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Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining

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A Correction to this article was published on 04 October 2018

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Abstract

This study investigates the use of nanopowder-mixed dielectric oil and temporary metallic coating on highly doped Si sample to achieve nanometric surface roughness using μ-WEDM operation. To achieve this, two different nanopowders were used in dielectric medium with two different temporary metallic coating in the workpiece. This is with Al and C with metallic coating of (gold) thickness 160 nm and 320 nm. Further, the discharge energy level was varied into two proximate stages (80 V/13 pF and 85 V/0.1 nF). The results show that nanopowder-assisted μ-WEDM process has improved the material removal rate (MRR) by ~ 44.5% (maximum). However, the spark gap (SG) has also been increased to a maximum of 60% than without nanopowder-assisted the μ-WEDM process. Further, it was found in our study that graphite (C) nanopowder usually generates lower spark gap as compared to aluminum (Al) nanopowder. It has also been observed that at specific μ-WEDM condition, coating thickness, and powder concentration C, Al can easily produce nanometric average surface roughness (ASR) (for C lowest ASR was 76 nm and for Al lowest ASR was 83 nm). From the findings, it can be understood that ASR can be improved maximum ~ 65% for C nanopowder and ~ 51% for Al nanopowder-assisted μ-wire electro-discharge machining as compared to conventional μ-WEDM of Si wafer. Machining stability and evenness of the machined slots were also improved by a significant margin when nanopowder-assisted μ-wire electro-discharge machining method was applied.

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Change history

  • 04 October 2018

    The authors would like to publish an Acknowledgement section.

  • 04 October 2018

    The authors would like to publish an Acknowledgement section.

References

  1. J. W. Jung, Y. H. Jeong, B.-K. Min, and S. J. Lee, Model-based pulse frequency control for micro-edm milling using real-time discharge pulse monitoring, J. Manuf. Sci. Eng., vol. 130, no. 3, p. 31106, 2008

    Article  Google Scholar 

  2. Rajurkar KP, Sundaram MM, Malshe AP (2013) Review of electrochemical and electrodischarge machining. Procedia CIRP 6:13–26

    Article  Google Scholar 

  3. Mohammed Muntakim Anwar, A study on micro-patterning of polypyrrole using micro-electro-discharge machining, The University of British Columbia, 2012

  4. Saleh T, Dahmardeh M, Nojeh A, Takahata K (2013) Dry micro-electro-discharge machining of carbon-nanotube forests using sulphur-hexafluoride. Carbon N Y 52:288–295

    Article  Google Scholar 

  5. Reynaerts D, Heeren P-H, Van Brussel H (1997) Microstructuring of silicon by electro-discharge machining (EDM) — part I: theory. Sensors Actuators A Phys 60(1–3):212–218

    Article  Google Scholar 

  6. Luo YF, Chen CG, Tong ZF (1992) Investigation of silicon wafering by wire EDM. J Mater Sci 27(21):5805–5810

    Article  Google Scholar 

  7. Takino H, Ichinohe T, Tanimoto K, Yamaguchi S, Nomura K, Kunieda M (2005) High-quality cutting of polished single-crystal silicon by wire electrical discharge machining. Precis Eng 29(4):423–430

    Article  Google Scholar 

  8. Wang W, Liu ZD, Tian ZJ, Huang YH, Liu ZX (2009) High efficiency slicing of low resistance silicon ingot by wire electrolytic-spark hybrid machining. J Mater Process Technol 209(7):3149–3155

    Article  Google Scholar 

  9. Jahan MP, Lieh TW, Wong YS, Rahman M (2011) An experimental investigation into the micro-electrodischarge machining behavior of p-type silicon. Int J Adv Manuf Technol 57(5–8):617–637

    Article  Google Scholar 

  10. Fonda P, Chan ML, Heidari A, Nakamoto K, Sano S, Horsley DD, Yamazaki K (2013) The application of diamond-based electrodes for efficient EDMing of silicon wafers for freeform MEMS device fabrication. Procedia CIRP 6:280–285

    Article  Google Scholar 

  11. Zhao Y, Kunieda M, Abe K (2013) Experimental investigations into EDM behaviors of single crystal silicon carbide. Procedia CIRP 6:135–139

    Article  Google Scholar 

  12. N. D. Daud, A. AbuZaiter, P. L. Leow, and M. S. Mohamed Ali, The effects of the silicon wafer resistivity on the performance of microelectrical discharge machining, Int J Adv Manuf Technol, pp. 1–10, 2017

  13. Lee S, Scarpulla MA, Bamberg E (2013) Effect of metal coating on machinability of high purity germanium using wire electrical discharge machining. J Mater Process Technol 213(6):811–817

    Article  Google Scholar 

  14. T. Saleh, A. N. Rasheed, and A. G. a. Muthalif, Experimental study on improving μ-WEDM and μ-EDM of doped silicon by temporary metallic coating, Int J Adv Manuf Technol, vol. 78, no. 9–12, pp. 1651–1663, 2015

    Article  Google Scholar 

  15. Jin ZJ, Zhang M, Guo DM, Kang RK (2005) Electroforming of Copper/ZrB<sub>2</sub> composites coatings and its performance as electro-discharge machining electrodes. Key Eng Mater 291–292(59935110):537–542

    Article  Google Scholar 

  16. Jeswani ML (1981) Effect of the addition of graphite powder to kerosene used as the dielectric fluid in electrical discharge machining. Wear 70(2):133–139

    Article  Google Scholar 

  17. Chow HM, Yan BH, Huang FY, Hung JC (2000) Study of added powder in kerosene for the micro-slit machining of titanium alloy using electro-discharge machining. J Mater Process Technol 101(1):95–103

    Article  Google Scholar 

  18. Tzeng YF, Lee CY (2001) Effects of powder characteristics on electrodischarge machining efficiency. Int J Adv Manuf Technol 17(8):586–592

    Article  Google Scholar 

  19. Kansal HK, Singh S, Kumar P (2007) Technology and research developments in powder mixed electric discharge machining (PMEDM). J Mater Process Technol 184(1–3):32–41

    Article  Google Scholar 

  20. Kansal HK, Singh S, Kumar P (2008) Numerical simulation of powder mixed electric discharge machining (PMEDM) using finite element method. Math Comput Model 47(11–12):1217–1237

    Article  Google Scholar 

  21. Prihandana GS, Mahardika M, Hamdi M, Wong YS, Mitsui K (2009) Effect of micro-powder suspension and ultrasonic vibration of dielectric fluid in micro-EDM processes-Taguchi approach. Int J Mach Tools Manuf 49(12–13):1035–1041

    Article  Google Scholar 

  22. Jahan MP, Anwar MM, Wong YS, Rahman M (2009) Nanofinishing of hard materials using micro-electrodischarge machining. Proc Inst Mech Eng Part B J Eng Manuf 223(9):1127–1142

    Article  Google Scholar 

  23. Jahan MP, Rahman M, Wong YS (2011) Study on the nano-powder-mixed sinking and milling micro-EDM of WC-co. Int J Adv Manuf Technol 53(1–4):167–180

    Article  Google Scholar 

  24. Kumar H (2014) Development of mirror like surface characteristics using nanopowder mixed electric discharge machining (NPMEDM). Int J Adv Manuf Technol 76(1–4):105–113

    Google Scholar 

  25. B. Ekmekci, H. Yasar, and N. Ekmekci, A discharge separation model for powder mixed electrical discharge machining, J. Manuf. Sci. Eng., vol. 138, no. 8, p. 81006, 2016

    Article  Google Scholar 

  26. Mahardika M, Tsujimoto T, Mitsui K (2008) A new approach on the determination of ease of machining by EDM processes. Int J Mach Tools Manuf 48(7–8):746–760

    Article  Google Scholar 

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Authors and Affiliations

  1. Faculty of Engineering, International Islamic University Malaysia, Kuala Lumpur, Wilayah Persekutuan, Malaysia

    Sams Jarin, Tanveer Saleh, Asan G. A. Muthalif & Mohammad Yeakub Ali

  2. Department of Mechanical and Industrial Engineering College of Engineering, Qatar University, Building B09 - near to QU Mosque, P.O. Box 2713, Doha, Qatar

    Asan G. A. Muthalif

  3. School of Science and Engineering, International University of Scholars, Dhaka, Bangladesh

    Moinul Bhuiyan

Authors
  1. Sams Jarin
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  2. Tanveer Saleh
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  3. Asan G. A. Muthalif
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  4. Mohammad Yeakub Ali
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  5. Moinul Bhuiyan
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Correspondence to Tanveer Saleh.

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Jarin, S., Saleh, T., Muthalif, A.G.A. et al. Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining. Int J Adv Manuf Technol 99, 3005–3015 (2018). https://doi.org/10.1007/s00170-018-2692-4

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  • DOI: https://doi.org/10.1007/s00170-018-2692-4

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