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Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating

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Abstract

A hybrid process including roll-to-roll (R2R) gravure printing, via-hole printing, and electroless plating was investigated for the creation of a double-side flexible printed circuit board (FPCB). A R2R gravure process with an Ag seed layer that includes front- and back-side printing with a polyimide film at the center was investigated. The gravure-printed Ag pattern was laser drilled for high accuracy. A via hole was filled with a low-viscosity Ag ink using the drop-casting method. In addition, an electroless Cu plating process was performed to increase the conductivity of the printed circuit. The interconnection performance was confirmed from the resistance values obtained using a feed-through test and microscopic images. To evaluate the reliability of the FPCB, a cyclic bending motion test was performed; stable electrical performance was observed even after 400,000 cycles. The results obtained in this study suggest that the proposed hybrid process for double-side FPCBs is viable for a mass production system.

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Authors and Affiliations

  1. Department of Mechanical Design and Production Engineering, Konkuk University, 120 Neungdong-ro, Gwangjin-gu, Seoul, 143-701, Korea

    Janghoon Park, Jongsu Lee & Sungsik Park

  2. School of Mechanical Engineering, Konkuk University, 120 Neungdong-ro, Gwangjin-gu, Seoul, 143-701, Korea

    Kee-Hyun Shin & Dongjin Lee

  3. Flexible Display Roll-to-Roll Research Center, Konkuk University, 120 Neungdong-ro, Gwangjin-gu, Seoul, 143-701, Korea

    Kee-Hyun Shin & Dongjin Lee

Authors
  1. Janghoon Park
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  2. Jongsu Lee
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  3. Sungsik Park
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  4. Kee-Hyun Shin
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  5. Dongjin Lee
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Correspondence to Dongjin Lee.

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Park, J., Lee, J., Park, S. et al. Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating. Int J Adv Manuf Technol 82, 1921–1931 (2016). https://doi.org/10.1007/s00170-015-7507-2

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  • DOI: https://doi.org/10.1007/s00170-015-7507-2

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