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Multi-step cutting depth optimization method based on the removal mechanism of SiCp/Al

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Abstract

SiCp/Al composites (Silicon Carbide Particles embedded in an Aluminum matrix) are widely used in aerospace, automotive and other fields due to their excellent properties such as high dimensional stability and high specific strength. But, the large hardness of SiCp particles makes the processing of SiCp/Al difficult .The position of SiC particles relative to the cutting path determines the interaction between the tool and the particles, which affects the cutting process of SiCp/Al. However, there is a lack of study on the position of SiC particles relative to the cutting path. We study the processing mechanism of SiCp / Al under multistep cutting and propose a model of the relative position of the cutting path and the SiCp particle. To reduce particle damage during the cutting process, a quantitative relationship between cutting depth and the diameter of SiC particles is established for the first time in this paper. Finite element models considering particle shape, distribution, and cohesive element are established based on the above model. The particle removal mechanisms, cutting force characteristics, and surface quality are compared in detail for multi-step and single-step cutting. The simulation model is validated through experiment. The results show that the optimized multi-step cutting parameters can change the removal mode of particles from overall debonding to local fracture, effectively reduce the machining defects, and finally improve the surface quality of the workpiece. The Ra and SSD depths are reduced by 41.1% and 27.9%, respectively, when compared to single-step cutting.

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Acknowledgements

This work was supported by the Ningbo Major Science and Technology Project (2022Z013).

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Contributions

Xu Zhang: Conceived and designed the study, collected and analyzed data, and drafted the manuscript.

Liangfei Hu: Contributed to the study design, perform finite element analysis, and contributed to the interpretation of results. Assisted in manuscript writing and revision.

Jia Ge: Participate in the analysis of results and critically review and revise manuscripts.

Xuechang Zhang: Provided critical feedback and revisions to the manuscript and secured funding for the research through a grant from the Ningbo Major Science and Technology Project (2022Z013).

All authors read and approved the final manuscript.

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Correspondence to Liangfei Hu or Jia Ge.

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Zhang, X., Hu, L., Ge, J. et al. Multi-step cutting depth optimization method based on the removal mechanism of SiCp/Al. Int J Adv Manuf Technol 131, 4499–4514 (2024). https://doi.org/10.1007/s00170-024-13273-9

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  • DOI: https://doi.org/10.1007/s00170-024-13273-9

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