Skip to main content
SpringerLink
Log in

Adhesive wafer bonding of micro-actuators with SU-8 photoresist

  • Technical Paper
  • Published:
Microsystem Technologies Aims and scope Submit manuscript

Abstract

Adhesive wafer bonding of micro-actuators using SU-8 photoresist is reported. It was investigated in this study that the bonding temperature, bonding pressure, baking time and thickness of the cross-linked SU-8 photoresist layer affects the bonding strength of the assembled micro-actuators. The adhesive wafer bonding was performed by applying different pressures while baking the wafers at different temperatures. In this work, we have demonstrated that decreasing the exposure dose and post-exposure baking temperature play significant roles in affecting the bonding strength of assembled micro-actuators. We believe that lowering the exposure dose and post-exposure temperature will inhibit hardening of the intermediate negative photo-resist layer, and it enhances softening of SU-8 thin film, which can facilitate the bonding strength between the micro-chips.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5

Similar content being viewed by others

References

  • Alexe M, Gösele U (2004) Wafer bonding applications and technology. Springer-Verlag, Berlin

    Book  Google Scholar 

  • Ataro O (2005) Micro-electromechanical structural design and optimization of vertical cavity photonic devices with wide continuous tuning, doctoral dissertation, Universität Kassel, Germany, 2005

  • Bilenberg B, Nielsen T, Clausen B, Kristensen A (2004) PMMA to SU-8 bonding for polymer-based lab-on-a-chip systems with integrated optics. J Micromech Microeng 14:814

    Article  Google Scholar 

  • Nobel C (1992) Industrial adhesives handbook. Casco Nobel, Fredensborg

    Google Scholar 

  • Wang Y (1999) Silicon–glass wafer bonding with silicon hydrophilic fusion bonding technology Sensors Actuators A 72:46

  • Yu L, Tay F, Xu G, Chen B, Avram M, Iliescu C (2006) Adhesive bonding with SU-8 at wafer level for microfluidic devices. J Phys Int MEMS Conf Ser 34:776

    Article  Google Scholar 

Download references

Acknowledgements

The authors would like to acknowledge EPIR Technologies, Inc. for funding this work.

Author information

Authors and Affiliations

  1. Microphysics Laboratory, Physics, University of Illinois at Chicago, 845 W Taylor street, Chicago, 60607, USA

    Deginet Admassu, Tejumade Durowade, Wei Gao & Sivalingam Sivananthan

  2. EPIR Technologies Inc, 590 Territorial Dr Ste H, Bolingbrook, 60440, USA

    Silviu Velicu

Authors
  1. Deginet Admassu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Tejumade Durowade
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Wei Gao
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Silviu Velicu
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Sivalingam Sivananthan
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Deginet Admassu.

Ethics declarations

Conflict of interest

The authors declare that they have no conflict of interest.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Admassu, D., Durowade, T., Gao, W. et al. Adhesive wafer bonding of micro-actuators with SU-8 photoresist. Microsyst Technol 27, 3293–3297 (2021). https://doi.org/10.1007/s00542-020-05097-w

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00542-020-05097-w

Search

Navigation