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Third-order polynomial model for analyzing stickup state laminated structure in flexible electronics

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Abstract

Laminated hard-soft integrated structures play a significant role in the fabrication and development of flexible electronics devices. Flexible electronics have advantageous characteristics such as soft and light-weight, can be folded, twisted, flipped inside-out, or be pasted onto other surfaces of arbitrary shapes. In this paper, an analytical model is presented to study the mechanics of laminated hard-soft structures in flexible electronics under a stickup state. Third-order polynomials are used to describe the displacement field, and the principle of virtual work is adopted to derive the governing equations and boundary conditions. The normal strain and the shear stress along the thickness direction in the bi-material region are obtained analytically, which agree well with the results from finite element analysis. The analytical model can be used to analyze stickup state laminated structures, and can serve as a valuable reference for the failure prediction and optimal design of flexible electronics in the future.

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Acknowledgements

The project was supported by the National Natural Science Foundation of China (Grants 11572022 and 11172022).

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Authors and Affiliations

  1. School of Aeronautic Science and Engineering, Beihang University, Beijing, 100191, China

    Xianhong Meng, Zihao Wang & Boya Liu

  2. School of Mechanical and Aerospace Engineering, Oklahoma State University, Stillwater, OK, 74078, USA

    Shuodao Wang

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  1. Xianhong Meng
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  2. Zihao Wang
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  3. Boya Liu
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Correspondence to Xianhong Meng or Shuodao Wang.

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Meng, X., Wang, Z., Liu, B. et al. Third-order polynomial model for analyzing stickup state laminated structure in flexible electronics. Acta Mech. Sin. 34, 48–61 (2018). https://doi.org/10.1007/s10409-017-0670-y

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  • DOI: https://doi.org/10.1007/s10409-017-0670-y

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