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Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity

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Abstract

The microporous corrosion is the main surface failure mechanism of gold-plated components. The microporous corrosion behavior of electroless nickel and immersion gold (ENIG)-plated printed circuit boards (PCBs) in Turpan area which has an atmospheric environment with high salinity was investigated via a field exposure method for 24 months, as well as 3D analysis, FIB technology, composition analysis, and electrochemical impedance spectroscopy and corrosion mechanism model. After 6 months of exposure, the corrosion products filled up the pores and clustered on the surface as mound shape, and a possible corrosion mechanism model was displayed in the study after 24 months of exposure. The results showed that PCB-ENIG mainly suffered microporous corrosion in a high salinity atmospheric environment. The pores on the gold-plated coating were location where corrosion occurred first and the corrosion products were mostly oxides, chlorides, sulfates and carbonates of copper and nickle.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (Nos. 51671027, 51771027 and 51271032), the National Basic Research Program of China (973 Program, No. 2014CB643300), and the National Environmental Corrosion Platform (NECP).

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Author notes

  1. Kui Xiao and Ziheng Bai have contributed equally to this study.

Authors and Affiliations

  1. Corrosion and Protection Center, University of Science and Technology Beijing, Beijing, 100083, People’s Republic of China

    Kui Xiao, Ziheng Bai, Lidan Yan, Pan Yi, Chaofang Dong, Junsheng Wu, Yuting Hu, Ruilin Xiong & Xiaogang Li

  2. Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, People’s Republic of China

    Kui Xiao, Ziheng Bai, Lidan Yan, Pan Yi, Chaofang Dong, Junsheng Wu, Yuting Hu, Ruilin Xiong & Xiaogang Li

  3. Ningbo Institute of Material Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, Zhejiang, People’s Republic of China

    Xiaogang Li

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  1. Kui Xiao
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  2. Ziheng Bai
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Correspondence to Kui Xiao.

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Xiao, K., Bai, Z., Yan, L. et al. Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity. J Mater Sci: Mater Electron 29, 8877–8885 (2018). https://doi.org/10.1007/s10854-018-8905-7

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  • DOI: https://doi.org/10.1007/s10854-018-8905-7

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