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Terahertz Characterization of Glass-Based Materials and Stackups for 6 G Microelectronics Packaging

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Abstract

Glass-based materials, including polymer/glass stack ups, are attractive structural blocks for packaging substrates supporting 5 G and 6 G microelectronic modules and components. We present the first broadband characterization of AGC Inc. EN-A1 alkali-free boroaluminosilicate glass and of Ajinomoto Build-up Film (ABF) laminated on soda-lime float glass substrate from 200 GHz to 2.5 THz with a commercial terahertz time-domain spectroscopy (THz-TDS) system. The refractive index \(n(\nu )\), attenuation coefficient \(\alpha (\nu )\), permittivity \(\varepsilon '(\nu )\), and loss tangent \(\tan \delta (\nu )\) of EN-A1 glass as well as laminated ABF are \(n_\mathrm{EN-A1}=2.376\), \(\alpha _\mathrm{EN-A1}=31.1\) cm\(^{-1}\), \(\varepsilon '_\mathrm{EN-A1}=5.64\), \(\tan \delta _\mathrm{EN-A1}=0.062\), and \(n_\textrm{ABF}= 1.9\), \(\alpha _\textrm{ABF}= 30\) cm\(^{-1}\), \(\varepsilon _\textrm{ABF} = 3.8\), \(\tan \delta _\textrm{ABF}= 0.072\), all at 1 THz. Our results validate the promising perspective of both EN-A1 glass and ABF polymer materials as microwave and THz packaging solutions.

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Acknowledgements

The authors acknowledge PRC Industry consortium members in supporting this research effort. We are grateful to AGC Inc. and Ajinomoto for providing us with EN-A1 glass and ABF films, respectively.

Funding

MZ, HS, AL, and DSC gratefully acknowledge the support of Conseil Régional Grand Est.

Author information

Author notes

  1. Madhavan Swaminathan

    Present address: Department of Electrical Engineering, Pennsylvania State University, State College, PA, 16802-1589, USA

Authors and Affiliations

  1. Georgia Tech-CNRS IRL2958, Georgia Tech-Europe, 2 Rue Marconi, 57070, Metz, France

    Min Zhai, Haolian Shi, Alexandre Locquet & D. S. Citrin

  2. School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, USA

    Min Zhai, Haolian Shi, Alexandre Locquet & D. S. Citrin

  3. School of Material Science and Engineering, and the 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA

    Pragna Bhaskar

  4. School of Electrical and Computer Engineering, the School of Material Science and Engineering, and the 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA

    Madhavan Swaminathan

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Contributions

M.Z., D.S.C., and A.L. wrote the main manuscript text, P.B. prepared the samples, M.Z. and H.S. made the THz measurements, carried out the data analysis, and prepared the figures, D.S.C, A.L., and M.S. conceptualized and supervised the project. All authors reviewed the manuscript.

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Correspondence to D. S. Citrin.

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Zhai, M., Bhaskar, P., Shi, H. et al. Terahertz Characterization of Glass-Based Materials and Stackups for 6 G Microelectronics Packaging. J Infrared Milli Terahz Waves 44, 841–857 (2023). https://doi.org/10.1007/s10762-023-00951-0

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