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Nondestructive detection of cracks near the surface of wooden boards by dynamic heat dissipation

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Abstract

A method to detect cracks near the surface of wooden boards has been developed where the change in surface temperature of the wood sample is monitored using an infrared camera following momentary heating by a flash. Cylindrical holes simulating cracks were drilled into the wood samples, and blackbody paint was painted onto the surface of the samples to assist flash absorption. This method uses the dynamic heat transport process from the blackbody paint to the surface of the wood sample to the cracks over a short timescale. The theoretical foundations of the observation method were outlined, and the technique was verified in experiments with samples of Cercidiphyllum japonicum, Western red cedar, Japanese cedar, Balsa, and medium-density fiberboard. The developed technique is able to detect the presence of holes located near the surface of some samples. However, this method could not detect the presence of holes in Balsa nor holes located deeper than 1 mm from the surface of the sample. A theoretical analysis of these phenomena was provided to help interpreting them.

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Acknowledgments

This work was supported by the Ministry of Education, Culture, Sports, Science and Technology of Japan (MEXT) and the Japan Society for the Promotion of Science (JSPS) KAKENHI Grant Number 23560056.

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Authors and Affiliations

  1. Department of Electrical and Electronics Engineering, Nippon Institute of Technology, 4-1 Gakuendai, Miyashiro, Saitama, 345-8501, Japan

    Minoru Aoyagi, Takefumi Hiraguri & Takahiro Ueno

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  1. Minoru Aoyagi
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  2. Takefumi Hiraguri
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  3. Takahiro Ueno
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Correspondence to Minoru Aoyagi.

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Aoyagi, M., Hiraguri, T. & Ueno, T. Nondestructive detection of cracks near the surface of wooden boards by dynamic heat dissipation. Wood Sci Technol 48, 773–786 (2014). https://doi.org/10.1007/s00226-014-0639-y

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  • DOI: https://doi.org/10.1007/s00226-014-0639-y

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