Skip to main content
SpringerLink
Log in

Effect of dispersion condition of multi-walled carbon nanotube (MWNT) on bonding properties of solderable isotropic conductive adhesives (ICAs)

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Carbon nanotubes have been considered as reinforcements in composite materials because of their exceptional mechanical, electrical, and thermal properties. In this paper, the effect of dispersion conditions of multi-walled carbon nanotubes (MWNTs) on bonding properties of solderable isotropic conductive adhesives (ICA) was investigated. Two types of ICAs, untreated pristine MWNT-filled ICAs and acid-treated MWNT (a-MWNT)-filled ICAs were formulated with 1 wt% MWNTs and 83 wt% low-melting-point alloy (LMPA) fillers. X-ray photoelectron spectroscopy analysis was conducted to characterize the surface chemical states of pristine and a-MWNTs and verify the effectiveness of a-MWNTs. The fracture surface of the polymer matrix and solderable ICAs with a-MWNTs showed good dispersion conditions through field-emission scanning electron microscope. After the interconnection process, the a-MWNT-filled solderable ICA showed uniform dispersion of MWNTs in the polymer matrix and formed a stable metallurgical conduction path because of the good rheology-coalescence-wetting behavior of LMPA. Alternatively, pristine MWNT-filled ICA showed poor dispersion and an unstable conduction path formed by aggregated MWNTs.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13

Similar content being viewed by others

References

  1. H. Wolfson, G. Elliot, US Patent 2774747, published 18 December (1956)

  2. Y. Li, C.P. Wong, Mater. Sci. Eng. R 51, 1–35 (2006)

    Article  Google Scholar 

  3. H.K. Kim, F.G. Shi, Microelectron. J. 32, 315–321 (2001)

    Article  Google Scholar 

  4. D. Wojciechowski, J. Vanfleteren, E. Reese, H.W. Hagendorn, Microelectron. Reliab. 40, 1215–1226 (2000)

    Article  Google Scholar 

  5. Z. Wu, J. Li, D. Timmer, K. Lozano, S. Bose, Int. J. Adhes. Adhes. 29, 488–494 (2009)

    Article  Google Scholar 

  6. D.D. Lu, Y.G. Li, C.P. Wong, J. Adhes. Sci. Technol. 22, 815–834 (2008)

    Article  Google Scholar 

  7. J. Liu, Conductive adhesives for electronics packaging, 1st edn. (Electrochemical Publications LTD, Port Erin, 1999), pp. 2–13

    Google Scholar 

  8. D.D. Lu, C.P. Wong, J. Adhes. Sci. Technol. 22, 835–851 (2008)

    Article  Google Scholar 

  9. M.J. Yim, K.W. Paik, Int. J. Adhes. Adhes. 26, 304–313 (2006)

    Article  Google Scholar 

  10. A. Seppealea, E. Ristolainen, Microelectron. Reliab. 44, 639–648 (2004)

    Article  Google Scholar 

  11. M. Zwolinski, J. Hickman, H. Rubin, Y. Zaks, S. McCarthy, T. Hanlon, P. Arrowsmith, A. Chaudhuri, R. Harmansen, S. Lau, D. Napp, IEEE Trans. Compon. Packaging Manuf. Technol. Part C 19, 241–250 (1996)

    Article  Google Scholar 

  12. B.S. Yim, J.M. Kim, S.H. Jeon, S.H. Lee, J.H. Kim, J.G. Han, M.H. Cho, Mater. Trans. 50, 2649–2655 (2009)

    Article  Google Scholar 

  13. Y. Zhou, M.I. Jeelani, S. Jeelani, Mater. Sci. Eng. A 506, 39–44 (2009)

    Article  Google Scholar 

  14. W. Bauhofer, J.Z. Kovacs, Compos. Sci. Technol. 69, 1486–1498 (2009)

    Article  Google Scholar 

  15. P.C. Ma, B.Z. Tang, J.K. Kim, Carbon 46, 1497–1505 (2008)

    Article  Google Scholar 

  16. H.P. Wu, X.J. Wu, M.Y. Ge, G.Q. Zhang, Y.W. Wang, J. Jiang, Compos. Sci. Technol. 67, 1182–1186 (2007)

    Article  Google Scholar 

  17. F. Marcq, P. Demont, P. Monfraix, A. Peigney, C. Laurent, T. Falat, F. Courtade, T. Jamin, Microelectron. Reliab. 51, 1230–1234 (2011)

    Article  Google Scholar 

  18. H. Jiang, M.J. Yim, W. Lin, C.P. Wong, IEEE Trans. Compon. Packaging Technol. 32, 754–758 (2009)

    Article  Google Scholar 

  19. B.S. Yim, J.M. Kim, Mater. Trans. 51, 2329–2331 (2010)

    Article  Google Scholar 

  20. J. Shen, W. Huang, L. Wu, Y. Hu, M. Ye, Compos. Sci. Technol. 67, 3041–3050 (2007)

    Article  Google Scholar 

  21. W. Zou, Z.J. Du, Y.X. Liu, X. Yang, H.Q. Li, C. Zhang, Compos. Sci. Technol. 68, 3259–3264 (2008)

    Article  Google Scholar 

  22. L. Aryasomayajula, K.J. Wolter, J. Nanotechnol. 2013, 296517 (2013)

    Article  Google Scholar 

  23. S.Y. Lee, S.J. Park, Bull. Korean Chem. Soc. 31, 1596–1600 (2010)

    Article  Google Scholar 

  24. P.C. Ma, N.A. Siddiqui, G. Marom, J.K. Kim, Compos. Pt. A-Appl. Sci. Manuf. 41, 1345–1367 (2010)

    Article  Google Scholar 

  25. M. Abdalla, D. Dean, D. Adibempe, E. Nyairo, P. Robinson, G. Thompson, Polymer 48, 5662–5670 (2007)

    Article  Google Scholar 

  26. H. Peng, L.B. Alemany, J.L. Margrave, V.N. Khabashesku, J. Am. Chem. Soc. 125, 15174–15182 (2003)

    Article  Google Scholar 

  27. Z. Spitalsky, D. Tasis, K. Papagelis, C. Galiotis, Prog. Polym. Sci. 35, 357–401 (2010)

    Article  Google Scholar 

Download references

Acknowledgments

This research was supported by the Chung-Ang University Excellent Student Scholarship in 2013 and Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and future Planning (2014007164).

Author information

Authors and Affiliations

  1. School of Mechanical Engineering, Chung-Ang University, Seoul, 156-756, Korea

    Byung-Seung Yim, Byung Hun Lee & Jong-Min Kim

  2. School of Chemical Engineering and Material Science, Chung-Ang University, Seoul, 156-756, Korea

    Jooheon Kim

Authors
  1. Byung-Seung Yim
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Byung Hun Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Jooheon Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Jong-Min Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jong-Min Kim.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Yim, BS., Lee, B.H., Kim, J. et al. Effect of dispersion condition of multi-walled carbon nanotube (MWNT) on bonding properties of solderable isotropic conductive adhesives (ICAs). J Mater Sci: Mater Electron 25, 5208–5217 (2014). https://doi.org/10.1007/s10854-014-2290-7

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-014-2290-7

Keywords

Search

Navigation