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Undeformed chip thickness and machined surface roughness in radial ultrasonic vibration-assisted grinding process

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Abstract

Particle-reinforced titanium matrix composites have attracted increasing attention to fabricate key components in the aerospace field. Grinding process, as a precision machining method, has been widely adopted to guarantee the desired machining quality. However, poor machining quality and severe tool wear are inevitable for the conventional grinding (CG) process, resulting from the presence of reinforced particles and fibers. In addition, the material removal characteristics and ground surface quality are significantly affected by the undeformed chip thickness (UCT). In this case, a radial ultrasonic vibration-assisted grinding (UVAG) device was fabricated, and the associated UCT model was established in views of the actual exposure height of grains, the number of dynamic grains, and the intermittent grinding of abrasive grains. The UCT model was then modified on the basis of ground surface roughness. Results showed that the UCT in UVAG reached 15–20 times compared with that in the CG process, and the maximum error of the UCT was 9.5% compared with the developed model and experimental value. Moreover, the influence of grinding depth on the UCT was not monotonous, and the UCT was the smallest when the grinding depth was approximately 60 μm.

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All data generated or analyzed during this study are included in the present article.

Abbreviations

v w :

Workpiece feed speed

v s :

Grinding speed

d s :

Diameter of grinding wheel

ω s :

Grinding wheel angular velocity

f :

Ultrasonic frequency

A x :

Vibration amplitude

φ 0 :

Initial phase angle of abrasive grain

l u, l c :

Distance between abrasive tracks in UVAG or CG

\(\overline{{\lambda }_{\mathrm{u}}}\) \(\overline{{\lambda }_{c}}\) :

Average distance between the dynamic grains in UVAG or CG

i :

Number of abrasive grains contained in a grinding cycle

(i + 1)th :

Trajectory of the i + 1 abrasive grain

L :

Abrasive trajectory wavelength

a gmax-u :

Undeformed chip thickness in UVAG

k :

The ratio of agmax-u to agmax-c

\(\left[{v}_{\mathrm{s}}T,\overline{{\lambda }_{\mathrm{u}}}\right]\) :

Least common multiple of \({v}_{\mathrm{s}}T\) and \(\overline{{\lambda }_{\mathrm{u}}}\)

l arc :

Length of the effective grinding trajectory

H :

Exposure height of the abrasive grain

ε σ :

Normal distribution parameters

t :

Time

Q ' w :

Material removal rate

R a :

Machined surface roughness

α :

Included angle between tangent of abrasive trajectory and X direction

θ :

Included angle between tangent of abrasive trajectory and Z direction

h c h u :

Minimum height of the dynamic grains in CG or UVAG

M :

Total grinding cycles

N s :

Dynamic effective abrasive grain quantity

a gmax-c :

Undeformed chip thickness in CG

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Funding

This work was financially supported by the National Natural Science Foundation of China (nos. 51921003, 92160301, 52175415, and 52205475), the Natural Science Foundation of Jiangsu Province (no. BK20210295), the Open Foundation State Key Laboratory of Mechanical Transmissions (no. SKLMT-MSKFKT-202101), the Funding of Jiangsu Innovation Program for Graduate Education (no. KYCX21_0189), and the Special Projects for the Reengineering of Industrial Foundation and the High-quality Development of Manufacturing Industry (no. TC210H02X).

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Authors and Affiliations

  1. National Key Laboratory of Science and Technology On Helicopter Transmission, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China

    Yansong Yue, Biao Zhao, Bangfu Wu & Wenfeng Ding

Authors
  1. Yansong Yue
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  2. Biao Zhao
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  3. Bangfu Wu
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  4. Wenfeng Ding
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Contributions

Conceptualization, investigation, writing–original draft preparation, Yansong Yue; visualization and supervision, Biao Zhao; data curation, Bangfu Wu; project administration, Wenfeng Ding.

Corresponding author

Correspondence to Biao Zhao.

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Yue, Y., Zhao, B., Wu, B. et al. Undeformed chip thickness and machined surface roughness in radial ultrasonic vibration-assisted grinding process. Int J Adv Manuf Technol 123, 299–311 (2022). https://doi.org/10.1007/s00170-022-10187-2

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  • DOI: https://doi.org/10.1007/s00170-022-10187-2

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