Skip to main content
SpringerLink
Log in

Impurity-induced unusual microstructural evolution and mechanical property in Sn/Cu solder joints

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

The use of functional additives in the electroplating process results in an impurity incorporation in the Cu plated layer. A high level of impurity residual has been recognized as a severe reliability problem to the Sn/Cu joints because voids are prone to form at the Sn/Cu interface in the thermal aging process. This study focuses on the effect of aging temperature on the formation and distribution of voids. Two electroplated Cu substrates and one rolled Cu foil were joined Sn balls to prepare the Sn/Cu joints for thermal aging in the range of 100–200 °C. The microstructural examination results indicated that the additive formula of polyethylene glycol (PEG) and Cl− resulted in massive void formation at the Sn/Cu interface, and the distribution of voids showed a strong dependence on the aging temperature. The strong temperature dependence of void distribution led to an unusual evolution of microstructure and shear strength in the Sn/Cu joints.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

Similar content being viewed by others

References

  1. J.R. Davis, Copper and Copper Alloys, 1st edn. (ASM International, Materials Park, OH, 2001), pp. 127–152

    Google Scholar 

  2. K.K. Chakravorty, C.P. Chien, J.M. Cech, M.H. Tanielian, P.L. Young, IEEE Trans. Comp., Hybrids, Manuf. Technol. 13, 200 (1990)

    Article  Google Scholar 

  3. X. Ye, M. De Bonte, J.P. Celis, J.R. Roos, J. Electrochem. Soc. 139, 1592 (1992)

    Article  Google Scholar 

  4. T. Kobayashi, J. Kawasaki, K. Mihara, H. Honma, Electrochim. Acta 47, 85 (2001)

    Article  Google Scholar 

  5. D. Josell, T.P. Moffat, J. Electrochem. Soc. 165, D23 (2018)

    Article  Google Scholar 

  6. Z.V. Feng, X. Li, A.A. Gewirth, J. Phys. Chem. B 107, 9415 (2003)

    Article  Google Scholar 

  7. Y.D. Chiu, W.P. Dow, J. Electrochem. Soc. 160, D3021 (2013)

    Article  Google Scholar 

  8. M. Tan, C. Guymon, D.R. Wheeler, J.N. Harb, J. Electrochem. Soc. 154, D78 (2007)

    Article  Google Scholar 

  9. Y. Jin, Y. Sui, L. Wen, F. Ye, M. Sun, Q. Wang, J. Electrochem. Soc. 160, D20 (2013)

    Article  Google Scholar 

  10. S.W. Chen, C.M. Chen, W.C. Liu, J. Electron. Mater. 27, 1193 (1998)

    Article  Google Scholar 

  11. C.P. Lin, C.M. Chen, Y.W. Yen, J. Alloys Compd. 591, 297 (2014)

    Article  Google Scholar 

  12. J.Y. Wu, H. Lee, C.H. Wu, C.F. Lin, W.P. Dow, C.M. Chen, J. Electrochem. Soc. 161, D522 (2014)

    Article  Google Scholar 

  13. H.K. Cheng, C.W. Huang, H. Lee, Y.L. Wang, T.F. Liu, C.M. Chen, J. Alloys Compd. 622, 529 (2015)

    Article  Google Scholar 

  14. S. Kumar, C.A. Handwerker, M.A. Dayananda, J. Phase Equilib. Diff. 32, 309 (2011)

    Article  Google Scholar 

  15. J.Y. Kim, J. Yu, S.H. Kim, Acta Mater. 57, 5001 (2009)

    Article  Google Scholar 

  16. S.H. Kim, J. Yu, J. Mater. Res. 25, 1854 (2010)

    Article  Google Scholar 

  17. P. Borgesen, L. Yin, P. Kondos, Microelectron. Reliab. 52, 1121 (2012)

    Article  Google Scholar 

  18. J. Yu, J.Y. Kim, Acta Mater. 56, 5514 (2008)

    Article  Google Scholar 

  19. Y. Liu, J. Wang, L. Yin, P. Kondos, C. Parks, P. Borgesen, D.W. Henderson, E.J. Cotts, N. Dimitrov, J. Appl. Electrochem. 38, 1695 (2008)

    Article  Google Scholar 

  20. T.Y. Yu, H. Lee, H.L. Hsu, W.P. Dow, H.K. Cheng, K.C. Liu, C.M. Chen, J. Electrochem. Soc. 163, D734 (2016)

    Article  Google Scholar 

  21. H. Lee, T.Y. Yu, H.K. Cheng, K.C. Liu, P.F. Chan, W.P. Dow, C.M. Chen, J. Electrochem. Soc. 164, D457 (2017)

    Article  Google Scholar 

  22. C.C. Chen, C.H. Yang, Y.S. Wu, C.E. Ho, Surf. Coat. Technol. 320, 489 (2017)

    Article  Google Scholar 

  23. P.T. Lee, Y.S. Wu, P.C. Lin, C.C. Chen, W.Z. Hsieh, C.E. Ho, Surf. Coat. Technol. 320, 559 (2017)

    Article  Google Scholar 

  24. Y. Liu, L. Yin, S. Bliznakov, P. Kondos, P. Borgesen, D.W. Henderson, C. Parks, J. Wang, E.J. Cotts, N. Dimitrov, IEEE Trans. Compon. Pack. Technol. 33, 127 (2010)

    Article  Google Scholar 

  25. L. Yin, P. Borgesen, J. Mater. Res. 26, 455 (2011)

    Article  Google Scholar 

  26. K. Zeng, R. Stierman, T.C. Chiu, D. Edwards, K. Ano, K.N. Tu, J. Appl. Phys. 97, 024508 (2005)

    Article  Google Scholar 

  27. Y.J. Chen, C.K. Chung, C.R. Yang, C.R. Kao, Microelectron. Reliab. 53, 47 (2013)

    Article  Google Scholar 

Download references

Acknowledgements

This work is supported by the Ministry of Science and Technology of Taiwan through Grant No. MOST-105-2221-E-005-087.

Author information

Authors and Affiliations

  1. Department of Chemical Engineering, National Chung Hsing University, Taichung, 402, Taiwan

    Hsuan-Ling Hsu, Hsuan Lee, Ping-Heng Wu & Chih-Ming Chen

  2. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan

    Yee-Wen Yen

Authors
  1. Hsuan-Ling Hsu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Hsuan Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Ping-Heng Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yee-Wen Yen
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Chih-Ming Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Chih-Ming Chen.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Hsu, HL., Lee, H., Wu, PH. et al. Impurity-induced unusual microstructural evolution and mechanical property in Sn/Cu solder joints. J Mater Sci: Mater Electron 29, 12842–12849 (2018). https://doi.org/10.1007/s10854-018-9403-7

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-018-9403-7

Search

Navigation