Skip to main content

Advertisement

SpringerLink
Log in

Stress relaxation behavior and low cycle fatigue behavior of bulk SAC 305

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Bulk Sn96.5Ag3Cu0.5 samples were mechanically tested to investigate the effect of temperature, frequency and applied stress on the low cycle fatigue and stress relaxation behavior and the corresponding microstructure. Samples were tested under a variety of parameters including applied stresses between 8 and 80 MPa, temperatures of 25, 50, 100 and 150 °C and frequencies of 1, 0.1 and 0.01 Hz, respectively. Samples used for the stress relaxation behavior exhibited plastic behavior with increased softening behavior with increased stress levels, increased temperature and lower frequencies. Bayesian analysis revealed that stress relaxation behavior could be expressed in general by the following expression: ∆σ = AN B In the previous expression, Bayesian analysis showed that the testing frequency has an exponential dependency while the temperature has a power law dependency on the parameters A and b. The results of the low cycle fatigue study showed that life decreased with increased applied stress, decreased frequency and increased temperature. Bayesian analysis revealed that the low cycle fatigue behavior could be described by the following expression: ∆σ = G(logN)m. Additionally, Bayesian analysis showed that the testing frequency and temperature both have a power law dependency on the parameters G and m.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

Similar content being viewed by others

References

  1. I. Kim, T. Park, S. Yang, S. Lee, A comparative study of the fatigue behavior of SnAgCu and SnPb solder joints. Adv. Fract. Strength 1–4(297–300), 831–836 (2005)

    Google Scholar 

  2. J. Sundelin, S. Nurmi, T. Lepisto, Recyrstallization behavior of SnAgCu solder joints. Mater. Sci. Eng. A 474(1–2), 201–207 (2008)

    Article  Google Scholar 

  3. B. Dompierre, V. Aubin, E. Charkaluk, W.C. Maia Filho, M. Brizoux, Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies. Proc. Eng. 2(1), 1477–1486 (2010)

    Article  Google Scholar 

  4. M. Erinc, P. Schreurs, M.G.D. Geers, Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder. Mech. Mater. 40(10), 780–791 (2008)

    Article  Google Scholar 

  5. B. Dompierre, V. Aubin, E. Charkaluk, W.C.M. Filho, M. Brizoux, Cyclic mechanical behavior of Sn3.0Ag0.5Cu alloy under high temperature isothermal ageing. Mater. Sci. Eng. A 528(13–14), 4812–4818 (2011)

    Article  Google Scholar 

  6. C. Kanchanomai, Y. Miyashita, Y. Mutoh, Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders. J. Electron. Mater. 31(5), 456–465 (2007)

    Article  Google Scholar 

  7. Y. Kariya, T. Suga, Low-cycle fatigue properties of eutectic solders at high temperatures. Fatigue Fract. Eng. Mater. Struct. 30(5), 413–419 (2007)

    Article  Google Scholar 

  8. T.-M.K. Korhonen, L.P. Lehman, M.A. Korhonen, D.W. Henderson, Isothermal fatigue behavior of the near-eutectic Sn–Ag–Cu alloy between −25°C and 125°C. J. Electr. Mater. 36(2), 173–178 (2001)

    Article  Google Scholar 

  9. J.H.L. Pang, B. Xiong, T. Low, Creep and fatigue characterization of lead free 95.5 Sn-3.8 Ag-0.7 Cu solder. in Proceedings from the 54th Electronic Components and Technology Conference, vol 2 (2001) pp. 1333–1337

  10. ASTM E9-089A, Standard Test Methods for Tension Testing of Metallic Materials (2000)

  11. ASTM E21-89A, Standard Test Methods for Elevated Temperature Tension Tests of Metallic Materials (2003)

  12. ASTM E209-00, Standard Practice for Compression Tests of Metallic Materials at Elevated Temperatures with Conventional or Rapid Heating Rates and Strain Rates (2002)

  13. ASTM, E8, Standard Test Methods of Tension Testing of Metallic Materials, vol. 3.01,.pp. 41–49

  14. M. Azarkhail, M. Modarres, A novel Bayesian framework for uncertainty management in physics-based reliability models, in ASME International Mechanical Engineering Congress and Exposition, Proceedings, vol 14 (2008)

  15. M. Azarkhail, V. Ontiverious, M. Modarres, A Bayesian framework for model uncertainty considerations in fire simulation codes, in Proceedings of the 17th international conference on nuclear engineering vol 14 (2009) pp 41–49

Download references

Acknowledgments

The authors would like to thank Victor Ontiveros and Mohammad Nuhi for their help with experimental work/data analysis, CALCE and NISP Lab for their help with the SEM work. The authors would also like to acknowledge the SEEDS Fellowship Program (funded by the National Science Foundation).

Author information

Authors and Affiliations

  1. Department of Materials Science and Engineering, University of Maryland College Park, College Park, MD, USA

    Gary Paradee, Eric Bailey & Aris Christou

Authors
  1. Gary Paradee
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Eric Bailey
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Aris Christou
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Gary Paradee.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Paradee, G., Bailey, E. & Christou, A. Stress relaxation behavior and low cycle fatigue behavior of bulk SAC 305. J Mater Sci: Mater Electron 25, 4122–4128 (2014). https://doi.org/10.1007/s10854-014-2138-1

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-014-2138-1

Keywords

Search

Navigation