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Transport properties of CuxCo4Sb11.7Te0.3 prepared by solid-state reaction

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Abstract

The Skutterudite compounds have been extensively studied worldwide over the past several years for their potential advanced thermoelectric applications in the intermediate temperature range. However, most methods for synthesis of CoSb3 materials require a long-duration heating process and complex equipments. In this study, a simple solid-state reaction method was used to prepare copper-tellurium co-doped CoSb3 ( CuxCo4Sb11.7Te0.3, x = 0-0.4) bulk thermoelectric materials. The obtained samples show enhanced thermoelectric properties compared to Cu-undoped sample. Especially in the case of Cu-doped CoSb3, the compound Cu0.4Co4Sb11.7Te0.3 exhibits a maximal Seebeck coefficient of 234.2 µVK− 1 at 617 K, the sample Cu0.1Co4Sb11.7Te0.3 reaches a power factor of 2012.35 mWm− 1 K− 2 at 715.7 K. Moreover, phonon scattering appears to be enhanced due to the significant reduction in grain size of the samples prepared by the solid-state reaction method, resulting in a minimum thermal conductivity of 1.67 Wm− 1 K− 1. A dimensionless figure of merit (ZT) of 0.68 was obtained for Cu0.3Co4Sb11.7Te0.3 at 716 K. Thus, the solid-state reaction method is a feasible strategy for the preparation of Skutterudite thermoelectric materials.

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Data availability Statement

The raw/processed data required to reproduce these findings cannot be shared at this time as the data also forms part of an ongoing study.

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Acknowledgements

This work supported by the National Natural Science Foundation of China (Grant number 52062031), Liupanshui Key Laboratory of thermoelectric and electrode materials(Grant number 52020-2020-0903), School level fund project of Liupanshui Normal University (lpssykyjj201902), and the Science and Technology Innovation Group of Liupanshui Normol University (LPSSYKJTD201905).

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Correspondence to J. Z. Zhang.

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Qin, B.K., Ji, Y.H., Bai, Z.L. et al. Transport properties of CuxCo4Sb11.7Te0.3 prepared by solid-state reaction. J Electroceram 49, 1–5 (2022). https://doi.org/10.1007/s10832-022-00286-7

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