Abstract
How to improve the bonding ability and quality performance of heterogeneous plates has always been one of the difficult problems in the field of high-performance heterogeneous composite sheet forming and manufacturing. In this paper, a new manufacturing method of heterogeneous clad plate, hard plate rolling clad plate, is proposed. The hot rolling process of Al/Mg/Al composite slab with or without hard plate was studied. The results show that the shear stress in the rolling direction (RD) can be transformed into the compressive stress in the normal direction (ND), and then the welding pressure between different composite layers can be increased. This method can suppress the bending and edge crack defects and significantly improve the shape quality and forming ability. At the same time, through the study of the interface structure of the composite plate, it can be known that the metallurgical bonding can be achieved with a small reduction after adding the hard plate. Two clear layers of Al3Mg2 and Al17Mg12 intermetallic compounds appear at the Al/Mg interface. The thickness of the diffusion layer is significantly larger than that of the traditional hot-rolled clad plate, and the thickness of the diffusion layer can reach 38 μm when the reduction is 60%. The yield strength is 172.3 MPa and the elongation is 21.5%. To sum up, the hot rolling of hard-plate provides a new idea for the forming and manufacturing of high performance heterogeneous composite plate.
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This paper was supported by the Natural Science Foundation of Heilongjiang Province (LH2019E056) and the Fundamental Research Foundation for Universities of Heilongjiang Province (LGYC2018JQ011).
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Composite plate connection is currently a hot research direction in the field of plastic processing. The hot-rolled composite by hard-plate proposed in this paper provides a new idea for the connection of composite plates.
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Da Huo, P., Li, F., Wang, Y. et al. Formability and interface structure of Al/Mg/Al composite sheet rolled by hard-plate rolling (HPR). Int J Adv Manuf Technol 118, 55–65 (2022). https://doi.org/10.1007/s00170-021-07178-0
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DOI: https://doi.org/10.1007/s00170-021-07178-0