Skip to main content
Log in

Dielectric pocket engineered, gate induced drain leakages (GIDL) and analog performance analysis of dual metal nanowire ferroelectric MOSFET (DPE-DM-NW-Fe FET) as an inverter

  • Technical Paper
  • Published:
Microsystem Technologies Aims and scope Submit manuscript

Abstract

This research article presents a simulation study on a dielectric pocket engineered dual metal nanowire ferroelectric (DPE-DM-NW-Fe FET) MOSFET. The aim is to mitigate the Gate-Induced Drain Leakage (GIDL) effect in the off-state condition and improve the subthreshold swing. GIDL is a type of SCE which is detrimental for the device as continuous gate leakage current. Severely hamper the performance of the device particularly in analog applications. To prevent this a novel structure is proposed in which two dielectric pockets are introduced adjacent to the source and drain to reduce the SCEs. GIDL occurs even when the gate voltage is nearly zero, but it becomes significant when the gate region is at a lower bias and the drain region is at a higher bias. The introduced dielectric pockets act as diffusion stoppers, forming insulating barriers to prevent off-state current. Simulation studies were conducted to analyze off-state GIDL currents for different channel lengths (30 nm, 40 nm, and 50 nm). Various parameters such as electric field, electron concentration, electron velocity, and surface potential have been simulated and compared with a Single Metal Gate (SMG) cylindrical MOSFET. Critical performance parameters including drain current, transconductance (gm), output conductance (gd), input capacitance (CGG), cutoff frequency (fT), gain transconductance frequency product (GTFP), gain frequency product (GFP), maximum transfer power gain (MTPG), unilateral power gain (UPG), and early voltage (Vea) have been calculated. Additionally, the noise performances of the DPE-DM-NW-Fe FET have been examined, and its implementation as a CMOS inverter have been explored for determining noise margins. The lower noise margin makes the device suitable for high-frequency applications. The simulations have been conducted using the ATLAS-3D simulator.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17
Fig. 18
Fig. 19
Fig. 20
Fig. 21
Fig. 22
Fig. 23

Similar content being viewed by others

References

  • Aaesha A, Ammar N, Victor N (2013) Electric-field and temperature dependence of the activation energy associated with gate induced drain leakage. J Appl Phys 113(044513):1–5

    Google Scholar 

  • Ana F (2012) Suppression of gate induced drain leakage current (GIDL) by gate work function engineering: analysis and model. J Electron Dev 13:984–996

    Google Scholar 

  • Bhuyan MH (2020) A review of the fabrication process of the pocket implanted MOSFET structure. SEU J Sci Eng 14(1)

  • Bouhdada A, Bakkali S, Touhami A (1997) Modelling of gate-induced drain leakage in relation to technological parameters and temperature. Microelectron Reliab 37(4):649–652

  • Chang C, Haddad SA, Swaminathan BA, Lien J (1988) Drain-avalanche and hole-trapping induced gate leakage in thin-oxide MOS devices. IEEE Electron Dev Lett 9(11):588–590

    Article  Google Scholar 

  • Chen J, Chan TY, Chen IC, Ko PK, Hu C (1987) Subbreakdown drain leakage current in MOSFET. IEEE Electron Dev Lett 8(11):515–517

    Article  Google Scholar 

  • Chen JH, Wong SC, Wang YH (2001) An analytic three-terminal band-to-band tunneling model on GIDL in MOSFET. IEEE Trans Electron Dev 48(7):1400–1405

    Article  Google Scholar 

  • Chen JF, Yan CR, Lin YC, Fan JJ, Yang SF, Shih WC (2011) Analysis of GIDL-induced off-state breakdown in high-voltage depletion-mode nMOSFETs. IEEE Trans Electron Dev 58(6):1608–1613

    Article  Google Scholar 

  • Fan J, Li M, Xu X, Yang Y, Xuan H, Huang R (2014) Insight into gate-induced drain leakage in silicon nanowire transistors. IEEE Trans Electron Devices 62(1):213–219

    Google Scholar 

  • Garg S, Kaur J, Goel A, Haldar S, Gupta RS (2023a) Physics based analytical modeling and simulation of Cylindrical Junctionless Nanowire Ferroelectric field effect transistor (CJNFe-FET) for enhanced analog performance. Microsyst Technol 13:1–3

    Google Scholar 

  • Garg S, Haldar S, Kaur J, Gupta RS, Goel A (2023) Temperature sensitive analysis of junctionless nanowire ferroelectric field effect transistor (JNFe- FET) for enhanced analog performance. In: IEEE Devices for Integrated Circuit (DevIC), Kalyani, India, pp 425–429

  • Goel A, Rewari S, Verma S, Gupta RS (2019) Shallow extension engineered dual material surrounding gate (SEE-DM-SG-DMGFeFET). Semicond Sci Technol 34:6

    Google Scholar 

  • Goel A, Rewari S, Verma S, Gupta RS (2021) Modeling of shallow extension engineered dual metal surrounding gate (SEE-DM-SG) MOSFET gate-induced drain leakage (GIDL). Indian J Phys 95:299–308

    Article  Google Scholar 

  • Jayanarayanan SK, Dey S, Donnelly JP, Banerjee SK (2006) A novel 50 nm vertical MOSFET with a dielectric pocket. Solid-State Electron 50(5):897–900

    Article  Google Scholar 

  • Jimenez D, Saenz JJ, Iniguez B, Sune J, Marsal LF, Pallares J (2004) Modeling of nanoscale gate-all-around MOSFETs. IEEE Electron Device Lett 25(5):314–316

    Article  Google Scholar 

  • Jong-Tae P, Colinge J-P (2002) Multiple gate SOI MOSFETs: device design guidelines. IEEE Tran Electron Dev 49(12):2222–2229

    Article  Google Scholar 

  • Jurczak M, Skotnicki T, Gwoziecki R, Paoli M, Tormen B, Ribot P, Dutartre D, Monfray S, Galvier J (2001) Dielectric pockets-a new concept of the junctions for deca-nanometric CMOS devices. IEEE Trans Electron Dev 48(8):1770–1775

    Article  Google Scholar 

  • Kobayashi M, Hiramoto T (2023) Device design guideline for slope ferroelectric FET using negative capacitance in sub-0.2 operation. Oper Speed Mater Requirement Energy Efficiency

  • Kumar MJ, Chaudhry A (2004) Two-dimensional analytical modeling of fully depleted DMG SOI MOSFET and evidence for diminished SCEs. IEEE Trans Electron Dev 51(4):569–574

    Article  Google Scholar 

  • Madan J, Gupta RS, Chaujar R (2017) Performance investigation of heterogeneous gate dielectric-gate metal engineered–gate all around-tunnel FET for RF applications. Microsyst Technol 23:4081–4090

    Article  Google Scholar 

  • Maity NP, Maity R, Baishya S (2017) Voltage and oxide thickness dependent tunneling current density and tunnel resistivity model: application to high-k material HfO2 based MOS devices. Superlattices Microstruct 111:628–641

    Article  Google Scholar 

  • Mehta H, Kaur H (2016) Modeling and simulation study of novel double gate ferroelectric junction-less (DGFJL) transistor. Superlattices Microstruct 97:536–547

    Article  Google Scholar 

  • Mehta H, Kaur H (2018) Impact of Gaussian doping profile and negative capacitance effect on double-gate junction-less transistors (DGJLTs). IEEE Trans Electron Dev 65:7

    Article  Google Scholar 

  • Neeraj N, Sharma S, Goel A, Rewari S, Gupta RS (2023) Improved analog and AC performance for high frequency linearity-based applications using gate-stack dual metal (DM) nanowire (NW) FET (4H-SiC). Microsyst Technol 10:1–4

    Google Scholar 

  • Nirmal D, Kumar PV, Joy D, Jebalin BK, Kumar NM (2013) Nanoscale tri gate MOSFET for ultralow power applications using high-k dielectrics. In: 2013 IEEE 5th International Nanoelectronics Conference (INEC), pp 12–19

  • Nirmali, Kumar V, Samuel PC, Shrithi, Thomassmohan DMK (2024) Analysis of dual gate MOSFETS using high K dielectrics

  • Pahwa G, Member S, Dutta T, Agarwal A, Chauhan YS (2017) Compact model for ferroelectric negative capacitance transistor with MFIS structure. IEEE Trans Electron Dev 64:3

    Article  Google Scholar 

  • Panchanan S, Maity R, Baishya S, Maity N (2023a) Charge-based trans-capacitance model for SiO2/HfO2 based nano scale trigate FinFET including quantum mechanical effect. SILICON 16:1–12

    Google Scholar 

  • Panchanan S, Maity R, Baidya A (2023b) Role of fin shape on drain current of SiO2/HfO2 based trigate FinFET including quantum mechanical effect. SILICON 15:3883–3895

    Article  Google Scholar 

  • Ranjan R (2019) Performance reliability of ultra-thin Si-SiO2, Si-Al2O3, Si-ZrO2 and Si-HfO2 interface in rectangular steep retrograded nano-regimes devices. Microelectron Reliab 96:21–28

    Article  Google Scholar 

  • Roldan JB, Gamiz F, Lopez-Villanueva JA (1998) IEEE Trans Electron Devices 45:2249

    Article  Google Scholar 

  • Roy S, Chakarabarty P, Pally R (2022) Assessing RF/AC performance and linearity analysis of NCFET in CMOS compatible thin body FDSOI. IEEE Trans Electron Dev 69(2)

  • Sakurai T, Newton AR (1990) IEEE Solid State Circ 25:584

  • Shih CH, Chen YM, Lien C (2004) An analytical model of short-channel effect for metal–oxide–semiconductor field-effect transistor with insulated shallow extension. Jpn J Appl Phys 43(12R):7993

    Article  Google Scholar 

  • Trivedi N, Kumar M, Haldar S, Deswal SS, Gupta M, Gupta RS (2019) Assessment of analog RF performance for insulated shallow extension (ISE) cylindrical surrounding gate (CSG) MOSFET incorporating gate stack. Microsyst Technol 25:1547–1554

    Article  Google Scholar 

  • Yu B, Wann CH, Nowak ED, Noda K, Hu C (1997) Short-channel effect improved by lateral channel-engineering in deep-submicronmeter MOSFET’s. IEEE Trans Electron Dev 44(4):627–634

    Article  Google Scholar 

  • Yu B, Lu H, Liu M, Taur Y (2007) Explicit continuous model for double gate and surrounding gate MOSFET. IEEE Tran Electron Dev 54(10):2715–2222

    Article  Google Scholar 

Download references

Acknowledgements

The authors are gratified to the Director, Maharaja Agrasen Institute of Technology for providing necessary facilities to carry out this research work.

Author information

Authors and Affiliations

Authors

Contributions

A. The author solely responsible for literature survey and writing the paper. B. The author ensures that questions related to the accuracy or integrity of any part of the work are appropriately addressed. C.D. performed the analysis of paper in terms of authenticity and verified the simulated results. E. to investigate and supervised the findings of this work.

Corresponding author

Correspondence to Shalu Garg.

Ethics declarations

Competing interests

The authors declare no competing interests.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Garg, S., Kaur, J., Goel, A. et al. Dielectric pocket engineered, gate induced drain leakages (GIDL) and analog performance analysis of dual metal nanowire ferroelectric MOSFET (DPE-DM-NW-Fe FET) as an inverter. Microsyst Technol (2024). https://doi.org/10.1007/s00542-024-05681-4

Download citation

  • Received:

  • Accepted:

  • Published:

  • DOI: https://doi.org/10.1007/s00542-024-05681-4

Navigation