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Improve the Toughness of Epoxy Resin Insulating Materials by Compounding Acid Anhydride Curing Agent

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The Proceedings of 2023 4th International Symposium on Insulation and Discharge Computation for Power Equipment (IDCOMPU2023) (IDCOMPU 2023)

Abstract

Epoxy resin is one excellent insulating material and is widely used in the manufacture of electrical insulation structures, but its toughness is poor. Therefore, toughening has been the first problem to be solved for the development of new epoxy insulating materials. In this paper, the method of compounding acid anhydride curing agent is used to improve the toughness of epoxy resin insulation materials. By compounding methylhexahydrophthalic anhydride (Me-HHPA) with a new special anhydride curing agent, the impact strength, cracking resistance and electrical breakdown strength of epoxy resin curing products are tested. The results show that this new anhydride curing agent can not only improve the mechanical properties and cracking resistance of epoxy resin composites, but also does not affect the electrical insulation properties of epoxy resin composites. Further, the paper also illustrates the mechanism of the effect of this new anhydride curing agent on the toughness of epoxy resin cured products, hoping that the study will provide a reference for the toughening of epoxy insulating materials.

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Acknowledgements

This work is supported by Technology Project of Headquarters of State Grid Co., LTD (Item number:5500-202258489A-2-0-JK).

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Correspondence to Yushun Zhao .

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Zhao, Y., Zhao, Y., Luo, Z., Li, X., Hu, S. (2024). Improve the Toughness of Epoxy Resin Insulating Materials by Compounding Acid Anhydride Curing Agent. In: Dong, X., Cai, L. (eds) The Proceedings of 2023 4th International Symposium on Insulation and Discharge Computation for Power Equipment (IDCOMPU2023). IDCOMPU 2023. Lecture Notes in Electrical Engineering, vol 1100. Springer, Singapore. https://doi.org/10.1007/978-981-99-7393-4_51

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  • DOI: https://doi.org/10.1007/978-981-99-7393-4_51

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-99-7392-7

  • Online ISBN: 978-981-99-7393-4

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