu-gu, Incheon, 21999, Korea

    So-Eun Jeong

  2. School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Gyeonggi-do, Suwon, 16419, Korea

    So-Eun Jeong & Seung-Boo Jung

  3. Department of Advanced Materials Engineering, Chungbuk National University, 1 Chungdae-ro, Seowon-gu, Chungbuk, Cheongju, 28644, Korea

    Jeong-Won Yoon

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  1. So-Eun Jeong
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  2. Seung-Boo Jung
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  3. Jeong-Won Yoon
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Correspondence to Seung-Boo Jung or Jeong-Won Yoon.

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Jeong, SE., Jung, SB. & Yoon, JW. Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications. J Mater Sci: Mater Electron 31, 15048–15060 (2020). https://doi.org/10.1007/s10854-020-04068-1

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  • DOI: https://doi.org/10.1007/s10854-020-04068-1

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