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Investigation on focused ultrasound-assisted diamond wire sawing of silicon carbide

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Abstract

Focused ultrasound-assisted diamond wire sawing (DWS) is proposed in order to improve the sawing performance in terms of sawing force, surface finish, and edge chippings. Under the streaming effect of acoustic wave, the diamond wire saw is forced to move at high frequency. The highest acoustic pressure is obtained at the focal point according to the distribution of scattered waves. A series of sawing experiments with focused ultrasound assistance are accomplished. The influence of wire speed and normal load on sawing forces and surface quality is studied. It is shown that the tangential forces decrease with the increase of wire saw speed. Sawing forces with focused ultrasound assistance are always smaller than that under the traditional condition with the same cutting parameters. Typically, a reduction of 56.0% can be obtained for friction factors. Under the effect of acoustic cavitation and streaming, burrs can be effectively removed from the cutting zone. Furthermore, high ductile removal region can be produced, resulting in better surface finish. During focused ultrasound-assisted DWS, only a few tiny edge chippings appear and a reduction of 56.6% in the maximum edge chip width is provided. Due to the cavitation and cleaning effects, less particles and agglomeration are found on the on the wire surface.

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Funding

The authors would like to acknowledge the support of the “National Natural Science Foundation of China (Grant No. 52275403).”

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Authors and Affiliations

  1. School of Automation, Beijing University of Posts and Telecommunications, Beijing, 100876, China

    Lutao Yan, Xiuhong Chen & Haiyuan Li

  2. School of Mechanical Electrical Engineering, Beijing Information Science and Technology University, Beijing, 100192, China

    Qinjian Zhang

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  1. Lutao Yan
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  2. Xiuhong Chen
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  3. Haiyuan Li
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  4. Qinjian Zhang
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Contributions

Lutao Yan: investigation, methodology, formal analysis, writing—original draft, writing—review and editing, funding acquisition.

Xiuhong Chen: conceptualization, methodology, validation, investigation.

Haiyuan Li: project administration, resources, writing—review and editing.

Qinjian Zhang: resources, supervision, project administration.

Corresponding authors

Correspondence to Lutao Yan or Qinjian Zhang.

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The authors declare no competing interests.

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Yan, L., Chen, X., Li, H. et al. Investigation on focused ultrasound-assisted diamond wire sawing of silicon carbide. Int J Adv Manuf Technol 128, 3251–3259 (2023). https://doi.org/10.1007/s00170-023-12164-9

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  • DOI: https://doi.org/10.1007/s00170-023-12164-9

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