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Multiple slit electrochemical micromachining using a single wire and a constant inter-electrode voltage

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Abstract

Fabrication of micro-slit array in difficult to machine materials is a considerable challenge due to its rigorous surface integrity requirements. This paper proposed a novel method for multiple slit electrochemical micromachining using a single wire and a specific apparatus was developed. The wire is spooled through a specific pulley with multiple grooves to generate a multiple-wire face. Thus, the wire tension and the wire travelling direction would be the same in each wire machining branch. A simplified flow field and electric model illustrated that each machining branch has the same electric supply and the same wire travelling status, as well as the same flow field, which is of great benefits for producing arrayed structures with high consistency. Experiments verified that the inter-electrode voltage as well as the slit width decreased with the increase of electrode amount and the maximum electrode feeding rate was limited. To maintain a constant inter-electrode, the output of the pulse generator was adjusted to a suitable value depending upon the wire amount. Compared with a constant output voltage, the largest electrode feeding rate of each single electrode and the total feeding rate are improved. Finally, a task was designed to compare multi-slit ECMM, HS-WEDM, and LS-WEDM in machining efficiency and surface integrity. It indicated multi-slit ECMM is a feasible alternative for machining arrayed structures requiring good surface integrity in high efficiency.

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Funding

This project was supported by the National Natural Science Foundation of China (no. 51775276) and the Aeronautical Science Foundation of China (no. 20160852006)

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Correspondence to Yongbin Zeng.

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Fang, X., Wu, Y., Tong, P. et al. Multiple slit electrochemical micromachining using a single wire and a constant inter-electrode voltage. Int J Adv Manuf Technol 104, 2805–2814 (2019). https://doi.org/10.1007/s00170-019-04143-w

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  • DOI: https://doi.org/10.1007/s00170-019-04143-w

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