Abstract
Re–Ni alloys with high Re content were electrodeposited galvanostatically from aqueous solutions with addition of gelatin. The influence of gelatin on the Faradaic efficiency (FE), chemical composition, morphology and crystallographic structure of the alloys was investigated. Morphology, surface roughness, chemical composition and phase identification of the alloys were characterized by an environmental scanning electron microscopy, atomic force microscopy, energy-dispersive spectroscopy and X-ray diffraction, respectively. The addition of gelatin in the plating led to the increase in Re content, and the decrease in the FE and deposition rate. In the absence and presence of gelatin, the alloys with high Re content consisted of an amorphous phase. The addition of gelatin resulted in small amount of carbon in the alloys due to the adsorption of gelatin in the alloy. The gelatin had a great influence on the morphology of the alloys, resulting in significant grain coarsening, the increase in surface roughness and the decrease in crack size. The optimum concentration of gelatin was found to be about 0.9–2.7 g L−1.
Similar content being viewed by others
References
T.M. Selvakumari, R.N. Emerson, S. Ganesan, Digest J. Nanomater. Biostruct. 6, 9 (2011)
T.C. Franklin, Surf. Coat. Technol. 30, 415 (1987)
S.R. Brankovic, B. Kagajwala, J. George, G. Majkic, G. Stafford, P. Ruchhoeft, Electrochim. Acta 387, 83 (2012)
M. Paunovic, M. Schlesinger, Fundamentals of Electrochemical Deposition, 2nd edn. (Wiley, New York, 2005), pp. 177–198
N. Eliaz, E. Gileadi, Induced Codeposition of Alloys of Tungsten, Molybdenum and Rhenium with Transition Metals, in Modern Aspects of Electrochemistry, vol. 42, ed. by C.G. Vayenas, R.E. White, M.E. Gamboa-Aldeco (Springer, New York, 2008), p. 191. (Chapter 4)
A. Naor, N. Eliaz, E. Gileadi, Electrochem. Soc. Trans. 137, 25 (2010)
A. Naor, N. Eliaz, E. Gileadi, Electrochim. Acta 6028, 54 (2009)
A. Naor-Pomeranz, L. Burstein, N. Eliaz, E. Gileadi, Electrochem. Solid-State Lett. 13, D91 (2010)
A. Naor, N. Eliaz, E. Gileadi, J. Electrochem. Soc. 157, D422 (2010)
H. Fukushima, T. Akiyama, M. Shimizu, K. Higashi, Met. Finish. 35, 247 (1984). (in Japanese)
H. Fukushima, T. Akiyama, M. Shimizu, K. Higashi, Met. Finish. 36, 198 (1985). (in Japanese)
P.R. Zabinski, A. Franczak, R. Kowalik, Arch. Metall. Mater. 57, 495 (2012)
S.K. Mondal, F. Contu, B. Ewers, J.D. Batteas, S.R. Taylor, in An AFM Evaluation of Rhenium-Nickel Electrodeposit Nucleation on Copper, 225th ECS Meeting, (2014), p. 530
O. Berkh, N. Eliaz, E. Gileadi, J. Electrochem. Soc. 161, D219 (2014)
M. Cohen-Sagiv, N. Eliaz, E. Gileadi, Electrochim. Acta 88, 240 (2013)
A. Duhin, A. Inberg, N. Eliaz, E. Gileadi, Electrochim. Acta 56, 9637 (2011)
V.P. Greco, Rhenium Alloys-Ion Group Metals-Electrodeposition and Properties, Technical Report, WVY-7150, 1971. http://www.dtic.mil/dtic/tr/fulltext/u2/741362.pdf
C.H. Huang, J.R. Jan, W.Y. Shu, H.M. Wu, Mater. Chem. Phys. 70, 168 (2001)
N. Eliaz, K. Venkatakrishna, A.C. Hegde, Surf. Coat. Technol. 205, 1969 (2010)
R.A. Abuknesha, F. Jeganathan, R. DeGroot, D. Wildeboer, R.G. Price, Anal. Bioanal. Chem. 396, 2547 (2010)
F. Contua, S.R. Taylor, Electrochim. Acta 70, 34 (2012)
K.H. Hou, Y.F. Chang, S.M. Chang, C.H. Chang, Thin Solid Films 518, 7535 (2010)
T. Yamasaki, Scr. Mater. 44, 1497 (2001)
J. Elias, P. Brodard, M.G.C. Vernooij, J. Michler, L. Philippe, Electrochim. Acta 56, 1485 (2011)
L. Oniciu, L. Muresan, J. Appl. Electrochem. 21, 565 (1991)
M.E. Soares, C.A.C. Souza, S.E. Kuri, Mater. Sci. Eng.: A 402, 16 (2005)
L.X. Wei, A.S.M.A. Haseeb, Y.X. Goh, Effects of thiourea and gelatin on the electrodeposition of Sn-Ag solder alloy, in The 4th Asia Symposium on Quality Electronic Design (2012) pp. 291–296
G.M. Brown, G.A. Hope, J. Electroanal. Chem. 397, 293 (1995)
N.A. Kostromina, S.L. Davydova, A.D. Shaposhnikova, V.P. Tikhonov, Theor. Exp. Chem. 15, 228 (1979)
F. Czerwinski, Thin Solid Films 280, 199 (1996)
N. Eliaz, T.M. Sridhar, E. Gileadi, Electrochim. Acta 50, 2893 (2005)
I. Mizushima, P.T. Tang, H.N. Hansen, M.A.J. Somers, Electrochim. Acta 51, 6128 (2006)
Acknowledgements
This work has been supported by the Natural Science Foundation of Jiangsu Province (Grant Number: BK20150260).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Wu, W. Effect of gelatin additive on microstructure and composition of electrodeposited rhenium–nickel alloys in aqueous solutions. Appl. Phys. A 122, 1028 (2016). https://doi.org/10.1007/s00339-016-0567-9
Received:
Accepted:
Published:
DOI: https://doi.org/10.1007/s00339-016-0567-9