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Optimization of microridge punch design for deep drawing process by using the fuzzy Taguchi method

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Abstract

In recent years, metal components produced through die forming have decreased in size leading to challenges in drawing forming. In this study, an optimal microridge punch was designed using the robust multi-objective design in the fuzzy Taguchi method to enhance the formability of deep drawing process. Using a round, stainless steel cup measuring 2.5 mm in inner diameter and 0.1 mm in thickness, four punch microridge dimension parameters that influenced the thinning rate (TR) and stripping force (SF) during drawing forming were explored. The design performances of two objective functions, namely, the TR and SF, were assessed using the Taguchi method. The effect of the design parameters on the objective functions were verified using a factor effect analysis and an analysis of variance (ANOVA), whereas the measuring index of optimal multiple performance characteristics (MPC) was obtained using fuzzy logic inference. The analysis results showed that the dimension parameters that influenced TR and SF contribution, listed in descending order, were ridge gap (45.25%), ridge nose radius (40.86%), ridge-to-nose distance (11.18%), and ridge height (2.71%). The optimal values were subsequently used to design and produce drawing dies and an experiment was performed to verify their effectiveness. The experiment result showed that the optimal ridge punch drawing distance reached 1.542 mm, which was an increase of 55.60% compared with the drawing distance of non-ridge punch (0.993 mm).

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Funding

Financial support was received for this research from the Frontier Mould and Die Research and Development Center from The Featured Areas Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (MOE) in Taiwan.

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Correspondence to Chun-Chih Kuo.

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Kuo, CC., Lin, BT. & Wang, WT. Optimization of microridge punch design for deep drawing process by using the fuzzy Taguchi method. Int J Adv Manuf Technol 103, 177–186 (2019). https://doi.org/10.1007/s00170-019-03515-6

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  • DOI: https://doi.org/10.1007/s00170-019-03515-6

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