Abstract
The frequent and continuous use of electronic components results in a gradual increase in temperature, significantly decreasing their effectiveness. In the present study, composites have been fabricated with microencapsulated phase change materials (MicroPCM) integrated into rigid polyurethane (R-PU) foam to regulate the heat accumulation in electronic parts. A seeded-emulsion system was used to synthesize microcapsules based on capric acid (CA) core and poly [methyl methacrylate-co-methacrylic acid] (PMMA-co-MMA) shell material. MicroPCM3 prepared with 2:1 core to shell ratio was integrated into R-PU foam sandwiched between tin panels. The thermal energy flow analysis rate was used to estimate the time required to reach the set temperature of the R-PU foam composites with and without MicroPCMs. Thermal analysis, structural characterization, morphological study of MicroPCMs and R-PU foam composites were performed using differential scanning calorimeter (DSC), Fourier transforms infrared (FTIR), and scanning electron microscopy (SEM). From the thermal analysis of R-PU foam composites at 40 wt.% MicroPCM3 loading, the latent heat of melting, and crystallization were found to be 31.74 ± 1.50 J/g and 31.19 ± 1.50 J/g, respectively. The time needed to reach the set temperature of tin panels was recorded to be 210 ± 5 min, indicating very good thermal energy storage capacity. A 40 wt.% MicroPCM3 loading exhibited better thermal energy storage performance.
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Acknowledgements
The author thanks the Institute of Chemical Technology, Mumbai, for availing all-instrumental facilities required for the work, and the Defense Research and Development Organization (DRDO), New Delhi, India, for providing financial assistance (Grant number: NRB/4003/PG/387 dated 17-01-2017).
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Defense Research and Development Organization (DRDO), New Delhi, India (Grant number: NRB/4003/PG/387 dated 17-01-2017).
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Naikwadi, A., Samui, A. & Mahanwar, P. Experimental investigation of rigid polyurethane foam/microencapsulated phase change material composite for thermal energy storage in electronic component. Polym. Bull. 79, 10095–10114 (2022). https://doi.org/10.1007/s00289-021-03961-x
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DOI: https://doi.org/10.1007/s00289-021-03961-x