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Thermomigration-induced failure in ball grid array solder joint under high current stressing

  • Metals & corrosion
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Abstract

In this work, rapid failure of a few minutes was observed in real ball grid array solder joints under high current density (8 × 103 and 1 × 104 A cm−2) at room temperature. For each test condition, the failure solder joint was detected at the same position of the daisy chain by computed tomography technology. Furthermore, the open failure for all solder joints was caused by the chip side (anode side) Cu dissolution. Microstructure evolution for a pair of electrically connected solder joints was investigated. In both solder joints, Cu atoms on the chip side were dissolved to the board side with the formation of intermetallic compound particles in solder matrix. Finite element simulation was introduced to calculate the current density, temperature, and heat flux distribution. The temperature gradient along the direction of Cu migration in solder joint was developed due to the accumulation of Joule heating. Thermomigration was confirmed as the dominant mechanism of chip side Cu dissolution.

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Acknowledgements

This paper was financially supported by the National Natural Science Foundation of China (Nos. 51705484 and 51572190). The authors would like to take this opportunity to express their sincere appreciation for the joint training project between the Chinese Academy of Physics and Tianjin University.

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Authors and Affiliations

  1. Department of Applied Physics, Faculty of Science, Tianjin University, Tianjin, 300354, China

    Peng Liu & Ping Wu

  2. Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang, 621900, China

    Sen Cong & Shaobin Wang

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  1. Peng Liu
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  2. Sen Cong
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  3. Shaobin Wang
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  4. Ping Wu
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Contributions

PL: acquisition of the data and drafting manuscript. SC: conception and planning of the work. SW: analysis and interpretation of the data. PW: conception and planning of the work.

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Correspondence to Sen Cong or Ping Wu.

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Liu, P., Cong, S., Wang, S. et al. Thermomigration-induced failure in ball grid array solder joint under high current stressing. J Mater Sci 58, 10753–10763 (2023). https://doi.org/10.1007/s10853-023-08678-y

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  • DOI: https://doi.org/10.1007/s10853-023-08678-y

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