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Dissimilar Cu/Al tube joint by EMF-assisted brazing

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Abstract

In order to increase the reliability and efficiency of brazing joint for Cu/Al dissimilar metal tubes, electromagnetic forming (EMF) was adopted to improve the clearance of Cu/Al dissimilar metal tubes for presetting filler metal. The electromagnetic forming process was numerically investigated to study the effects of discharge voltage and initial clearance on the deformation uniformity of Cu outer tube. With the EMF process, the reasonable clearance between the outer and inner tubes was obtained for brazing joint in experiment. Then, the Cu/Al dissimilar metal tube was brazed with Zn–3Al filler metal at 420 °C for 8 s. The sufficient welding diffusion between Zn–3Al and the Al substrate was found and the thickness of intermetallic compound (IMC) layer on the Zn–3Al/Cu interface was about 2.1 μm. The tensile strength of the Cu/Al joint was 75 MPa and the fracture occurred on the T2 Cu tube. It is validated that EMF-assisted brazing method can achieve excellent metallurgic bonding of Cu/Al dissimilar metal tube joint.

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Funding

This work was supported by the National Nature Science Foundation of China (No. 51475345) and the Open Fund Project of State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology (P2015-01, P2018-013).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, 430070, China

    Yu Lei, Shangyu Huang, Wei Liu, Yong Xiao, Jianhua Hu, Xueming Du & Xifan Zou

  2. State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430070, China

    Yu Lei, Shangyu Huang & Wei Liu

Authors
  1. Yu Lei
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  2. Shangyu Huang
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  3. Wei Liu
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  4. Yong Xiao
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  5. Jianhua Hu
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  6. Xueming Du
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  7. Xifan Zou
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Correspondence to Wei Liu.

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Lei, Y., Huang, S., Liu, W. et al. Dissimilar Cu/Al tube joint by EMF-assisted brazing. Int J Adv Manuf Technol 95, 4039–4047 (2018). https://doi.org/10.1007/s00170-017-1535-z

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  • DOI: https://doi.org/10.1007/s00170-017-1535-z

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