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Mechanical and thermal properties of organosolv lignin/sodium dodecyl sulphate binary agent-treated polypropylene/chitosan composites

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Abstract

The effects of filler content and chemical treatment on mechanical and thermal properties of polypropylene–chitosan composites were investigated. Filler chemical treatment was carried out by reacting chitosan with organosolv lignin/sodium dodecyl sulphate binary modifying agents under mild condition. Filler–matrix interfacial adhesion enhanced considerably in presence of the binary agent that effectively modified the chitosan surface, leading to increased tensile and impact strength of the composites. Even though the chemical treatments did not change the thermal degradation mechanism of the composites, the obtained results exhibited that the treated composites had better thermal properties than the untreated composites. These finding implies that organosolv lignin-containing binary modifying agents could be a potential reagent to replace synthetic modifying agents.

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Acknowledgments

Research funding from the fundamental research grant scheme (FRGS) by the Ministry of Education of Malaysia is greatly acknowledged.

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Authors and Affiliations

  1. Department of Chemical Engineering, Faculty of Engineering and Science, Curtin University of Sarawak, CDT 250, 98009, Miri, Sarawak, Malaysia

    Faisal Amri Tanjung

  2. Division of Polymer Engineering, School of Materials Engineering, Universiti Malaysia Perlis, 02600, Jejawi, Perlis, Malaysia

    Salmah Husseinsyah & Kamarudin Hussin

  3. Department of Polymer Engineering, Faculty of Chemical Engineering, Universiti Teknologi Malaysia, 81310, Skudai, Johor, Malaysia

    Azman Hassan

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  1. Faisal Amri Tanjung
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  2. Salmah Husseinsyah
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  3. Kamarudin Hussin
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  4. Azman Hassan
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Correspondence to Faisal Amri Tanjung.

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Tanjung, F.A., Husseinsyah, S., Hussin, K. et al. Mechanical and thermal properties of organosolv lignin/sodium dodecyl sulphate binary agent-treated polypropylene/chitosan composites. Polym. Bull. 73, 1427–1445 (2016). https://doi.org/10.1007/s00289-015-1556-4

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  • DOI: https://doi.org/10.1007/s00289-015-1556-4

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