Skip to main content

Advertisement

SpringerLink
Log in

Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition

  • ORIGINAL ARTICLE
  • Published:
Journal of Material Cycles and Waste Management Aims and scope Submit manuscript

Abstract

The copper recovery from waste printed circuit boards is of great significance to protect natural resource and environment. Direct current electrodeposition has been applied to extract metal from hydrometallurgical leach solutions. However, during the direct current electrodeposition process, concentration polarization and hydrogen evolution reaction often exist, which reduces current efficiency and metal recovery capability. In this work, a pulse current was applied to electrodeposit copper. The electrolyte was the leach solution of waste printed circuit boards obtained using a sulfuric acid-hydrogen peroxide system. The influence of process parameters in the leaching stage and the electrodeposition process on current efficiency were both investigated. The results showed that the current efficiency was 95.1% in pulse current electrodeposition, while that was only 90.9% in direct current electrodeposition. The increased current efficiency was proposed to be attributed to the fact that pulse current electrodeposition could improve the mass transfer of copper ions which suppressed concentration polarization and hydrogen evolution reaction. These results demonstrate that pulse current electrodeposition is a promising approach for recovering copper from waste-printed circuit boards.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

Similar content being viewed by others

Data availability

The data provided in this paper are available.

References

  1. Pinho SC, Ribeiro C, Ferraz CA, Almeida MF (2021) Copper, zinc, and nickel recovery from printed circuit boards using an ammonia – ammonium sulphate system. J Mater Cycles Waste Manage 23:1456–1465. https://doi.org/10.1007/s10163-021-01226-3

    Article  Google Scholar 

  2. Barrueto Y, Hernández P, Jiménez Y, Morales J (2021) Leaching of metals from printed circuit boards using ionic liquids. J Mater Cycles Waste Manage 23:2028–2036. https://doi.org/10.1007/s10163-021-01275-8

    Article  Google Scholar 

  3. Desmarais M, Pirade F, Zhang J, Rene ER (2020) Biohydrometallurgical processes for the recovery of precious and base metals from waste electricl and electronic equipments: Current trends and perspectives. Bioresource Technology Reports. https://doi.org/10.1016/j.biteb.2020.100526

    Article  Google Scholar 

  4. Abdelbasir SM, Hassan SSM, Kamel AH, El-Nasr RS (2018) Status of electronic waste recycling techniques: a review. Environ Sci Pollut Res 25:16533–16547. https://doi.org/10.1007/s11356-018-2136-6

    Article  Google Scholar 

  5. Akcil A, Agcasulu I, Swain B (2019) Valorization of waste LCD and recovery of critical raw material for circular economy: a review. Resour Conserv Recycl 149:622–637. https://doi.org/10.1016/j.resconrec.2019.06.031

    Article  Google Scholar 

  6. Seif El-Nasr R, Abdelbasir SM, Kamel AH, Hassan SSM (2020) Environmentally friendly synthesis of copper nanoparticles from waste printed circuit boards. Separation Purification Technology. https://doi.org/10.1016/j.seppur.2019.115860

    Article  Google Scholar 

  7. Kyung KS, Lee JC, Yoo K et al (2018) Kinetics of indium dissolution from marmatite with high indium content in pressure acid leaching. Waste Manage 199:69–76. https://doi.org/10.1007/s12598-016-0762-z

    Article  Google Scholar 

  8. Choi JW, Song MH, Bediako JK, Yun YS (2020) Sequential recovery of gold and copper from bioleached wastewater using ion exchange resins. Environ Pollut. https://doi.org/10.1016/j.envpol.2020.115167

    Article  Google Scholar 

  9. Wang J, Chen S, Zeng X et al (2021) Recovery of high purity copper from waste printed circuit boards of mobile phones by slurry electrolysis with ammonia-ammonium system. Separation Purification Techn. https://doi.org/10.1016/j.seppur.2021.119180

    Article  Google Scholar 

  10. Yu L, Miao C, Nie S et al (2021) Feasible preparation of Cu6Sn5 alloy thin-film anode materials for lithium-ion batteries from waste printed circuit boards by electrodeposition. Solid State Ionics. https://doi.org/10.1016/j.ssi.2021.115625

    Article  Google Scholar 

  11. Fogarasi S, Imre-Lucaci F, Ilea P, Imre-Lucaci Á (2013) The environmental assessment of two new copper recovery processes from waste printed circuit boards. J Clean Prod 54:264–269. https://doi.org/10.1016/j.jclepro.2013.04.044

    Article  Google Scholar 

  12. Su J, Lin X, Zheng S et al (2017) Mass transport-enhanced electrodeposition for the efficient recovery of copper and selenium from sulfuric acid solution. Sep Purif Technol 182:160–165. https://doi.org/10.1016/j.seppur.2017.03.056

    Article  Google Scholar 

  13. Silva MSBD, Melo RACD, Lopes-Moriyama AL, Souza CP (2019) Electrochemical extraction of tin and copper from acid leachate of printed circuit boards using copper electrodes. J Envi Manag 246:410–417. https://doi.org/10.1016/j.jenvman.2019.06.009

    Article  Google Scholar 

  14. Sun ZHI, Xiao Y, Sietsma J et al (2016) Complex electronic waste treatment – An effective process to selectively recover copper with solutions containing different ammonium salts. Waste Manage 57:140–148. https://doi.org/10.1016/j.wasman.2016.03.015

    Article  Google Scholar 

  15. Wei KX, Zhou HR, Jia FL et al (2021) Mechanical behaviors of graphene/copper matrix composite foils fabricated by pulse electrodeposition. Surfaces Interfaces 24:1–7. https://doi.org/10.1016/j.surfin.2021.101142

    Article  Google Scholar 

  16. Young KE, Seuk KM, Lee JC et al (2011) Chemical hazards associated with treatment of waste electrical and electronic equipment. Waste Manage 57:245–252. https://doi.org/10.1016/j.hydromet.2020.105427

    Article  Google Scholar 

  17. Zhang X, Zhang X, Liu Z et al (2019) Journal of Environmental Chemical Engineering Pulse current electrodeposition of manganese metal from sulfate solution. J Envi Chem Eng. https://doi.org/10.1016/j.jece.2019.103010

    Article  Google Scholar 

  18. Zhang S, Li Y, Wang R et al (2017) Superfine copper powders recycled from concentrated metal scraps of waste printed circuit boards by slurry electrolysis. J Clean Prod 152:1–6. https://doi.org/10.1016/j.jclepro.2017.03.087

    Article  Google Scholar 

  19. Guo X, Qin H, Tian Q, Li D (2020) Recovery of metals from waste printed circuit boards by selective leaching combined with cyclone electrowinning process. J Hazardous Materials. https://doi.org/10.1016/j.jhazmat.2019.121355

    Article  Google Scholar 

  20. Su J, Lin X, Zheng S et al (2017) Mass transport-enhanced electrodeposition for the efficient recovery of copper and selenium from sulfuric acidsolution. Sep Purif Technol 182:160–165. https://doi.org/10.1016/j.seppur.2017.03.056

    Article  Google Scholar 

  21. Ning D, Yang C, Wu H (2019) Ultrafast Cu2+ recovery from waste water by jet electrodeposition. Sep Purif Technol 220:217–221. https://doi.org/10.1016/j.seppur.2019.03.059

    Article  Google Scholar 

  22. Sharma VK, Kukreja N, Mausam K (2021) Application of pulse plating technique to improve hardness. Materials Today: Proceedings 45:3449–3451. https://doi.org/10.1016/j.matpr.2020.12.934

    Article  Google Scholar 

  23. Nurmi P, Özkaya B, Kaksonen AH et al (2010) Predictive modelling of Fe(III) precipitation in iron removal process for bioleaching circuits. Bioprocess Biosyst Eng 33:449–456. https://doi.org/10.1007/s00449-009-0346-5

    Article  Google Scholar 

  24. Vicenzo A, Bonelli S, Cavallotti PL (2010) Pulse plating of matt tin: effect on properties. Trans Inst Met Finish 88:248–255. https://doi.org/10.1179/002029610X12791981507802

    Article  Google Scholar 

  25. Ataie SA, Zakeri A (2016) Improving tribological properties of (Zn-Ni)/nano Al2O3 composite coatings produced by ultrasonic assisted pulse plating. J Alloy Compd 674:315–322. https://doi.org/10.1016/j.jallcom.2016.02.111

    Article  Google Scholar 

  26. Wu L, Graves JE, Cobley AJ (2018) Mechanism for the development of Sn-Cu alloy coatings produced by pulsed current electrodeposition. Mater Lett 217:120–123. https://doi.org/10.1016/j.matlet.2018.01.094

    Article  Google Scholar 

  27. Tian Q, Li J, Guo X et al (2021) Efficient electrochemical recovery of tellurium from spent electrolytes by cyclone electrowinning. J Sustainable Metallurgy 7:27–45. https://doi.org/10.1007/s40831-020-00317-z

    Article  Google Scholar 

  28. Elomaa H, Halli P, Sirviö T et al (2018) A future application of pulse plating–silver recovery from hydrometallurgical bottom ash leachant. Trans Inst Met Finish 96:253–257. https://doi.org/10.1080/00202967.2018.1507320

    Article  Google Scholar 

  29. Hao J, Wang X, Wang Y et al (2022) Optimizing the leaching parameters and studying the kinetics of copper recovery from waste printed circuit boards. ACS Omega 7:3689–3699. https://doi.org/10.1021/acsomega.1c06173

    Article  Google Scholar 

  30. Dela Pena EM, Roy S (2018) Electrodeposited copper using direct and pulse currents from electrolytes containing low concentration of additives. Surf Coat Technol 339:101–110. https://doi.org/10.1016/j.surfcoat.2018.01.067

    Article  Google Scholar 

  31. Leisner P, Møller P, Fredenberg M, Belov I (2007) Recent progress in pulse reversal plating of copper for electronics applications. Trans Inst Met Finish 85:40–45. https://doi.org/10.1179/174591907X161973

    Article  Google Scholar 

  32. Landolt D, Marlot A (2003) Microstructure and composition of pulse-plated metals and alloys. Surf Coat Technol 169–170:8–13. https://doi.org/10.1016/S0257-8972(03)00042-2

    Article  Google Scholar 

  33. Ghaemi M, Binder L (2002) Effects of direct and pulse current on electrodeposition of manganese dioxide. J Power Sources 111:248–254. https://doi.org/10.1016/S0378-7753(02)00309-9

    Article  Google Scholar 

  34. Qiang L, Pinto ISS, Youcai Z (2014) Sequential stepwise recovery of selected metals from fl ue dusts of secondary copper smelting. J Clean Prod 84:663–670. https://doi.org/10.1016/j.jclepro.2014.03.085

    Article  Google Scholar 

  35. Cocchiara C, Dorneanu SA, Inguanta R et al (2019) Dismantling and electrochemical copper recovery from waste printed circuit boards in H2SO4–CuSO4–NaCl solutions. J Clean Prod 230:170–179. https://doi.org/10.1016/j.jclepro.2019.05.112

    Article  Google Scholar 

  36. Nikolić ND, Pavlović LJ, Krstić SB et al (2008) Influence of ionic equilibrium in the CuSO4-H2SO4-H2O system on the formation of irregular electrodeposits of copper. Chem Eng Sci 63:2824–2828. https://doi.org/10.1016/j.ces.2008.02.022

    Article  Google Scholar 

  37. Liu Y, Song Q, Zhang L, Xu Z (2021) Targeted recovery of Ag-Pd Alloy from polymetallic electronic waste leaching solution via green electrodeposition technology and its mechanism. Separation Purification Tech. https://doi.org/10.1016/j.seppur.2021.118944

    Article  Google Scholar 

  38. Song YB, Chin DT (2002) Current efficiency and polarization behavior of trivalent chromium electrodeposition process. Electrochim Acta 48:349–356. https://doi.org/10.1016/S0013-4686(02)00678-3

    Article  Google Scholar 

  39. Cao X, Xu L, Shi Y et al (2019) Electrochemical behavior and electrodeposition of cobalt from choline chloride-urea deep eutectic solvent. Electrochim Acta 295:550–557. https://doi.org/10.1016/j.electacta.2018.10.163

    Article  Google Scholar 

  40. Haccuria E, Ning P, Cao H et al (2017) Effective treatment for electronic waste - selective recovery of copper by combining electrochemical dissolution and deposition. J Clean Prod 152:150–156. https://doi.org/10.1016/j.jclepro.2017.03.112

    Article  Google Scholar 

  41. Tanaka Y (2007) Chapter 11 Limiting Current Density. Membrane Science and Technology https://doi.org/10.1016/S0927-5193(07)12011-8

  42. Sharma A, Bhattacharya S, Sen R et al (2012) Influence of current density on microstructure of pulse electrodeposited tin coatings. Mater Charact 68:22–32. https://doi.org/10.1016/j.matchar.2012.03.002

    Article  Google Scholar 

  43. Deo Y, Ghosh R, Nag A et al (2021) Electrochimica Acta Direct and pulsed current electrodeposition of Zn-Mn coatings from additive-free chloride electrolytes for improved corrosion resistance. Electrochim Acta. https://doi.org/10.1016/j.electacta.2021.139379

    Article  Google Scholar 

  44. Hua G, Zhicheng X, Dan Q et al (2020) Chemosphere Fabrication and characterization of porous titanium-based PbO2 electrode through the pulse electrodeposition method : Deposition condition optimization by orthogonal experiment *. Chemosphere. https://doi.org/10.1016/j.chemosphere.2020.128157

    Article  Google Scholar 

  45. He A, Liu ÆQ, Ivey ÆDG (2008) Electrodeposition of tin : a simple approach. J Mater Sci Mater Electron 19:553–562. https://doi.org/10.1007/s10854-007-9385-3

    Article  Google Scholar 

  46. Xu Z, Guo X, Tian Q et al (2020) Electrodeposition of tellurium from alkaline solution by cyclone electrowinning. Hydrometallurgy. https://doi.org/10.1016/j.hydromet.2020.105316

    Article  Google Scholar 

  47. Ben AI, Dhahbi M (2011) Electrochemical study and electrodeposition of copper in the hydrophobic tri-n-octylmethylammonium chloride ionic liquid media. J Mol Liq 161:13–18. https://doi.org/10.1016/j.molliq.2011.03.018

    Article  Google Scholar 

  48. Portela AL, Teijelo ML, Lacconi GI (2006) Mechanism of copper electrodeposition in the presence of picolinic acid. Electrochim Acta 51:3261–3268. https://doi.org/10.1016/j.electacta.2005.09.029

    Article  Google Scholar 

  49. Srinivasan S, Gileadi E (1966) The potential-sweep method: a theoretical analysis. Electrochim Acta 11:321–335. https://doi.org/10.1016/0013-4686(66)87043-3

    Article  Google Scholar 

Download references

Acknowledgements

This work was supported by the National Key Research and Development Program of China (Grant No. 2018YFC1902501 and 2018YFC1903605), the Beijing Nova Program (Grant number Z211100002121091), the Fundamental Research Funds for the Central Universities (Grant No. 048000546320506), and International Research Cooperation Seed Fund of Beijing University of Technology (Grant No. 2021A13).

Author information

Authors and Affiliations

  1. Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, People’s Republic of China

    Juanjuan Hao, Xiaolu Wang, Yishu Wang, Fu Guo & Yufeng Wu

  2. Key Laboratory of Advanced Functional Materials, Ministry of Education, Beijing, 100124, People’s Republic of China

    Fu Guo

  3. College of Robotics, Beijing Union University, Beijing, 100101, People’s Republic of China

    Fu Guo

Authors
  1. Juanjuan Hao
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Xiaolu Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Yishu Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Fu Guo
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Yufeng Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

Contributions

Conceptualization: JH; Methodology: JH and XW; Writing-original draft preparation: JH and XW; Writing-reviewing and editing: JH, XW, YW and YW; Supervision: FG. All authors have read and agreed to the published version of the manuscript.

Corresponding authors

Correspondence to Xiaolu Wang or Fu Guo.

Ethics declarations

Conflict of interest

The authors have no relevant financial or non-financial interests to disclose.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Supplementary Information

Below is the link to the electronic supplementary material.

Supplementary file1 (PDF 372 KB)

Rights and permissions

Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Hao, J., Wang, X., Wang, Y. et al. Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition. J Mater Cycles Waste Manag 25, 1108–1119 (2023). https://doi.org/10.1007/s10163-023-01604-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10163-023-01604-z

Keywords

Search

Navigation