Skip to main content
SpringerLink
Log in

Dependence of grain orientation in SABI333 solder joints on solidification temperature

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Electron backscattered diffraction was employed to observe the orientations of as-solidified Sn3.0Ag3.0Bi3.0In (SABI333) joints. Unlike other Sn-based solder joints consisting of only one grain or of tricrystals, the SABI333 joints typically consisted of polycrystals. The polycrystals were found to originate from Sn grains with deflections (> 15°) from the [110] and [\(1\bar {1}0\)] directions, i.e., the directions in which nucleation tends to occur, and the Bi and In atoms dissolved in the SnAg melt significantly enhanced the deflection. In addition, the orientations of the SABI333 solder joints were highly related to the solidification temperature. Higher solidification temperatures were associated with higher degrees of deviation. Additionally, two types of double tricrystals of Sn formed during solder joint solidification in the SABI333 joints. Although the characteristics of the twinning differed, both types had 80°–90° misorientations. One system featured four orientations of Sn grain twinning with a [100] or [010] axis, while the other one featured perpendicular tricrystals.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9

Similar content being viewed by others

References

  1. P. Darbandi, T.R. Bieler, F. Pourboghrat, T.K. Lee, The effect of cooling rate on grain orientation and misorientation microstructure of SAC105 solder joints before and after impact drop tests. J. Electron. Mater. 43, 2521–2529 (2014)

    Article  Google Scholar 

  2. T.K. Lee, B. Zhou, L. Blair, K.C. Liu, T.R. Bieler, Sn–Ag–Cu solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using orientation imaging microscopy. J. Electron. Mater. 39, 2588–2597 (2010)

    Article  Google Scholar 

  3. B. Zhou, T.R. Bieler, T.K. Lee, K.C. Liu, Crack development in a low-stress PBGA package due to continuous recrystallization leading to formation of orientations with 001 parallel to the interface. J. Electron. Mater. 39, 2669–2679 (2010)

    Article  Google Scholar 

  4. M.L. Huang, J.F. Zhao, Z.J. Zhang, N. Zhao, Dominant effect of high anisotropy in β-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu interconnect. J. Alloys Compd. 678, 370–374 (2016)

    Article  Google Scholar 

  5. M.L. Huang, J.F. Zhao, Z.J. Zhang, N. Zhao, Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration. Acta Mater. 100, 98–106 (2015)

    Article  Google Scholar 

  6. J. Han, F. Guo, J.P. Liu, Effects of anisotropy of tin on grain orientation evolution in Pb-free solder joints under thermomechanical stress. J. Mater. Sci. Mater. Electron. 28, 6572–6582 (2017)

    Article  Google Scholar 

  7. J. Han, F. Guo, J.P. Liu, Recrystallization induced by subgrain rotation in Pb-free BGA solder joints under thermomechanical stress. J. Alloys Compd. 698, 706–713 (2017)

    Article  Google Scholar 

  8. L.P. Lehman, Y. Xing, T.R. Bieler, Cyclic twin nucleation in tin-based solder alloys. Acta Mater. 58, 3546–3556 (2010)

    Article  Google Scholar 

  9. S.E. Battersby, R.F. Cochrane, A.M. Mullis, Growth velocity-undercooling relationships and microstructural evolution in undercooled Ge and dilute Ge–Fe alloys. J. Mater. Sci. 34, 2049–2056 (1999)

    Article  Google Scholar 

  10. G. Parks, A. Faucett, C. Fox, J. Smith, E.J. Cotts, The nucleation of Sn in undercooled melts: the effect of metal impurities. JOM 66, 2311–2319, (2014)

    Article  Google Scholar 

  11. B. Arfaei, M. Benedict, E.J. Cotts, Nucleation rates of Sn in undercooled Sn–Ag–Cu flip-chip solder joints. J. Appl. Phys. 114, 173506 (2013)

    Article  Google Scholar 

  12. C.M. Gourlay, S.A. Belyakov, Z.L. Ma, J.W. Xian, Nucleation and growth of tin in Pb-free solder joints. JOM 67, 2383–2393, (2015)

    Article  Google Scholar 

  13. Y. Kim, S. Nagao, T. Sugahara, K. Suganuma, M. Ueshima, H.J. Albrecht, K. Wilke, J. Strogies, Enhanced reliability of Sn–Ag–Bi–In joint under electric current stress by adding Co/Ni elements. J. Mater. Sci. Mater. Electron. 25, 3090–3095 (2014)

    Article  Google Scholar 

  14. Y. Kim, S. Nagao, T. Sugahara, K. Suganuma, M. Ueshima, H.J. Albrecht, K. Wilke, J. Strogies, Refinement of the microstructure of Sn–Ag–Bi–In solder, by addition of SiC nanoparticles, to reduce electromigration damage under high electric current. J. Electron. Mater. 43, 4428–4434 (2014)

    Article  Google Scholar 

  15. R. Dudek, R. Doring, B. Michel, Reliability prediction of area array solder joints. ASME Trans. 125, 562–570 (2003)

    Article  Google Scholar 

  16. A.U. Telang, T.R. Bieler, Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn-3.5Ag solder joint specimens. Scripta Mater. 52, 1027–1031 (2005)

    Article  Google Scholar 

  17. D.W. Henderson, J.J. Woods, T.A. Gosselin, J. Bartelo, D.E. King, T.M. Korhonen, M.A. Korhonen, L.P. Lehman, E.J. Cotts, S.K. Kang, P. Lauro, D.Y. Shih, C. Goldsmith, K.J. Puttlitz, The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue. J. Mater. Res. 19, 1608–1612 (2004)

    Article  Google Scholar 

  18. L.P. Lehman, S.N. Athavale, T.Z. Fullem, A.C. Giamis, R.K. Kinyanjui, M. Lowenstein, K. Mather, R. Patel, D. Rae, J. Wang, Y. Xing, L. Zavalij, P. Borgesen, E.J. Cotts, Growth of Sn and intermetallic compounds in Sn–Ag–Cu solder. J. Electron. Mater. 33, 1429–1439 (2004)

    Article  Google Scholar 

  19. J. Han, F. Guo, J.P. Liu, Early stages of localized recrystallization in Pb-free BGA solder joints subjected to thermomechanical stress. J. Alloys Compd. 704, 574–584 (2017)

    Article  Google Scholar 

  20. J. Han, S.H. Tan, F. Guo, Study on subgrain rotation behavior at different interfaces of a solder joint during thermal shock. J. Electron. Mater. 45, 6086–6094 (2016)

    Article  Google Scholar 

Download references

Funding

This study was funded by the National Natural Science Foundation of China (Grant No. 51401006), the Natural Science Foundation of Beijing Municipality (Grant Nos. 2162005 and 2172009) and the Science and Technology Project of Beijing Municipal Commission of Education (Grant No. KM201710005003).

Author information

Authors and Affiliations

  1. College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China

    Jing Han, Jian Sun, Tingyu Wen & Fu Guo

Authors
  1. Jing Han
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jian Sun
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Tingyu Wen
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Fu Guo
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jing Han.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Han, J., Sun, J., Wen, T. et al. Dependence of grain orientation in SABI333 solder joints on solidification temperature. J Mater Sci: Mater Electron 29, 12221–12230 (2018). https://doi.org/10.1007/s10854-018-9333-4

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-018-9333-4

Search

Navigation