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Effect of pull-down rate and power on electromagnetic separation of hypereutectic Ti–Si alloy under vacuum

  • Metals & corrosion
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Abstract

In the present study, numerical and experimental methods were used to investigate the effects of the process parameters on the enrichment of primary Si by separation of hypereutectic Ti-89 wt.% Si alloy melts during directional solidification. The results indicated that the separation of the primary Si from Ti-89 wt% Si alloy melts significantly depends on the pull-down rate of the melts, and the flow velocity of the melts decreases as the pull-down rate increases, which reduces the separation and enrichment effects of the primary Si during the electromagnetic directional solidification process. Conversely, with the increase in power, the convection and heat transfer of the melt are enhanced, which promotes the separation and enrichment of primary Si. Furthermore, the enrichment of silicon was analyzed by ICP (Inductive coupled plasma emission spectrometer), and it was found that with the power increasing from 3.8 to 5.4 kW, the content of Ti in the silicon enrichment layer decreased from 4.16 to 2.08%.

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Acknowledgements

The authors are grateful to the financial support by National Natural Science Foundation of China (No. 5186403 and U1702251).

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Authors and Affiliations

  1. Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming, 650093, China

    Ruifeng Zhang, Junpeng Wang, Yun Lei, Wenhui Ma & Guoqiang Lv

  2. State Key Laboratory of Complex Nonferrous Metal Resources Cleaning Utilization in Yunnan Province, Kunming, 650093, China

    Ruifeng Zhang, Junpeng Wang, Yun Lei, Wenhui Ma & Guoqiang Lv

  3. School of Vanadium and Titanium, Panzhihua University, Panzhihua, 617000, China

    Kuisong Zhu

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  1. Ruifeng Zhang
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Correspondence to Guoqiang Lv.

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Zhang, R., Wang, J., Zhu, K. et al. Effect of pull-down rate and power on electromagnetic separation of hypereutectic Ti–Si alloy under vacuum. J Mater Sci 58, 397–410 (2023). https://doi.org/10.1007/s10853-022-07993-0

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  • DOI: https://doi.org/10.1007/s10853-022-07993-0

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