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Heat Transfer Characteristics of Billet/Die Interface and Measures to Relieve Thermal Stress for Hot Forging Die

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Abstract

The interfacial heat transfer coefficient (IHTC) shows the heat transfer capacity at the billet/die interface during the hot forming process, which affects the temperature gradient in the die that may potentially induce high thermal stress. Consequently, this determines the service life of the die. In this paper, a set of experimental equipments were used to identify the IHTC and the upsetting test of superalloy Inconel718 (GH4169) was carried out on the hot flat die to evaluate the IHTC characteristics after the billet heating and die preheating temperature, holding time, and billet deformation rate. The results indicated that the billet heating temperature has a minimal role in IHTC but the other components have a great impact on IHTC. Among them, the billet deformation rate has influenced the IHTC the most. In the die preheating temperature ranging from \(150\,^{\circ }\hbox {C}~\hbox {to}~400\,^{\circ }\hbox {C}\), it was found that the preheating temperature was proportional to IHTC. A high preheating temperature that leads to a high IHTC was found unfavorable in relieving the die surface thermal stress, and also weakened the die hardness and strength. The IHTC declined with the increase in the holding time as a result of the billet oxidation. Based on these findings, the composite ceramic and polymetallic heat-resistant coatings on the die surface were prepared, respectively, to relieve the thermal stress of die surface by reducing IHTC. It showed that both of the treated dies could effectively reduce the IHTC, blocking the transferred heat from the hot billet and making it applicable to the different hot forging events.

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Abbreviations

h :

Interfacial heat transfer coefficient \([\hbox {W/(m}^{2}{\cdot }\hbox {K})]\)

\(K_{T}\) :

Thermal conductivity [\(\hbox {W/(m}{\cdot } \hbox {K})\)]

x :

Coordinate through out the thickness (mm)

\(\dot{q}_{V}\) :

Internal heat source for the billet \(\hbox {(W/m}^{3})\)

\(X_{M}\) :

Sensitivity coefficient \((\hbox {m}^{2}{\cdot } {}^{\circ }\hbox {C/W}\))

\(q_{M}\) :

Interfacial heat flux at the time M \((\hbox {W/m}^{2}\))

S :

Objective function

\(Y_{K,M }\) :

Measured temperature at the location K and at the time M (\(^{\circ }\hbox {C}\))

\(q^{*}\) :

Any known heat flux (\(\hbox {W/m}^{2}\))

\(T_{M-1} (\chi )\) :

Temperature distribution at the time \(t_{M-1}\,(^{\circ }\hbox {C}\))

b1, b2, b3 :

Temperature measurement points of the billet (mm)

d1, d2, d3:

Temperature measurement points of lower die (mm)

T :

Temperature \(({}^{\circ }\hbox {C})\)

c :

Specific heat [\(\hbox {KJ/(Kg}{\cdot } \hbox {K})\)]

q :

Heat flux \(\hbox {(W/m}^{2})\)

C :

Constant

L :

Length of the model

\(\rho \) :

Density (\(\hbox {Kg/m}^{3}\))

\(\bar{\sigma }\) :

Equivalent stress (Pa)

\(\dot{\bar{\varepsilon }}\) :

Equivalent strain rate (\(\hbox {s}^{-1}\))

\(\dot{\varphi }_{z}\) :

Deformation rate (\(\hbox {s}^{-1}\))

\(\Delta T\) :

Transient temperature difference at the interface (\(^{\circ }\hbox {C}\))

\(\tau \) :

Time (s)

n :

Total number of temperature measurement points

M :

Time point

K :

Location point

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Acknowledgements

This work was financially supported by National Natural Science Foundation of China (Grant No. 51275216), Natural Science Foundation of Jiangsu Province, China (Grant No. BK20160353), Natural Science Foundation of Jiangsu Higher Education Institutions of China (Grant No. 16KJB460032), and Top-notch Academic Programs Project of Jiangsu Higher Education Institutions of China (Grant No. PPZY2015B186).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Jiangsu University, Xuefu Road 301, Zhenjiang, 212013, People’s Republic of China

    Baoshan Lu, Leigang Wang & Yao Huang

  2. Department of Precision Manufacturing Engineering, Suzhou Institute of Industrial Technology, Zhineng Road 1, Suzhou, 215104, People’s Republic of China

    Baoshan Lu & Zhe Geng

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  1. Baoshan Lu
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  2. Leigang Wang
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Correspondence to Leigang Wang.

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Lu, B., Wang, L., Geng, Z. et al. Heat Transfer Characteristics of Billet/Die Interface and Measures to Relieve Thermal Stress for Hot Forging Die. Int J Thermophys 38, 102 (2017). https://doi.org/10.1007/s10765-017-2242-6

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