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Ultra-low sintering temperature ceramics for LTCC applications: a review

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Abstract

During past over 30 years, low temperature co-fired ceramic (LTCC) technology has been developed to meet with the requirements of small, light weight and multifunctional electronic components through enabling fabrication of three-dimensional ceramic modules with low dielectric loss and embedded silver electrode. A recent technology is to develop new dielectrics with ultra-low sintering temperature (usually <650 °C) to save energy, reduce processing time, and to enable further integrations with semiconductors, metals or even plastics. In this review, we summarized the materials with ultra-low sintering temperature developed in past over 10 years, which will be helpful for those researchers to not only develop new materials but also improve all technologies in ultra-LTCC fields.

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Acknowledgments

This review is one of invited paper for the special issue of JMSE Electronic Materials for Harsh Environments. All authors acknowledge those scientists who contributed to LTCC technology to save power energy. Acknowledgements are given also to the State Key Laboratory of Electronic Thin films and Integrated Devices of China for the project support (KFJJ201207).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Southwest University of Science and Technology, Mianyang, 621010, China

    Hongtao Yu & Jingsong Liu

  2. State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, China

    Wanli Zhang & Shuren Zhang

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  1. Hongtao Yu
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  2. Jingsong Liu
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Correspondence to Jingsong Liu.

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Yu, H., Liu, J., Zhang, W. et al. Ultra-low sintering temperature ceramics for LTCC applications: a review. J Mater Sci: Mater Electron 26, 9414–9423 (2015). https://doi.org/10.1007/s10854-015-3282-y

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